Current Sensing Resistor Thick Film Type > SK Series

Transcription

1 Page: 1 of 7 General Chipsizefrom0603to2512 Resistance value from 10m to 1000m Compatible with Reflow and Wave Soldering processes Lead free, ROHS compliant for global Applications and halogen free Application Switching model power supply Battery pack Notebook, personal computer Test Instrument Power Amplifier Electrical Specifications Type Power Rating at 70 (W) Resistance Range (mω) TCR (ppm/ ) Resistance Tolerance Operation Temp. Range 20 R<33 ± R<68 ± /8 68 R<100 ± R<20 ± :1/4 1206:1/2 1210:1/2 2010: R<50 ± R<100 ±800 ±1%(F) -55 ~ R<20 ± R<50 ± R<100 ±800

2 Page: 2 of 7 Type Power Rating at 70 (W) Resistance Range (mω) TCR (ppm/ ) Resistance Tolerance Operation Temp. Range 10 R<20 ± R<100 ±800 ±1%(F) -55 ~+155 Part Number Information SK 08 G D F R047 T Series Name: SART Thick Film Type 2 Chip size: 06: : : : : : Material Code: G:Ag Alloy 4 Power Code: H:1/16W F:1/8W D:1/4W A:1/2W 1:1W 2:2W 5 Resistance Tolerance: F:±1% 6 Resistance Code: R047=47mΩ 6M50=6.5mΩ 7 Packaging Code: T:Tape& Reel B:Bulk Pack Dimensions Type L(mm) W(mm) T(mm) A(mm) B(mm) ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.20

3 Page: 3 of 7 Recommended Land Patterns Type A(mm) B(mm) C(mm) D(mm) Materials No. Materials No. Materials 1 Ceramic Substrate 6 Marking 2 Bottom Electrode 7 Edge Electrode 3 Top Electrode 8 Barrier Layer 4 Resistor Layer 9 External Electrode 5 Overcoat 10 /

4 Page: 4 of 7 Power Derating Curve Recommended Solder Curve 1. Infrared Reflow Temperature: 260 Time: 5sec Max. Recommend Reflow profile: Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 /sec Max. Preheat 150 Temperature Min(Tsmin) 200 Temperature Max(Tsmax) Time(Tsminto Tsmax) 60sec~120sec Peak Temperature(Tp) 260 Time within 5 of actual Peak Temperature(Tp) 5sec Melting tin time(tl) 20sec~30sec Ramp-Down Rate Time 25 to Peak Temperature 6 /sec Max. 8min Max. 2.Wave soldering 3.Hand Soldering Reservoir Temperature: 260 Temperature: 350 Time in Reservoir: 10sec Max. Time: 5sec Max.

5 Page: 5 of 7 Product Characteristics Item Test Condition/ Methods Performance Standard Short Time Overload 2.5X rated power for 5sec R ±1% IEC Temperature Coefficient of Resistance (T.C.R.) Load Life TCR =(R-R0)/R0(T2-T1)* 10 6 T1 T2 Test temperature:25 ~ ± 2, 1000 hours, at rated power 1.5 hours ON, 0.5 hours OFF Refer to SART Spec IEC R ±1% IEC Bias Humidity 40 ±2, (93% ± 3%)RH, 1000 hours, at rated power 1.5 hours ON, 0.5 hours OFF R ±1% IEC Thermal Shock -55 (30min)/+155 (30min), 300 cycles R ±1% IEC Solderability 245 ± 5, 3.0sec ± 0.3sec 95%coverage Min. IEC Resistance to Soldering Heat High temperature Exposure Bending Test 270 ±5, 10sec±1sec R ±1% IEC ±2, 1000 hours R ±1% IEC Epoxy thickness1.6mm, fulcrums distance 90mm, bending width 5mm(0603\0805), bending width 4mm(1206\1210), bending width R ±1% IEC mm(2010\2512) Insulation Resistance (100V±15V) DC 1000MΩ Min. IEC Operation at low temperature Voltage proof Component solvent resistance Shear test -55 ±5,1hour without load,rated voltage IEC or limiting element voltage whichever is lower R ±1% for 45min,15min without load Apply Max. overload voltage of AC RMS at a rate of approximately No breakdown or 100V/sec between substrate and terminations flash-over IEC for 60sec±5sec Iso-propyl alcohol (IPA) 23 ±5,10hours R ±1% IEC Applying force: 0603: 5N; 0805:9N;1206, 1210:25N;2010,2512: 45N No mechanical damage IEC Duration:10sec±1sec

6 Page: 6 of 7 Packaging 1. Paper Tape Dimensions Type A(mm) B(mm) W(mm) F(mm) E(mm) ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.10 Type P(mm) P0(mm) P1(mm) D0(mm) T(mm) ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± Embossed Tape Dimensions Type A0(mm) B0(mm) W(mm) F(mm) E(mm) t(mm) ± ± ± ± ± ± ± ± ± ± ± ±0.05 Type P(mm) P0(mm) P1(mm) D0(mm) D1(mm) K0(mm) ± ± ± ± ± ± ± ± ± ±0.10

7 Page: 7 of 7 3.Reel Dimensions Type M(mm) W(mm) T(mm) A(mm) B(mm) C(mm) D(mm) ± ± ± ± ± ± ± ± ± ± ± ± ± ± Quantity of Package Type Quantity (pcs) Peeling Test Storage The ambient temperature shall between 5 ~30. The relative humidity recommended for storage is between 25%RH~60%RH. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.