New Dual Magnetron Plasma Source Designed For Large Area Substrate Pretreatment and Oxide Film Deposition P. Morse, R. Lovro, M. Rost, and J.

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1 New Dual Magnetron Plasma Source Designed For Large Area Substrate Pretreatment and Oxide Film Deposition P. Morse, R. Lovro, M. Rost, and J. German,

2 Road Map Source Design Theory of Operation Experimental Setup Pretreatment Process Data Deposition Process Data Conclusion

3 envis-ion DMPTS Dual Magnetron Pretreatment Source Stacked magnetron design Operates off MFAC or BPDC power Compatible with adjacent processes Long electrode life, quick change targets End block, cantilever, or remote mount Model Max Power Typical Power Operating Pressure PET Surface Energy at 6.7m/min DMPTS 5 Kw/m 2-4 kw / m 2 40 mtorr > 65 dynes

4 envis-ion DMPTS Source Cross Section Source Opening Electrode A Titanium Electrode Electrode B Power Supply Electrode Fastener Gas Manifold

5 Theory of Operation 1. Electron Generation Alternating sputtering between two low sputter yield electrodes with high secondary electron emission creates a low impedance plasma cloud. Substrate

6 Theory of Operation 2. Process Gas Ionization / Activation The process gases (Oxygen, Argon, Nitrogen, etc..) are introduced directly into the plasma through the back wall of the source. Substrate

7 Theory of Operation 3. Plasma Expansion Plasma density increases until the plasma expands out of the source Low strength magnetic fields outside the source form a collimated beam of plasma, Effective to 200mm and beyond. Substrate

8 envis-ion DMPTS Low Ion and Electron Energy Typically competing technologies have much higher ion energies, this demonstrates energies under 40eV. Source: Fraunhofer IST Energy histogram of ions (left) and electrons (right) on chamber wall (i.e. substrate) adjacent to the source orifice at different snapshot times.

9 Experimental Setup Equipment: (1) 620mm long evis-ion source (1) 30kW EN-Tech Bi-Polar Pulse DC power supply (40kHz) (1) 650mm long aluminum target rotary cathode (DC) (1) Advanced Energy Pinnacle Cathode Power Supply (1) 1000sccm Argon Mass Flow Controller (1) 1000sccm Oxygen Mass Flow Controller (1) 500sccm HMDSO Mass Flow Controller (MKS 1150C) (1) 20mTorr Capacitive Manometer (2) Turbo Molecular Pumps (1) Set of Accudyne Surface Energy Marker Pens AS 3359 Adhesion Testing Supplies PET, Polycarbonate, Polyethylene bare plastic substrates

10 Experimental Setup The system was configured as shown in this simplified top view EN-Tech Power Supply 30kW 1000sccm Argon 1000sccm Oxygen Rotary Cathode Drum Turbo Pumps DMPTS Source Substrate Chamber Wall

11 Process Variables and Measurements: Surface Energy Enhancement Testing Process Variables Source to Substrate Distance Substrate Velocity Number of Passes Power (Power Control Mode) Argon Flow Oxygen Flow Value 82mm 6.7m/min 1 Pass 7kW 900sccm 300sccm Process Measured Values Value Power Supply Voltage 490V Power Supply Current 14.3A Process Pressure from CM 10mTorr

12 Surface Energy Testing Results: 44 Dyne Doesn t Wet 42 Dyne Does Wet The 60 Dyne Marker does wet on the surface after pretreatment so the surface energy is greater than or equal to 60 Dyne

13 Surface Energy Testing Results: The surface energy was tested along the entire 650mm length of the substrate. The resulting surface energy along the entire substrate was greater than or equal to 60dyne/cm after pretreatment suggesting that the pretreatment was uniform.

14 Process Variables and Measurements: Adhesion and Surface Energy Enhancement Testing Process Variables Source to Substrate Distance Substrate Velocity Power (Power Control Mode) Argon Flow Oxygen Flow Aluminum Target Power Value 100mm 6.7m/min 2-5kW 900sccm 300sccm 4kW DC Process Measured Values Value Power Supply Voltage V Process Pressure from CM 10mTorr

15 envis-ion DMPTS Polyethylene Pretreatment Surface Energy and Adhesion Surface Energy (Dynes) AS 3359 Adhesion Scale Treatment Exposure (kw-min/m^2) Surface Energy Sputtered Aluminum Adhesion

16 envis-ion DMPTS Polycarbonate Pretreatment Surface Energy and Adhesion Surface Energy (Dynes) AS 3359 Adhesion Scale Treatment Exposure (kw-min/m^2) Surface Energy Sputtered Aluminum Adhesion

17 envis-ion DMPTS PET Pretreatment Surface Energy and Adhesion Surface Energy (Dynes) AS 3359 Adhesion Scale Treatment Exposure (kw-min/m^2) Surface Energy Sputtered Aluminum Adhesion

18 Process Variables and Measurements: 3 rd Party Testing of Planarized Substrates in an inline coater The power supply used for this testing was and AE-PEII at 40kHz Process Variables Source to Substrate Distance Substrate Velocity Number of Passes Power (Power Control Mode) Argon Flow Oxygen Flow Process Measured Values Process Pressure from CM Value 100mm 0.5m/min 1 Pass 1-4kW 1000sccm 500sccm Value 1.85mTorr

19 envis-ion DMPTS Surface Energy (Dynes) 3 rd Party Testing of Planarized Plastic Substrates - Inline Coater samples for each substrate type were tested Treatment Exposure (kw-min/m^2) Substrate A - Surface Energy Substrate B - Adhesion Substrate C - Adhesion AS 3359 Adhesion Scale

20 Pretreatment Conclusions Performance Characteristics and Advantages The DMPTS source was able to increase the surface energy of the plastic materials at low exposure rates Some materials such as polycarbonate require treatment beyond the highest measurable surface energy for adhesion At high exposure rates the DMPTS did not reduce the adhesion between the substrates and sputtered aluminum No over treatment Low energy plasma is uniquely suited for pretreatment Adhesion was improved on bare plastic substrates as well as on substrates with planarization layers

21 envis-ion DMCVD Dual Magnetron CVD Source Stacked magnetron design Added flexible pre-cursor manifold Operates off MFAC or BPDC power Improved cooling allows for higher power densities Model Max Power Typical Power Operating Pressure SiO2 Dep Rate DMCVD 20 Kw/m 10 kw/m 3-15 mtorr >200 nm m /min

22 envis-ion DMCVD DMCVD Source The DMCVD source is very similar to the DMPTS source with the following differences Addition of an integrated precursor manifold Improved water cooling of the electrode Different electrode design Heavy duty condensate shielding Note: The DMPTS is suitable for plasma treatment in a production environment and may be suitable for PECVD depending on the application. DMCVD is currently in development.

23 Theory of Operation 4. Precursor Activation The precursor gas is introduced into the vacuum chamber outside the source and becomes activated and will stick to the substrate when it comes in contact with the plasma. HMDSO Coating forming on substrate surface from activated HMDSO Substrate

24 Theory of Operation 4. Process Gas and Precursor Chemical Reaction The precursor that was activated and stuck to the substrate surface is bombarded by Oxygen Ions that react to form the final SiO2 coating. Substrate Activated Oxygen reacting with the initial HMDSO coating to form SiO2

25 envis-ion DMCVD Dual Magnetron CVD Source SiO2 using HMDSO Rates as high as 400 nm m/min D2 Deposition Rate as a Function of Pressure 200 HMDSO at 20kW - 150mm TTS Uniformity within +/-3% Refractive index Low contamination from electrode Deposition Rate, nm*m/min HMDSO -20kW -80mm 200sccm at 20kW 80mm TTS Ti:Si Power [W] crack onset strain ε (%) CM Pressure, mtorr

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