TOXIC SUBSTANCE REDUCTION PLAN SUMMARY

Transcription

1 Siemens Canada Limited Siemens Milltronics Process Instruments TOXIC SUBSTANCE REDUCTION PLAN SUMMARY (Reporting Year 2011) Prepared by: Elyse Sawdon December 12, 2012 Siemens Canada Limited Siemens Milltronics Process Instruments 1954 Technology Drive, P.O. Box 4225 Peterborough, Ontario K9J 7B1 / Canada Tel.: (705) Fax: (705)

2 Basic Facility Information Substance name & CAS Registry Lead and its compounds (except tetraethyl lead). CAS # number Facility Name Siemens Canada Limited, Siemens Milltronics Process Instruments Facility Address 1954 Technology Drive Peterborough, ON K9J 7B1 Parent Company Siemens Canada Limited Parent Company Address 1550 Appleby Line, Burlington, ON, L7L 6X7 Percentage of Ownership 100% Universal Transverse Mercator (UTM) coordinates in NAD83 National Pollutant Release Inventory (NPRI) ID number Number of full-time employee equivalents Public Contact North American Industry Classification System (NAICS) 2-digit code North American Industry Classification System (NAICS) 4-digit code North American Industry Classification System (NAICS) 6-digit code Toxic Substance Reduction Planner name and license number Latitude: Longitude: Carla Guest Sr. Communications Specialist carla.guest@siemens.com 33 Manufacturing 3345 Navigational, Measuring, Medical and Control Instruments Manufacturing Measuring, Medical and Controlling Devices Manufacturing Risky Sordilla TSRP0098 1

3 Toxic Substances for Which Plans Have Been Prepared Inherent to the designs of SMPI s wide selection of process measuring instruments is the use of various substances in the manufacturing and assembly process. A number of these substances are included in the National Pollutant Release Inventory (NPRI) list of reportable substances although all, except for lead and its compounds (except tetraethyl lead) (hereon referred to as lead ), are non-reportable since consumption and use of these substances are below the quantity threshold reporting limit. Plan Summary Statement This Toxic Substance Reduction Plan Summary accurately reflects the Toxic Substance Reduction Plan prepared by SMPI for lead, dated December 12, Statement of Intent SMPI is committed to being an industry leader in the fields of environmental protection and innovation. It is the intent of SMPI to reduce the use of lead in our facility through ongoing efforts, working towards lead-free assembly and production. Objectives and Targets SMPI is taking actions towards eliminating the use of lead in the production process, and the release of lead-free products in the future. Over the next year, a potential reduction target of 89kg is estimated to be achievable through reductions options such eliminating lead containing printed circuit boards (PCBs), lead plated electronic components, lead based solder materials and potting compounds containing lead. Description of Substance Used in the Facility Lead and its compounds enter the facility through the use of raw materials containing the substance. These raw materials are utilized in various assembly processes resulting in the manufacture of finished products. There are no physical or chemical transformations or processing involved at the Inventory and Shipping Stages for lead-containing materials. All processing steps which have to do with the substance occur at the Assembly Stage. Additionally, lead and its compounds are neither created nor destroyed in any of the manufacturing steps. 2

4 Toxic Substance Reduction Options To reduce the use of lead at Siemens Milltronics Process Instruments facility, SMPI has found it both technically and economically feasible to implement the following: Option1: Substitute tin-based solder paste in place of lead-based solder paste, Option 3: Use chemical dross eliminator in wave solder and drag solder processes Option 5: Reduce over-purchasing of leaded solder, and Option 6: Advanced training for wave/drag solder machine operators. Furthermore, Option 2: Design and produce new lead free products will continue to be carried out as new products are designed and launched by SMPI. However, this option was determined not to be technically feasible as a primary means of reducing lead in the facility, due to the delayed return on investment and the vast capital investment needed to design all new products. Estimated Reductions for Options that are both Technically and Economically Feasible Option(s) Option 1: Substitute tin-based solder for lead-based solder Option 3: Use chemical dross eliminator in wave/drag solder process Option 5: Reduce overpurchasing of leaded solder Option 6: Advanced training for wave/drag solder machine operators Used (kg/year) Contained in Product (kg/year) On-Site Releases (kg/year) Air Water Land Off-Site Recycling (kg/year) kg kg 0 kg 0 kg 0 kg 9.5 kg 48.7 kg 0kg 0 kg 0 kg 0 kg kg kg kg 0 kg 0 kg 0 kg kg 48.7 kg 0 kg 0 kg 0 kg 0 kg kg Timeline for Achieving Estimated Reductions The timeline for completion of all proposed toxic reduction options for 2013 is six to nine months, and all proposed options should be complete by September

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