Thermal Management of Electronics Devices with PCMs filled Pin-fin Heat Sinks

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Thermal Management of Electronics Devices with PCMs filled Pin-fin Heat Sinks 35 TH HEXAG MEETING, 15 MAY 2018 THE BEEHIVE, NEWCASTLE UNIVERSITY Adeel Arshad adeel.

1 Thermal Management of Electronics Devices with PCMs filled Pin-fin Heat Sinks 35 TH HEXAG MEETING, 15 MAY 2018 THE BEEHIVE, NEWCASTLE UNIVERSITY Adeel Arshad Supervisors: Dr Mark Jabbal and Pro. Yuying Yan Fluids & Thermal Engineering (FLUTE) Research Group Faculty of Engineering The University of Nottingham, Nottingham, UK

2 OVERVIEW Motivation Background Aims and Objectives Experimental Methodology Experimental Design Results 2

3 Motivation 3

Background Projection of maximum heat flux and power dissipation for microprocessor chips Major causes of electronics failures "A critical review of traditional and

4 Background Projection of maximum heat flux and power dissipation for microprocessor chips Major causes of electronics failures "A critical review of traditional and emerging techniques and fluids for electronics cooling." Renewable and Sustainable Energy Reviews 78 (2017): U.S. Air Force Avionics Integrity Program notes,

5 Aims and Objectives In this research project, a series of experimental studies were undertaken so as to achieve a better understanding of heat transfer characteristics of circular and square PCMs filled heat sinks under varying the fin thickness and volumetric fractions of PCMs. The objectives of this study were; To observe the charging and discharging of PCMs. To evaluate the increase in latent heating phase duration. To determine the enhancement in operation time at different set point temperatures (SPTs). To evaluate the heat capacity and thermal conductance. 5

6 Experimental Methodology Experimental Methodology Heat Sink Configurations PCMs Pin-fin Heat Sinks N-Eicosane Paraffin Wax Square profile Fin thickness Circular Profile Fin thickness Volumetric fraction = 0.0, 0.33, 0.66, 1.0 Volumetric fraction = 0.0, 0.33, 0.66, 1.0 No fin, 1mm, 2mm, 3mm No fin, 2mm, 3mm, 4mm 6

7 Experimental Design Pictorial view o f experimental setup Sectional view of heat sink assembly 7

8 Thermophysical Properties of Materials Material Thermal Conductivity (W/mK) Specific heat (kj/kgk) Latent heat (kj/kg) Melting Temperatur ( ) Density (kg/m 3 ) (Liquid) 790(Liquid) Paraffin Wax (Solid) 880(Solid) n-eicosane (Liquid) 2.2(Liquid) 780(Liquid) (Solid) 1.9(Solid) 820(Solid) Aluminum Rubber Pad

9 Results Square Pin-fin Heat Sinks Comparison of heat sink base temperatures for varying configuration of heat sinks with PCMs Arshad, A., et al. (2017). "Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction." Applied Thermal Engineering 112: Arshad, A., et al. (2018). "Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter." International Journal of Heat and Mass Transfer 117:

10 Results Square Pin-fin Heat Sinks Enhancement in Latent heating phase completion time Arshad, A., et al. (2017). "Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction." Applied Thermal Engineering 112: Arshad, A., et al. (2018). "Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter." International Journal of Heat and Mass Transfer 117:

$volume fraction." Applied Thermal Engineering 112: 143-155. Arshad, A., et al. (2018).$

11 Results Square Pin-fin Heat Sinks Enhancement in operation time of different fin thicknesses of pin-fin heat sinks Arshad, A., et al. (2017). "Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction." Applied Thermal Engineering 112: Arshad, A., et al. (2018). "Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter." International Journal of Heat and Mass Transfer 117:

12 Results Circular Pin-fin Heat Sinks Comparison of pin-fin diameters for paraffin wax and n-eicosane Arshad, A., et al. (2018). "Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs." International Journal of Heat and Mass Transfer 123: Arshad, A., et al. (2017). "Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices." International Journal of Heat and Mass Transfer 112:

PCMs." International Journal of Heat and Mass Transfer 123: 272-284. Arshad, A., et al. (2017).

13 Results Circular Pin-fin Heat Sinks Enhancement in operation time of various finned heat sinks Arshad, A., et al. (2018). "Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs." International Journal of Heat and Mass Transfer 123: Arshad, A., et al. (2017). "Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices." International Journal of Heat and Mass Transfer 112:

14 Results Square & Circular Pin-fin Heat Sinks Comparison of heat sinks base temperatures Arshad, A., et al. (2018). "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison." International Journal of Heat and Mass Transfer 117:

15 Results Square & Circular Pin-fin Heat Sinks Comparison of latent heating phase completion duration Arshad, A., et al. (2018). "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison." International Journal of Heat and Mass Transfer 117:

"Thermal management of electronics devices with PCMs filled pin-fin

16 Results Square & Circular Pin-fin Heat Sinks Comparison of enhancement in operation time Arshad, A., et al. (2018). "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison." International Journal of Heat and Mass Transfer 117:

17 Results Square & Circular Pin-fin Heat Sinks Comparison of heat capacity and thermal conductance Arshad, A., et al. (2018). "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison." International Journal of Heat and Mass Transfer 117:

18 Conclusions The comparison of heat sinks base temperature proves that 3mm diameter of pin-fin heat sink efficient thermal cooling than 2mm square pin-fin heat sink. The maximum latent heating phase completion durations are found for 3 mm thick circular pinfin heat sink for all provided input heat fluxes. Similarly, higher operations times, to reach SPTs of 65ºC and 45ºC are found for 3mm circular configuration pin-fin heat sink in comparison of 2 mm square configuration fin thickness pin-fin heat sink. The comparison of heat capacity and thermal conductance further proves that 3mm diameter fin thickness pin-fin heat sink has maximum potential to absorb thermal energy and to transfer heat from the electronic devices. 18

Future Work The next phase of the this project

To design the hybrid heat sink using synthetic

To utilize the various thermal conductivity

19 Future Work The next phase of the this project is; I. To design the hybrid heat sink using synthetic jet actuator (SJA) as an active cooling medium; Synthetic jet To optimize the geometric parameters. To explore the operating parameters. To investigate the fluid parameters. Aluminium oxide Copper oxide II. To utilize the various thermal conductivity enhancers (TCEs) with PCMs filled with heat sink; CuO Al 2 O 3 Graphene Metal foam (Al & Cu) Metal foam (Al & Cu) Graphene 19

Experimental Investigation on the Thermal Performance of Cavity Type Heat Sink with PCM

International Journal of Applied Environmental Sciences ISSN 0973-6077 Volume 12, Number 8 (2017), pp. 1547-1559 Research India Publications http://www.ripublication.com Experimental Investigation on the