Henkel Smart Chemistry Hub Event: Advanced Gasketing Solutions Madison Heights, May 17

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1 Henkel Smart Chemistry Hub Event: Advanced Gasketing Solutions Madison Heights, May 17

2 Power Up! Sealing battery packs and electronic components Bill Brown Manager - Applications Engineering

3 Agenda 1. EE/AEV Gasketing Industry Trends and Considerations Application Examples Curing Methods Chemical Portfolio 2. Potting/Sealing 3

4 EE/AEV Trends Increased electrification More modules Hybrid Systems Battery 48 Volt Systems Stop-start Serviceable covers 4

5 Component Sealing Needs Cooling Systems Fluids Connectors Fluid Sealing Gasketing Impregnation External Environment Dust, dirt, air, water 5

6 Liquid Gasket Alternatives to Traditional Gasketing for EE/AEV Components Replacing die cut and pressed-in-place gaskets UV-cure solid and foam products cost savings robotically applied Liquid moisture cure sealants Silicone Polyacrylate 6

7 Liquid Dispensed Sealing Solutions Formed-in-Place Gasketing Polyacrylate products Foams Cured-in-Place Gaskets/XIPG Coolant Resistance Potting Products Silicones Epoxies Urethanes 7

8 Introduction to EE/AEV gasketing Application Examples Automotive electronics ECU Sensors Inverters and Converters Motors Battery Packs 8

9 E/E Gasketing Sensing Systems Numerous vehicle sensors Fuel Delivery Systems Fuel system control module Controls / PD Electronics Control Modules & Electrical Power Distribution Centers Connectors & Power Supplies EE Power Distribution Interfaces Lighting Control Modules Safety & Driver Assistance Electronic brake modules Airbag modules Chassis control modules Steering control modules Battery Systems Electrical Centers, Sensors 9

10 What are Liquid Gaskets? Benefits vs. Solid Gaskets Lower cost Increased reliability Simplified processing Molded rubber gaskets are typically 4-5x more expensive Relaxed machining standards and lower tooling costs Automated processing eliminates hand placement of molded or die-cut foam gaskets Reduced inventory Seals through adhesion or compression Adhesion to both metals and engineered plastics Adds structural strength Single and dual component materials Long open time / manufacturing friendly Light cure options for short work-in-process Automated processing Liquid gaskets are common for high volume production 10

11 Liquid Gasket Selection Criteria Type of parts stampings, castings, machined, molded plastic Flange design standoff, tongue and groove Service conditions - temp, pressure, fluids Manufacturing requirements assembly Serviceability and reusability Gasketing and Potting Solutions for E/E - AEV Bill Brown

12 Loctite Liquid Gasketing Three Technologies Dispensing Assembly FIPG Liquid or paste Liquid or paste Cured Gasket Seal by adhesion Dispensing Curing Assembly CIPG Liquid or paste Liquid or paste Cured Gasket Cured Gasket Dispensing Curing Assembly Seal by compression XIPG Liquid or paste Liquid or paste Cured Gasket Cured Gasket 12 Gasketing and Potting Solutions for E/E - AEV Bill Brown

13 Loctite Formed-In-Place Gaskets Benefits Manual or automated dispense Simple material handling Rapid gasket design changes Reduce part numbers multiple gasket designs Reduce labor costs Heavy bodied paste (option) No slump after dispense Leak test prior to full cure RTV or 2-component cure No curing equipment necessary Can be packed prior to full cure 13 Gasketing and Potting Solutions for E/E - AEV Bill Brown

14 Cost ($/Unit) Technology Highlight Formed-in-Place Gasket LOCTITE TLB 400 SLT One or two-component silicone product for bonding and sealing electronic modules Rate of cure and product thickness allows module to be leak tested online quickly after parts are assembled Provides excellent adhesion, strength, flexibility and environmental resistance Application Examples & Value Enhancement Cost Comparison Between FIPG & PIPG (Based on a standard oil pan) Conventional PIPG Loctite Traditional Silicone FIPG Benefits Lowest cost sealing solution Typically 4 5 times lower material cost than hard gaskets Lower labor costs automation replaces manual placement Reduce part numbers same product for multiple programs Design flexibility change on the fly 14

15 Technology Highlight Electronic Gasketing LOCTITE TLB 400 SLT Heat Cure Module Sealant High Elongation: good performance when modules are thermal cycled in testing and in use. Good adhesion to most substrates plastic and metal. Thixotropic designed for automated dispensing Cure chemistry compatible with electronic gap fillers products Application Example Benefits Quick, low temperature cure 15 minutes at 85 C. Also cures and bonds at room temperature. Two-part for ease of storage and dispensing. Very long open time 400 minutes. Very competitively priced when compared to other heat or quick cure products. 15

16 Loctite Cured-In-Place Gaskets Benefits With Loctite Cured-in-Place liquid gasket technology, Henkel provides you with a unique, innovative gasket solution a solution that allows you to apply high-performance compression gaskets directly onto parts using a high precision equipment, within seconds. Pumpable paste dispensed by robot Reduce part numbers multiple gasket designs Rapid gasket design changes Reduce labor costs UV and moisture cure Reduce utility costs Reduced cycle time Bonded to part value added, easy transport, serviceable and reusable Original part Loctite CIPG robotically dispensed onto the part CIPG cured with UV light (or heat cure) Part with gasket is ready to be shipped 16 Gasketing and Potting Solutions for E/E - AEV Bill Brown

17 Terms / Keywords Aspect Ratio - height to width ratio Mostly determined by material rheology Affected by dispense parameters Lower ratio, more flange width 4.0mm 67% H - W ratio 6.0mm 17 Gasketing and Potting Solutions for E/E - AEV Bill Brown

18 Terms / Keywords Knit-Line - start and stop point / overlap More material in height and width Typically 0.2 to 0.5 mm Affected by equipment and programming 18 May 24, Gasketing and Potting Solutions for E/E - AEV Bill Brown

19 Terms / Keywords Compression Set (ASTM D395 Method B) % CS = (4.0mm - 3.5mm) / (4.0mm - 2.0mm) = 25% 3.5mm 2.0mm 19 May 24, Gasketing and Potting Solutions for E/E - AEV Bill Brown

20 Terms / Keywords Compression Stress Relaxation (CSR) Measure of sealing force Percent of retained force over time 20 Gasketing and Potting Solutions for E/E - AEV Bill Brown

21 Terms / Keywords Void-Volume Fill Space for lateral movement Insufficient volume stresses gasket Avoid pinching/shimming CORRECT INCORRECT 21 May 24, Gasketing and Potting Solutions for E/E - AEV Bill Brown

22 Compression Gasket Design Adequate flange width (4 mm min.) Limit compression and stress Based on chemsitry Provide sufficient seal for application 22 May 24, Gasketing and Potting Solutions for E/E - AEV Bill Brown

23 Typical Dispense Equipment Part nest repeatable part fixturing Wetted components Material unloader (drum, pails) Material hoses, flow control, dispense valve Motion platform 3-axis control (minimum) Curing equipment High intensity light (or) Convection oven Integration into production line 23 May 24, Gasketing and Potting Solutions for E/E - AEV Bill Brown

24 Cost ($/Unit) Technology Highlight Cured-in-Place Gasket LOCTITE One component, rapid curing sealing products silicone or polyacrylic based Seals through compression Cure mechanisms include UV only, UV / moisture or heat cure Application Examples & Value Enhancement Cost Comparison Between CIPG & PIPG (Based on a standard oil pan) Conventional PIPG Loctite Silicone CIPG Benefits Serviceable and reusable Lowers labor costs by offering automated placement Reduces part numbers same product for multiple programs Provides design flexibility 24

25 Technology Highlight Foam Gasketing LOCTITE 5470 Application Example Application Example LOCTITE 5470 is a UV/Moisture cure silicone that can be mixed with nitrogen to form a soft, flexible, low modulus foam gasket for sealing applications. A maximum density reduction of - 42% LOCTITE 5470, 58% nitrogen. Good compression set performance and bonds to most substrates. One component. Soft Shore OO 54. Easy processing in typical manufacturing environments. Excellent adhesion to aluminum and most plastics. Quick curing < 30 seconds. High temperature performance for underhood applications 150 C. 25

26 Liquid Gasket Solutions Summary Technology Type Applications Benefits Example Liquid Gaskets Cured- In-Place Gaskets (CIPG) Formed- In-Place Gaskets (FIPG) Sealing enclosures and connectors Control / PD Elec. Power Supplies Lighting Modules Sensing Systems Safety Assistance Driver Assistance Fuel Systems Lowest Cost Sealing Solution Material savings Less machining req. Reduce part #'s Design flexibility Automated process Apply at tier or OEM Value added to part Less liquids at assy. plant Serviceable and reusable Apply at tier or OEM Value added to part Less liquids at assy. plant Serviceable and reusable (XIPG) Apply at tier or OEM Value added to part Less liquids at assy. plant Serviceable and reusable 26

27 A-Line Gasket Product Line Selector Guide Service Temp <120 C Service Temp >150 C Service Temp >150 C Hi Fluid Resistance FIPG LOCTITE 5510, 5570, 5590 LOCTITE 5607, 5970, TLB 400 SLT LOCTITE 5900, 5970, 5810B CIPG/XIPG LOCTITE 5251A LOCTITE 5039, 5950, 5470 LOCTITE 5964,

28 AEV/EE Liquid Gasketing Summary Product & Concept Silicone, Polyacrylates and MS Polymer sealants using different methods: Formed- In-Place, Cured-In-Place (XIPG) Target Applications ECU s, Sensors, Inverters & Converters, Motors and Battery Packs Features & Benefits Process Automation Robot applied gaskets to achieve tightness by bonding Emission Improvement Lower gas permeability with new materials Improved chemical resistance Fulfills material requirements for harsh environments such as transmissions & HVAC applications Cost efficiency Alternative to current compression gaskets by using easier processes 29

29 Agenda 1. EE/AEV Gasketing Industry Trends and Considerations Application Examples Curing Methods Chemical Portfolio 2. Potting/Sealing 30

30 Potting/Sealing Target Applications Electrical, Electro-Mechanical Devices, Switches, Sensors, Connectors 31

31 Technology Highlight Potting Potting Fill large voids to unitize assemblies Encapsulation of sensitive electronic components providing functional, long-term durability Product range includes silicones, urethanes, epoxies and impregnation resins Benefits Engineered products to minimize process cycle times and reduce scrap Protect components from the exposure to chemicals, moisture, mechanical shock and vibration Provide mechanical reinforcement to housed assemblies Fill large voids to unitize assemblies Application Examples Micro-switches Connectors Sensors 32

32 Technology Highlight Non-Silicone Potting: MS Polymer Non-Silicone Potting and Sealing Material Loctite 5025A LOCTITE 5025A is designed for potting electrical and electronic applications Ideal for automotive exterior and interior environments Can withstand temperatures of up to 100 C (212 F) Benefits Dual cure system of UV for immediate set and moisture cure for shadow areas and final properties Non-silicone chemistry eliminates potential for siloxane contamination Excellent adhesion to a wide variety substrates Greater then 15 mm depth of UV cure Application Examples Micro-switches Connectors Sensors 33

33 Technology Highlight Non-Silicone Potting: Polyacrylate Non-Silicone Potting and Sealing Material Loctite Developmental Product Polyacrylate based potting product Elastomeric sealant Excellent automotive fluid resistance ATF, oils, etc. Benefits Dual cure system of UV for immediate set and moisture cure for shadow areas and final properties Non-silicone chemistry eliminates potential for siloxane contamination Excellent adhesion to a wide variety substrates Elastomeric properties allow for thermal expansion differences between plastics and metal terminals Application Examples Connectors Sensors 34

34 Technology Highlight Casting Resin Potting Casting Resin Application Examples Potting technology that provides superior thermal conductivity Casting with Oil Resistance Compatibility of high TC and Low Viscosity RT Cure under condition without air Benefits Process Efficiency High viscosity for easier process Vibration reduction through enhanced elasticity Thermal Conductivity Higher thermal conductivity to radiate heat (>2.2W/mK) Excellent oil Resistance High Viscosity Casting Resin AL Elastic Filler AL Casting with Oil Resistance 35

35 Impregnation Flex-Seal Products Product details One-part methacrylate monomer vacuum impregnation resin Heat cure Fills all voids and leaks, preventing moisture & contaminants from entering pre-existing voids Operating temperature range of C typical Benefits Flexible, thermal expansion No change to part appearance or dimensions Excellent chemical resistance (including oil, caustics, acid solutions and water) Impregnated wires and wire harnesses can be soldered, welded and crimped post processing Limitations Requires over-molded connectors, small voids 36

36 Technology Highlight TECHNOMELT Low Pressure Molding TECHNOMELT Low Pressure Molding TECHNOMELT low pressure molding is a combination of injection molding and casting that provides encapsulation, sealing and strain relief to electrical / electronic components Utilizes low injection pressures and short cycle times Benefits Protects and seals sensitive components No curing enables short cycle times Uses a custom designed mold-set; any shape is possible Potential elimination of plastic housing Potential up to 50% cost savings compared to other sealing solutions Application Examples Water tight connectors Sensors Strain relief, grommets on wire harnesses PCB s Antenna coils 37

37 Henkel Automotive Potting/Sealing Summary Technology Type Applications Benefits Example Sealing Solutions Potting Low Pressure Molding Sealing for: Pins/leads/terminals Connections PCB Pins/leads/terminals Wire harnesses Connectors Sensors PCB Provides long term sealing: Prevents Corrosion Mech. Reinforcement Temp resistance Chemical resistance Fills large voids Reduces WIP Fills large voids Reduces WIP Reduces package req. Process simplification Porosity Sealing Pins/leads/terminals Solenoids Wire harnesses Connectors Sensors Castings Low takt times No dimensional impact No design change for implementation High pressure retention Seal microporosity 38

38 A-Line Potting Product Line Selector Guide Interior / Exterior Locations (max C) Under Hood Locations (150 C) Under Hood / Fluid Contact or Immersion (150 C) UV / Moisture Cure LOCTITE 5025A LOCTITE 5031 Developmental Product UV Cure Only LOCTITE 3106, other UV acrylics LOCTITE Moisture Cure Only - LOCTITE 5040 FlexSeal 5100 / 5110 (impreg anaerobic) 2k Systems U137S / U102 LOCTITE 5620 Stycast 2850FT / Cat 11 Heat Cure Can accelerate 2k urethanes - EO 1058 A

39 Potting/Sealing Summary Product & Concept Encapsulation of sensitive electronic components providing functional, long-term seal at critical connector interfaces. Target Applications Electrical devices, Transformers, Sensors, Connectors, Inverters, Converters, Battery, Motor Features & Benefits Design Eliminate mechanic fastening and enhance rapid integration of electrical components Thermal Conductivity Heat transfer of heat producing components (Inverter/Converter) Resistance Provide insulation and prevent electronic components from moisture, dust and chemicals corrosion Process cost & efficiency Faster curing for faster process Quality Prevent moisture and contaminants from entering with impregnation processes 40

40 Conclusion Why Choose Henkel? Innovative Chemistry Design & Application Competence Engineering & Equipment Solutions 41

41 Lab Tour

42 Q&A 43

43 Sources & Contacts Please contact the following people depending on your requests: Technical questions, samples, trials: Bob Stefl AEV/EE Component Questions: Bill Brown 44

44 Thank you! This material has been visually improved with the help of our team at the Graphic Design Center in SSC Manila. To know more about this service, please visit in the Henkel portal.