CEI et Smart Grid Reunion Generale UTE 26 Mai 2009 Paris

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1 INTERNATIONAL ELECTROTECHNICAL COMMISSION CEI et Reunion Generale UTE 26 Mai 2009 Paris Richard Schomberg SMB SG3 Convener EDF VP Research North America System Engineering Professor wise Architecture Council Member TC8 Chair: System Aspects for Energy Delivery

2 2 Different drivers but. same solutions

3 About is the concept of modernizing the electric grid. The is integrating the electrical and information technologies in between any point of Generation and any point of Consumption. 3

4 er : what for? Advanced Distribution operation anticipate Improve life span of grid assets DER Integration towards active Distribution Network optimize Technology pushed innovations for distribution performance Automatic Meter Management Energy box (Unregulated business) control observe 4

5 Conceptual Model 5

6 Conceptual Model Levels 6

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14 Use Cases: Paths through the model 14

15 Interoperability Layers 15

16 GWAC Stack Levels of Interoperability 16

17 Decouple Functional Requirements from Technical Specifications System requirements Sub system Sub system Sub system Intelli Methodology for Developing Requirements for Energy Systems Sub system Sub system 17 Standard Building blocks

18 INTERNATIONAL ELECTROTECHNICAL COMMISSION SMART GRID Meeting IEC SMB Strategic Group 3 Paris, FR May 28-29, 2009

19 About SMB SG3 SMB Decision 133/20: a strategic group on smart grid be established with the primary responsibility for the development of a framework that includes protocols and model standards to achieve interoperability of smart grid devices and systems should first be established.. The strategic group will need to establish its membership and decide on its terms of reference. Richard Schomberg convener/peter Lanctot (IEC CO Officer) Secretary of the group 13 NCs have submitted nominations: BR, CA, CH, CN, DE, FR, GB, IT, JP, KR, NL, SE and US 11 NCs represented at the first meeting 19

20 Initial Discussion SG3 to propose common vision defined by boundaries: is the concept of modernizing the electric grid. The is integrating the electrical and information technologies in between any point of Generation and any point of Consumption. To optimize operation maintenance and evolution of electrical grids and building on the existing legacies. IEC Vocabulary for is under finalization (TC8). To recognize the absolute necessity of separating out requirements from any kind of solution. Standards addressing User Requirements must be used in the initial phases of projects, in order to properly use later on standards to address the technical design and specifications. projects require taking into account the combined interests of the three major stakeholders and their proxies: Vendors, Utilities, or Regulators SG3 Terms of reference: deliver what was requested by SMB, and reassess with the discussion on the long term plans to come 20

21 Tactical plan showing what industry can expect immediately from IEC Communicate: Circulate press release about IEC involvement in s, based on SG3 white paper; IEC to provide one-stop shop for Industry: IEC will provide shortly a web window allowing projects an easy access to a first release of ready to use standards as well as some guidance to make the most of them [Framework-1 : SG3 agreed on a first list of IEC standards and deliverables]. Develop Framework-2 by September 2009: Understanding the urgency, SG3 circulated a Questionnaire and called each of the 19 TCs identified (due date 31 May 2009). Update the list of TCs, and relevant standards, Update of Framework-1 21

22 SG 3 Future Deliver Framework-1 and Framework-2 Put in place for the long-term, a strategic and tactical plan so that the TC s can manage the convergence and consistency of the standards they produce, to be included in the IEC framework. Put in place for the long-term, an appropriate organization to sustain the strategic and tactical plans, and terms of reference Next meeting in Washington, DC September 28-29, 2009, close to the Week annual event Following meeting in Seoul (KR) (TBD) 22

23 INTERNATIONAL ELECTROTECHNICAL COMMISSION Thank you for your attention