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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : November Version 2 Written by: Sylvain HALLEREAU DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 1

2 Table of Contents Glossary Overview / Introduction Executive Summary Comparison of the Analyzed LEDs Reverse Costing Methodology 2. Physical Analysis Physical Analysis Methodology Package Characteristics Package X-Ray Package Opening Package Cross-Section Phosphor Package Parameters LED Die LED Dimensions Cree LED Dies Comparison LED Cross-Section Active Layers 3. Manufacturing Process Flow. 37 LED Die Process Flow Description of the Wafer Fabrication Units 4. Cost Analysis Synthesis of the Cost Analysis Yields Explanation Yield Hypotheses LED Front-End Cost Front-End : Epitaxy Hypotheses Front-End : Epitaxy Cost Front-End : Epitaxy Cost per Steps Front-End : Other Front-End Cost Front-End : Other Front-End Cost per Steps Front-End Cost per Equipment Family Front-End Cost per Consumable Family Dies per Wafer & Probe Test Back-End 0 : Probe Cost Back-End 0 : Dicing Cost LED Wafer & Die Cost (FE + BE 0) Back-End 1 : Packaging Hypothesis Back-End 1 : Packaging Process Flow Back-End 1 : Packaging Cost Details Back-End 1 : Final Test Cost Component Manufacturing Cost (FE+BE0+BE1) Cost Analysis Evolution 5. Estimated Manufacturer Price Analysis...66 Price definitions Manufacturers financial ratios Binning Impact on Manufacturing Price Ideal manufacturer Price Manufacturing Price with Binning Yield Conclusion by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 2

3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the CREE Xlamp XP-E Cool White LED reference XPEWHT-L E01. The XP-E is a pure white series and have a typical brightness of 114lm with a consumption of 1.12W at 350mA. The component is provided in a specific 2-pins package, compatible with SMT process. It can be used in a wide range of lighting applications, including: Portable LED light bulbs Architectural Signage Retail display Transportation Emergency vehicle 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 3

4 Comparison of the Analyzed LEDs Manuf. Series Ref. Category Electro-Optical characteristics Forward Current I F (ma) 150mA 350mA 700mA 1000mA 1500mA I F Max (ma) Luminous Flux Φ V (lm) Osram Oslon LUW CP7P Ultra-High Brightness Forward Voltage V F (V) Power Dissipation P D (W) Efficacy (lm/w) Luminous Flux Φ V (lm) Seoul Semi Z-Power Z5 SZWW5A0A Ultra-High Brightness Forward Voltage V F (V) Power Dissipation P D (W) Efficacy (lm/w) Luminous Flux Φ V (lm) Cree XLAMP XP-E Ultra-High Brightness Forward Voltage V F (V) Power Dissipation P D (W) Efficacy (lm/w) Luminous Flux Φ V (lm) Nichia NCSW119 Ultra-High Brightness Forward Voltage V F (V) Power Dissipation P D (W) Efficacy (lm/w) Luminous Flux Φ V (lm) Nichia NS6W183T Ultra-High Brightness Forward Voltage V F (V) Power Dissipation P D (W) Efficacy (lm/w) by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 4

5 XP-E Cool White Color spectrum Cool white color Cree measurement (datasheet) The XP-E LED is a white LED. The white color is obtained by the use of one royal blue LED (450nm) and a phosphorus YAG. It s a cool white color. The color Rending Index is 75% (Cree datasheet). All the white LEDs (cool, neutral, outdoor) are manufactured with a royal blue LED, same wavelength peak. Only the YAG changes between the version. The warm white LED have a peak slightly shifted toward the blue. Binning selection; 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 5

6 Physical Analysis Methodology Package is analyzed and measured. RX pictures to identify the package construction. The package is opened to get overall die data: dimensions, main characteristics. Cross-sections of the complete device and of the die are done to analyze the technologies and the materials used by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 6

7 Package Parameters Package Parameters 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 7

8 LED Die SEM view of the die (The die is soldered on the package) 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 8

9 Cree LED Dies Comparison The die used in the Xlamp XP-E is similar at the Cree EZ700 Gen I used in the XLAMP XR-C and the Cree EZ900 Gen I used in the Seoul Z5. These LEDs use the same Cree EZBright LED technology. The only differences come from the die size (0.68x0.68mm for the Cree XLAMP XR-C, 0.88x0.88mm for the Seoul Z5 and 0.99x0.965mm for the CREE XP-E) and the number of bond pads for cathode contacts. Cree EZ700 Gen I die Cree EZ900 Gen I die Cree EZ1000 Gen I die 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 9

10 Physical Analysis Summary The XP-E uses a flat lead-less ceramic package to which the LED die is soldered. Two physically isolated lands provide anode and cathode connections. The anode provides the bottom contacts for the LED die at the top of the package and a silicon diode protection device attached with silver-filled epoxy. The cathode connects to the tops of the LED and protection die with three wirebonds, two for the LED die and one for the protection diode. A third land acts as heat sink and is not electrically connected. We estimate that the fluorescent material is printed directly on the die. As a die with anti-waveguiding treatment is used, there is no silvered reflector cup required to collect side-emitted light. A molded silicone lens provides device encapsulation and upwards collimation of output light. The die is by Cree and uses the same fabrication technology as that of the Cree XLAMP XR-C and Seoul Semiconductor Z-Power Z5. The active device is bonded face-down to a sturdy metalized silicon chip, and then back-thinned to eliminate the optical impediments of the growth substrate and buffer layers. The final surface is etched in such a manner as to leave a fine structure which prevents interference and waveguiding effects, creating a surface-emitting device by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 10

11 LED Die Process Flow The main parts of the process: (1) GaN layer composed by buffer GaN, n-gan, MQW and p-gan layers are grown on a SiC substrate. (2) Realization of the first part of the p- contact metal stack on SiC substrate. (3) Realization of the second part of the p-contact metal stack on Si substrate (4) Solder bonding of SiC and Si substrates. Backgrinding of the Si substrate followed by AuSn ECD on backside. Temporary bonding of the SiC/Si substrates on glass carrier and SiC laser lift-off (removing of the SiC substrate). (5) GaN texturization and patterning. Passivation on GaN and realization of the n-contact (pure gold). Debonding 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 11

12 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 12

13 LED Front-End Cost Low Yield Medium Yield High Yield Total Front-End Cost Breakdown Cost Breakdown Cost Breakdown Raw Substrate Cost (SiC) $400,00 31,6% $400,00 35,1% $400,00 38,7% FE : Epitaxy Cost $215,93 17,0% $215,93 18,9% $215,93 20,9% FE : Other FE Cost $253,47 20,0% $253,47 22,2% $253,47 24,5% FE : Yield Losses Cost $397,95 31,4% $271,39 23,8% $164,28 15,9% TOTAL Front-End Cost $1 267,35 100% $1 140,79 100% $1 033,68 100% FE : Other FE Cost Breakdown (Medium Yield Estimation) Clean Room 5% Other FE Yield losses 40% Equipment 14% Materials 28% Salary 13% 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 13

14 LED Wafer & Die Cost (FE+BE 0) Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown FE : Raw Substrate Cost $400,00 31,2% $400,00 34,6% $400,00 38,2% FE : Epitaxy Cost (with Yield losses) $360,41 28,1% $316,20 27,4% $276,85 26,4% FE : Other Front-End Cost (with Yield losses) $506,94 39,6% $424,59 36,8% $356,84 34,1% BE 0 : Probe + Dicing Cost $14,26 1,1% $14,26 1,2% $14,26 1,4% TOTAL Wafer Cost $1 281,61 100% $1 155,05 100% $1 047,94 100% Nb of potential dies per wafer Nb of good dies per wafer ,9% ,2% ,6% FE : Raw Substrate Cost $0,087 31,2% $0,081 34,6% $0,075 38,2% FE : Epitaxy Cost (with Yield losses) $0,078 28,1% $0,064 27,4% $0,052 26,4% FE : Other Front-End Cost (with Yield losses) $0,110 39,6% $0,086 36,8% $0,067 34,1% BE 0 : Probe + Dicing Cost $0,003 1,1% $0,003 1,2% $0,003 1,4% Die Cost $0, % $0, % $0, % The final wafer cost ranges from $1,282 to $1,048 according to yield variations. The final LED die cost ranges from $0.279 to $0.197 according to yield variations. The Front-End (FE) cost represents 99% (Substrate + Epitaxy + Other FE). The Back-End 0 cost (Probe Test & Dicing) represents 1% by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 14

15 Component Manufacturing Cost (FE+BE0+BE1) Low Yield Medium Yield High Yield Cost Breakdown Cost Breakdown Cost Breakdown FE + BE 0 : Die cost $0,279 67,7% $0,233 66,3% $0,197 64,8% BE 1 : Packaging cost $0,101 24,6% $0,101 28,8% $0,101 33,2% BE 1 : Final test cost $0,002 0,4% $0,002 0,5% $0,002 0,5% BE 1 : Yield losses $0,030 7,4% $0,016 4,4% $0,005 1,5% Component cost $0, % $0, % $0, % The component cost is between $0.412 and $0.305 according to yield variations. The die cost represents 66% of the total manufacturing cost. It includes the costs of Front-End and Back-End level 0 (Probe test & Dicing). The packaging cost represents 29% of the total manufacturing cost. Final test cost and yield losses represent 4% each of the total manufacturing cost. The Back-End level 1 (BE 1) includes the steps Packaging & Final Test by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 15

16 Manufacturer Price with Binning Yield Binning Yield 20,0% Price reduction on component fall in the 20,0% outer bins We take a binning yield of 20% (DOE Workshop Consensus for LEDs manufactured on sapphire and SiC substrates). We estimate that an average price reduction of 20% is applied on the LED which failed to the bin. Versions Final component cost Floor price Manufacturer price Low Yield $0,412 $0,94 $0,957 Middle Yield $0,352 $0,80 $0,817 High Yield $0,305 $0,69 $0, by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 16

17 Conclusion Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2010 by SYSTEM PLUS CONSULTING, all rights reserved. CREE Xlamp XP-E Cool White LED 17