Linear Plasma Sources for Surface Modification and Deposition for Large Area Coating
|
|
- Elaine O’Brien’
- 6 years ago
- Views:
Transcription
1 Linear Plasma Sources for Surface Modification and Deposition for Large Area Coating Dr Tony Williams Gencoa Ltd, UK Victor Bellido-Gonzalez, Dr Dermot Monaghan, Dr Joseph Brindley, Robert Brown SVC 2016, Indianapolis, IL, USA L-8 (Wed 11 th May 9:40am)
2 Current source technology summary Five DC, AC & Hipims source examples for large areas The case for pre-treatment / deposition with self - regulating smart operation Conclusions 2
3 Linear Plasma Sources for Surface Modification and Deposition for Large Area Coating Dr Tony Williams Gencoa Ltd 3
4 Plasma Pre-treatment & Deposition Products for Large Areas A wide variety of different source technologies exist depending upon need Focus of this presentation Plasma Treatment Product Categories: DC linear ion sources DC magnetron based plasma treaters AC type dual electrode plasma sources AC type plasma CVD sources Hipps + positive beam ion etching DC or pulsed DC inverse sputter box DC or AC hollow cathode Microwave & RF linear source technology Application / typical current uses Low speed web & glass Low to High speed / power web Low to High speed / power web PECVD deposition web or glass Etching of metallic substrates Etching of metallic substrates Low to High speed / power web PECVD mainly solar cells hard to scale / high cost
5 DC Linear ion sources Plasma Treatment Sources
6 Linear ion sources are typically used to pre-treat before sputter coating scalable robust devices based upon DC power Linear ion sources are a powerful means to improve coating adhesion and device performance - liberates moisture and burn-off hydrocarbons. The linear ions sources work at sputtering pressures and with low substrate speeds of <5m/min. Automatic gas feedback control via the DC power supply makes operation much more simple self-regulated beams that adapts to chamber conditions.
7 Main advantage is easy scaling and simple operation
8 Easy to scale - Internal mounting im4700 worlds longest linear ion source 4.7m long beam length
9 Elcometer abrasion test (ISO 11998) Ion pre-treatment is a powerful means to improve coating adhesion and device performance Abrasion resistance of coatings Rubbing in wet conditions Load: 100 gr. No. Cycles: 500 Comparative results of coating with and without ion beam pre-treatment Results of single pass plasma pre-treat Sample without ion-beam pretreatment Sample treated by ion beam NREL
10 Comparison of tempered glass with and without the use of a single pass plasma pre-treat with linear ion source Parallel on-axis in-lens secondary electron detection Sample not treated by ion beam Sample with ion-beam pre-treatment Samples without ion beam pretreatment show a hazy reflection. Due to small bubbles (5 mm) in the coating. After the tempering process no visible defects were detected on the coating. SEM analysis confirm the good state of the coating.
11 Example of practical uses for linear ion sources for surface preparation - VISTA telescope - Parana 11 Flame Nebula (VISTA image) Credit: ESO Parana Chile VISTA Telescope
12 Example of practical uses for linear ion sources for surface preparation - VISTA telescope - Parana VISTA Telescope mirror coater Ion Source IM1500 At VISTA with geometrical mask 12
13 Large mirror ion etching linear ion sources ideal as easy to scale and accurate beam control preventing mirror damage Large mirror coaters 2-4.5m optics 13 Ion source Sputter source
14 Results Atomic Force Microscope Surface Roughness Untreated example ( from masked area of T-1K-R03X) Zerodur λ/20 Highly Polished (un-etched)
15 Results AFM 3D Mapping 1h Treatment T-1K-R01 T-1.5K-R02 T-2K-R03 The overall surface roughness doesn t change substantially with the ion bombardment, however composite nanotopography is enhanced
16 Pros and cons of DC inverted magnetron plasma sources Plus points Highly scalable and controllable plasma beam DC power hence lower cost levels Weakness Low power levels slow speeds only Less plasma excitation High voltage beam volt mean beam energies Self-neutralized by electron tunnel effect no charge build-up on insulating substrates Easy to implement and use if gas has auto feedback control Carbon anode and cathode prevents contamination Process Flexibilty can be used for PECVD and PEALD Can damage sensitive structures does not lead to increased roughness Low rate etching of the substrates 1 Angstrom per pass for oxides, 40 Angstroms for polymers Separate gas control leads to variable beam properties Source can etch rapidly if of a metallic nature and high power Very low rates, so only useful for R&D or seed layers
17 DC magnetron based plasmas for surface pre-treatment Plasma Treatment Sources
18 A wide variety of internal and external DC magnetron based plasma treating designs based upon process & system requirements
19 Pros and cons of DC based magnetron plasma sources Plus points Highly scalable and controllable plasma & can run at high substrate speeds and powers DC or pulsed power hence relatively lower cost levels than RF and microwave Self-neutralized plasma no charge buildup on insulators Can run in poisoned mode or gettering mode Pulsed DC required for moisture rich atmospheres Single electrode Weakness Less plasma excitation voltages typically less than 500V Need to manage the power load to substrate type and atmosphere needs feedback control Need to prevent arcing on the target by pulsing power modes Not suitable for very reactive environments, eg PECVD
20 AC type dual electrode plasma treaters (2kV) for surface pre-treatment Magnetically enhanced AC type higher voltage plasma Magnetic packs angle adjustment for plasma web interaction adjust
21 COMPACT AC powered magentically enhanced dual electrode operates with a medium frequency generator Very small sources possible less than 60mm space required. Water cooled dual electrodes Pre-distributed gas injection
22 Pros and Cons of AC based magnetically enhanced plasma sources Plus Points Switching high voltage AC plasma of high intensity Self-neutralized switching plasma potential no charge build-up on substrate or target more robust in dirty environments Double electrode switching from positive to negative so stable anode and cathode Highly scalable and controllable plasma & can run at high substrate speeds and powers Can run in poisoned mode or gettering mode Weakness Could damage the substrate adjust the magnetic angles to prevent damage Higher cost compared to single electrode DC Higher cost compared to single electrode DC Need to manage the power load to substrate type and atmosphere needs feedback control
23 AC type dual electrode plasma treaters (2kV) for surface pretreatment for PACVD
24 Dual Electrode AC-MF better for chemical etching processes high plasma excitement In dual AC-MF plasma discharges on each electrode the voltage alternates between cathode and anode potential providing an stable impedance for the plasma discharge
25 Pros and Cons of AC based magnetically enhanced Chemical plasma sources Plus Points Two separate electrodes easy to integrate and adapt to different process chambers by re-positioning Highly scalable and controllable plasma & can run at high substrate speeds and powers gas pumping capacity dependant Precursor delivery external to the sources and injected directly into the high intensity plasma zone reduces electrode contamination & extends life Integrated Speedflo PEM control for automatic process control and gas delivery option of in-vacuum or remote OPTIX plasma monitoring Weakness Fixed voltage once setup The main challenge is the precursor gas delivery into the plasma space and separate from the plasma source Need to guard against sand like deposit in source needs gas separation and easy to clean Rates are mainly dependant upon vacuum pumping capacity
26 Hipps New High Impulse Positive pulses for rapid ion etching of Hip v metallic substrates at earth potential
27 Unique and patent pending use of a Hipps power mode with positive pulsing for high rate etching of substrates Hip v cleaning box to collect sputtered material to prevent system and substrate contamination Power Supply: Hipps 6kW (500 Amp maximum, +1.4kV) multiple power supplies for higher powers. Highly ionized argon and other background gases accelerated towards the metallic plates at upto 1.4 kv with 400A peak pulses substrate at earth potential hence the substrate is effectively -1.4 kv relative to the plasma source. The sources should be angled at upto 45 deg for maximum sputter efficiency and to allow better collection of sputtered material. Rapid removal of surface oxides and contamination high speed substrates Stand alone source easy system integration (customer to supply cleaning box)
28 Voltage (kv) Unique and patent pending use of a Hipps power mode with positive pulsing for high rate etching of substrates positive pulse drives magnetically guided ions at a high acceleration voltage towards an earthed substrate for rapid etching Hip v Time (μs)
29 Internal Ion Beams for cleaning tube internal diameters not easy to achieve by conventional means + DC discharge (no ion etching of internal wall) Copper inner wall Hip v Internal Ion Bombarder +kv
30 Hip v Positive etching plasma source - compact design scalable design multiple 6 kw PSU s in parallel Compact design 166mm x 180mm and to any length (longer sources may require more power supplies connected in parallel) new source development on-going Based upon high voltage / current positive pulse plasma cleaning / etching subject to a Gencoa patent application An alternative to inverted magnetron sputter etching for strip steel and metallic substrates Hip v Von Ardenne
31 Hip v plasma sources New alternative to inverted magnetron sputter boxes Positive pulse source Inverted sputter box Unique technology with highest plasma activation available Hipps based High voltage and currents best to sputter native surface oxides quickly More compact - No need for magnetics behind the substrate as in the case of sputter boxes Angled beam for maximum sputter efficiency 45 deg ion bombardment angle results in max sputter yield Easier cleaning and system maintenance all debris is directed away from the source DC based DC slower, pulsing need to prevent arcing Require components both side of the substrate Normal magnetron type plasma Debris collects in the source and the substrate
32 Conclusions Choice of the correct plasma pre-treatment device depends upon process requirement Large scale optics and slow moving substrates Best solution Linear ion sources High speed substrate pre-treatment Reactive chemical etching / PACVD Metallic strip / substrate cleaning DC magnetron or AC dual electrode AC dual electrode / AC hollow cathode Hipps positive pulse or inverted sputter box
33 Gencoa is actively combining technologies and developing ways to enhance thin film devices Thank you for your attention Thank You Please visit us at Booth 506 Gencoa
Managing Anode Effects and Substrate Heating from Rotatable Sputter Targets
Managing Anode Effects and Substrate Heating from Rotatable Sputter Targets Frank Papa*, Dermot Monaghan**, Victor Bellido- González**, and Alex Azzopardi** *Gencoa Technical & Business Support in US,
More informationHigh Rate Deposition of Reactive Oxide Coatings by New Plasma Enhanced Chemical Vapor Deposition Source Technology
General Plasma, Inc. 546 East 25th Street Tucson, Arizona 85713 tel. 520-882-5100 fax. 520-882-5165 High Rate Deposition of Reactive Oxide Coatings by New Plasma Enhanced Chemical Vapor Deposition Source
More informationMaximizing the Potential of Rotatable Magnetron Sputter Sources for Web Coating Applications
Maximizing the Potential of Rotatable Magnetron Sputter Sources for Web Coating Applications V.Bellido-Gonzalez, Dermot Monaghan, Robert Brown, Alex Azzopardi, Gencoa, Liverpool UK Structure of presentation
More informationUsing a standard Penning Gauge as a powerful means of monitoring and feedback control
Gencoa - Dermot Monaghan Using a standard Penning Gauge as a powerful means of monitoring and feedback control Victor Bellido-González, Sarah Powell, Benoit Daniel, John Counsell, Dermot Monaghan Structure
More informationNew Dual Magnetron Plasma Source Designed For Large Area Substrate Pretreatment and Oxide Film Deposition P. Morse, R. Lovro, M. Rost, and J.
New Dual Magnetron Plasma Source Designed For Large Area Substrate Pretreatment and Oxide Film Deposition P. Morse, R. Lovro, M. Rost, and J. German, Road Map Source Design Theory of Operation Experimental
More informationGENCOA. Perfect your process
GENCOA Perfect your process 02 Introduction Providing expert solutions to a worldwide customer base over three decades, Gencoa is among the world leaders in the design and manufacture of products for the
More informationGencoa Product Portfolio
Gencoa offer the following range of products & process technology for the thin film industry developed over the last 20 years Planar Magnetrons Plasma Pre- Treaters Reactive Gas Controllers Gencoa Product
More informationMetallization deposition and etching. Material mainly taken from Campbell, UCCS
Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,
More informationThin Films: Sputtering Systems (Jaeger Ch 6 & Ruska Ch 7,) Can deposit any material on any substrate (in principal) Start with pumping down to high
Thin Films: Sputtering Systems (Jaeger Ch 6 & Ruska Ch 7,) Can deposit any material on any substrate (in principal) Start with pumping down to high vacuum ~10-7 torr Removes residual gases eg oxygen from
More informationMagnetron Sputter Cathodes planar & rotatable. Linear ion sources. Reactive gas controller & endpoint detector
GENCOA products cover 3 sputtering related areas Magnetron Sputter Cathodes planar & rotatable Reactive gas controller & endpoint detector Linear ion sources Other activities include on-site process implementation,
More informationCracker valve and plasma control process for reactive sputtering with Selenium & Sulphur
Cracker valve and plasma control process for reactive sputtering with Selenium & Sulphur Victor Bellido-González, Dermot Monaghan, Benoit Daniel, Joseph Brindley, Gencoa Ltd, UK Dr. Iván Fernández- Martínez,
More informationHiPIMS Deposition of Metal and Oxide Coatings
HiPIMS Deposition of Metal and Oxide Coatings 1 GT West, 1 PJ Kelly, 1 P Barker, 2 JW Bradley and 2 A Mishra 1. Surface Engineering Group, Manchester Metropolitan University, UK 2. Electrical Engineering
More informationMass Production of Clear Barriers. Requirements on Vacuum Web Coaters for Quality Assurance. Rainer Ludwig, Applied Films, Alzenau, Germany.
Mass Production of Clear Barriers Requirements on Vacuum Web Coaters for Quality Assurance Rainer Ludwig, Applied Films, Alzenau, Germany Abstract An increasing number of packages using Transparent Barrier
More informationEQUIPMENT AND SYSTEM FOR VACUUM COATING METALLIZING, SPUTTERING, PLASMA and PECVD. Hybrid system KOLZER DGK 36
email : carlo.gennari@fastwebnet.it web site : http://carlogennariforni.beepworld.it/kolzer.htm EQUIPMENT AND SYSTEM FOR VACUUM COATING METALLIZING, SPUTTERING, PLASMA and PECVD Hybrid system KOLZER DGK
More informationThin Films: Sputtering Systems (Jaeger Ch 6 & Ruska Ch 7,) Sputtering: gas plasma transfers atoms from target to substrate Can deposit any material
Thin Films: Sputtering Systems (Jaeger Ch 6 & Ruska Ch 7,) Sputtering: gas plasma transfers atoms from target to substrate Can deposit any material on any substrate (in principal) Start with pumping down
More informationINTRODUCTION OF SYS & System
Vision 2015 INTRODUCTION OF SYS & System PVD & Ion Beam Irradiator Manufacturing Company isys is committed to building the best January. 2007 1 SYS, based on excellent technology and sufficient equipment
More informationSolar Selective Absorber Coating Methods Plasma Processes
Solar Selective Absorber Coating Methods Plasma Processes Paul Gantenbein & Elimar Frank SPF - Institut für Solartechnik University of Applied Sciences Rapperswil (HSR) Optical properties of a selective
More informationAC Reactive Sputtering with Inverted Cylindrical Magnetrons
AC Reactive Sputtering with Inverted Cylindrical Magnetrons D.A. Glocker, Isoflux Incorporated, Rush, NY; and V.W. Lindberg and A.R. Woodard, Rochester Institute of Technology, Rochester, NY Key Words:
More informationBarrier Coating Encapsulation Using Rotatable Cylindrical Sputtering Cathodes
Barrier Coating Encapsulation Using Rotatable Cylindrical Sputtering Cathodes V. Bellido-Gonzalez, D. Monaghan, R. Brown, B. Daniel, J. Brindley, A. Azzopardi, and I. Sorzabal-Bellido, Gencoa Ltd., Liverpool,
More informationPower Vision Ltd. PV Research. Power Vision Ltd. Unit R2, Herald Park, Crewe, Cheshire, CW1 6EA, UK Tel:
Power Vision Ltd PV Research Power Vision Ltd Unit R2, Herald Park, Crewe, Cheshire, CW1 6EA, UK www.pvoptical.com Tel: +44 1270 253000 Flexible Whether it be fast AR coating onto temperature sensitive
More informationHiPIMS deposition of dense Palladium-Silver films for hydrogen separation
HiPIMS deposition of dense Palladium-Silver films for hydrogen separation S. Fasolin, S. Barison, S. Boldrini, F. Montagner, M. Romano, A. Ferrario, M. Fabrizio, L. Armelao CNR-ICMATE, Corso Stati uniti
More informationMicrowave Plasma Processing
Microwave Plasma Processing MUEGGE GMBH Hochstraße 4-6 64385 Reichelsheim Fon +49 (0) 6164-93 07 11 Fax +49 (0) 6164-93 07 93 info@muegge.de www.muegge.de Microwave Plasma Processing Microwave Plasma Technology:
More informationGridless end-hall. Ion Sources. For Ion Assisted Thin Film Deposition & Substrate Cleaning
Gridless end-hall Ion Sources For Ion Assisted Thin Film Deposition & Substrate Cleaning End-Hall Ion Sources mark I Ion Source The Mark I End-Hall is ideal for small research and development and pilot
More informationResearch of Processes and Devices for Plasma Treatment of Polymeric Films Before Vacuum Coating
Research of Processes and Devices for Plasma Treatment of Polymeric Films Before Vacuum Coating Y. Lipin and R. Zeilja, J/S Co. Sidrabe, Latvia; O. Aksenov, Institute of Electrical Insulating Materials,
More informationRoman Chistyakov and Bassam Abraham Zond Inc/Zpulser LLC, Mansfield, MA
HIPIMS Arc-Free Reactive Sputtering of Non-conductive Films Using the ENDURA 200 mm Cluster Tool: Direct Comparison Between Pulsed DC Pinnacle Plus and HIPIMS Cyprium Roman Chistyakov and Bassam Abraham
More informationCHARGED PARTICLE PHYSICS BRANCH CODE 6750
Page 1 of 6 CHARGED PARTICLE PHYSICS BRANCH CODE 6750 The Charged Particle Physics Branch performs basic and applied research on topics relevant to Navy and DoD missions with potential spin-offs to the
More informationFabrication Process. Crystal Growth Doping Deposition Patterning Lithography Oxidation Ion Implementation CONCORDIA VLSI DESIGN LAB
Fabrication Process Crystal Growth Doping Deposition Patterning Lithography Oxidation Ion Implementation 1 Fabrication- CMOS Process Starting Material Preparation 1. Produce Metallurgical Grade Silicon
More informationXSTREAM REMOTE PLASMA SOURCE WITH ACTIVE MATCHING NETWORK
XSTREAM REMOTE PLASMA SOURCE WITH ACTIVE MATCHING NETWORK FULLY INTEGRATED PLASMA SOURCE PLATFORM FOR HIGH-FLOW AND HIGH-PRESSURE, REACTIVE-GAS PROCESSES The high-efficiency Xstream platform, mounted outside
More informationVacuum Deposition of High Performance Gas Barrier Materials for Electronics Applications
Vacuum Deposition of High Performance Gas Barrier Materials for Electronics Applications Hélène Suttle DPhil Research Student Department of Materials -University of Oxford AIMCAL Fall Conference October
More informationAdhesion enhancement of DLC hard coatings by HiPIMS metal ion etching pretreatment and its tribological properties José Antonio Santiago Varela
Adhesion enhancement of hard coatings by HiPIMS metal ion etching pretreatment and its tribological properties José Antonio Santiago Varela Bilbao, October 19 th 2016 E-mail: jose.santiago@imdea.org Aim
More informationand cost implications of corrosion, casting a spot light on the need for innovation in pipe coating materials and processes.
A ccording to the Energy Information Administration s International Energy Outlook for 2006, world oil demand is expected to grow from 80 million barrels per day in 2003 to 98 million barrels per day in
More informationFundamental Characteristics of a Microwave Discharge Type Plasma Source Working under Atmosphere Pressure
Fundamental Characteristics of a Microwave Discharge Type Plasma Source Working under Atmosphere Pressure KOBAYASHI Akira*, TAKAO Yoshiyuki**, KOMURASAKI Kimiya*** Abstract The microwave discharge plasma
More informationGrowth Of TiO 2 Films By RF Magnetron Sputtering Studies On The Structural And Optical Properties
Journal of Multidisciplinary Engineering Science and Technology (JMEST) Growth Of TiO 2 Films By RF Magnetron Sputtering Studies On The Structural And Optical Properties Ahmed K. Abbas 1, Mohammed K. Khalaf
More informationStudy of Ion Beam Sputtering using Different Materials
ab Journal of Nuclear Science and Applications, 5(), Study of Ion Beam Sputtering using Different Materials H. El-Khabeary Accelerators & Ion Sources Department, Basic Nuclear Science Division, Nuclear
More informationPlasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate
Plasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate Development of Sidewalls Passivating Films Sidewalls get inert species deposited on them with plasma etch Creates
More informationLatest Development in Vacuum Metallisation
Latest Development in Vacuum Metallisation Professor Nadir Ahmed Vacuum Metallising Consultant General Vacuum Equipment Ltd. Pennine Business Park, Pilsworth Road, Heywood OL10 2TL England Tel: +44(0)1706
More informationPlasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate
Plasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate Development of Sidewalls Passivating Films Sidewalls get inert species deposited on them with plasma etch Creates
More informationPlasma Activated EB-PVD of Titanium and its Compounds by Means of Large Area SAD
AIMCAL 2005 Myrtle Beach, SC, USA, October 19th, 2005 Plasma Activated EB-PVD of Titanium and its Compounds by Means of Large Area SAD E. Reinhold, C. Steuer VON ARDENNE Anlagentechnik GmbH, Dresden, Germany
More informationTransactions on Engineering Sciences vol 2, 1993 WIT Press, ISSN
A study of thin-film continuous coating process by vapour deposition P. Gimondo," F. Arezzo,* B. Grifoni,* G. Jasch& "Centra Sviluppo Materiali SpA, Via di Castel & Von Ardenne Anlagentchnik GmbH, Plattleite
More informationLinear Broad Beam Ion Sources ACC-30x150 IS, ACC-40x300 IS and ACC-40 x 600 IS
Dr. Hermann Schlemm Ion Beam- and Surface Technology Saalbahnhofstraße 6 D - 07743 JENA, Germany Tel.: ++ 49 3641 22 73 29 Fax: ++ 49 3641 22 87 60 email: hermann.schlemm@jenion.de http://www.jenion.de
More informationDeposition of niobium and other superconducting materials with high power impulse magnetron sputtering: Concept and first results
15th International Conference on RF Superconductivity July 25-29, 2011, Chicago Deposition of niobium and other superconducting materials with high power impulse magnetron sputtering: Concept and first
More informationLarge Area Coating for Glazing IOP Vacuum Symposium Daresbury 11 th Feb 2010
Large Area Coating for Glazing IOP Vacuum Symposium Daresbury 11 th Feb 2010 Off-Line Coatings Technology Group Pilkington European Technology Centre 2 NSG Group Pilkington a member of NSG Group from June
More informationThe Physical Structure (NMOS)
The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 3D Perspective 2 3 Fabrication
More informationPhysical Vapor Deposition (PVD) Zheng Yang
Physical Vapor Deposition (PVD) Zheng Yang ERF 3017, email: yangzhen@uic.edu Page 1 Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide
More informationUSN. Hosur : 6A/6B/6C 10ME665. Discuss briefly. 1 a.
USN 1 P E PESIT Bangalore South Campus Hosur road, 1km before Electronic City, Bengaluru -100 Department of Mechanical Engineering INTERNAL ASSESSMENT TEST 3 Solutions Subject & Code : NTM 10ME665 Name
More informationStudies on Atmospheric Non-Thermal Plasma Jet Device
Int. J. New. Hor. Phys. 3, No. 1, 1-6 (2016) 1 International Journal of New Horizons in Physics http://dx.doi.org/10.18576/ijnhp/030101 Studies on Atmospheric Non-Thermal Plasma Jet Device H. A. El-sayed*,
More informationHigh Rate low pressure PECVD for barrier and optical coatings
High Rate low pressure PECVD for barrier and optical coatings, Matthias Fahland, John Fahlteich, Björn Meyer, Steffen Straach, Nicolas Schiller Outline Introduction PECVD New developments magpecvd arcpecv
More informationToday s Class. Materials for MEMS
Lecture 2: VLSI-based Fabrication for MEMS: Fundamentals Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class What is
More informationGeneral Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems
General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems Technology p. 9 The Parallels to Microelectronics p. 15 The
More informationImproving coupling coefficient distribution on BAW filters manufactured on 200mm wafers
Improving coupling coefficient distribution on BAW filters manufactured on 200mm wafers Sergey Mishin Advanced Modular Systems, Inc Goleta, CA/USA smishin@amssb.com Yury Oshmyansky Advanced Modular Systems,
More informationCompetence in Plasma-Surface-Technology. Attaining new Goals, taking new Approach...
Competence in Plasma-Surface-Technology Attaining new Goals, taking new Approach... 2 Development Plasma technology has become a classic already. We set up milestones. Today we are setting new standards.
More informationPlasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate
Plasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate Development of Sidewalls Passivating Films Sidewalls get inert species deposited on them with plasma etch Creates
More informationIon-plasma technologies and equipment
Ion-plasma technologies and equipment VACUUM ION-PLASMA INSTALLATIONS OF «OPAL» SERIES «Opal» series ion-plasma installations are designed for deposition of low-emission, reflective and toned coatings
More informationPlasma Quest Limited
Plasma Quest Limited A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators Dr. Peter Hockley and Prof. Mike Thwaites,
More informationBINP accelerator based neutron source S. Taskaev
BINP accelerator based neutron source S. Taskaev Budker Institute of Nuclear Physics, Novosibirsk, Russia Accelerator based neutron source Epithermal Neutron Source based on novel Vacuum Insulation Tandem
More informationGas and surface applications of atmospheric pressure plasmas
Gas and surface applications of atmospheric pressure plasmas Eugen Stamate Technical University of Denmark Roskilde 4000, Denmark OUTLINE Introduction of DTU Energy Conversion and Storage Activities in
More informationDurable Neutral Color Anti-Reflective Coating for Mobile Displays
Durable Neutral Color Anti-Reflective Coating for Mobile Displays By John Madocks and Phong Ngo, General Plasma, Inc. Figure 1: Samsung S4 with top half of cover glass coated with AR+DLC Abstract An in-line
More informationA Basic Introduction to Thin-Film Coatings. From the Experts at VaporTech
A Basic Introduction to Thin-Film Coatings From the Experts at VaporTech What are thin-film coatings? 2018 Vapor Technologies, Inc. All rights reserved. Thin-film coatings Physical or Chemical Vapor Deposition
More informationIBS/e Ion Beam Sputter Deposition and Etching System. IBS/e with KDC-10 Ion Beam Sputter Deposition and Etching System with Kaufman Ion Source
IBS/e Ion Beam Sputter Deposition and Etching System IBS/e with KDC-10 Ion Beam Sputter Deposition and Etching System with Kaufman Ion Source The Model IBS/e is a high vacuum thin film deposition system
More informationChapter 3 Silicon Device Fabrication Technology
Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale
More informationMODEL 1061 SEM Mill ION MILLING. Ion milling is used in the physical. sciences to enhance the sample s surface. characteristics. Inert gas, typically
MODEL 1061 SEM Mill A state-of-the-art ion milling and polishing system. It is compact, precise, and consistently produces high-quality scanning electron microscopy (SEM) samples in the shortest amount
More informationApplied Research for Vacuum Web Coating: What is Coming Next?
Applied Research for Vacuum Web Coating: What is Coming Next? Matthias Fahland, John Fahlteich, Steffen Günther, Manuela Junghähnel, Claus Luber, Nicolas Schiller, Cindy Steiner, Steffen Straach, Michiel
More informationHigh performance radio frequency generator technology for the Thermo Scientific icap 7000 Plus Series ICP-OES
TECHNICAL NOTE 43334 High performance radio frequency generator technology for the Thermo Scientific icap 7000 Plus Series ICP-OES Keywords Free-running, Plasma, RF generator, Solid-state Using inductively
More informationIntroduction Sample deposition system Cavity deposition system prototype Surface characterization Beyond niobium
Genfa Wu Introduction Sample deposition system Cavity deposition system prototype Surface characterization Beyond niobium 1 United We Stand Succeed JLAB ECR thin film collaboration: JLAB: L. Phillips,
More informationComparison of Different Sputter Processes for ITO: Planar DC versus Planar AC
Comparison of Different Sputter Processes for ITO: Planar DC versus Planar AC P. Sauer, H.-G. Lotz, A. Hellmich, R. Kukla, J. Schröder Applied Films GmbH & Co. KG, Alzenau, Germany Key Words: ITO MF PET
More informationReview of CMOS Processing Technology
- Scaling and Integration Moore s Law Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from
More informationDecorative Coatings PVD the bright choice
a parent company of Decorative Coatings PVD the bright choice kenosistec.com a parent company of Why PVD Coating Best surface properties PVD is still one of the most effective method for modifying and
More informationElectron beam technology for turbine coating
Второй международный технологический форум "Инновации. Технологии. Производство." 23-25 марта 2015 года Electron beam technology for turbine coating Anastasiya Zagorni, MBA Prof. Dr. Christoph Metzner,
More informationEQUIPMENT EQUIPMENT FOR HIGH-EFFICIENCY SOLAR CONCEPTS CRYSTALLINE SILICON PV. SCALA XEA nova XENIA
CRYSTALLINE SILICON PV EQUIPMENT EQUIPMENT FOR HIGH-EFFICIENCY SOLAR CONCEPTS SCALA XEA nova XENIA VON ARDENNE was founded in 1991 as a spin-off of the former Manfred von Ardenne Research Institute. The
More informationStudentská 1402/ Liberec 1 tel.: cxi.tul.cz. Technology equipment
Technology equipment Department of prototype technologies and processes 3D Printer Objet Connex 500 3D print technology PolyJet Matrix System Objet modelling from ABS-like material for larger and accurate
More informationA Design for an efficient cylindrical magnetron cathode with rotating magnets and optical emission incorporated
Patent on, A Design for an efficient cylindrical magnetron cathode with rotating magnets and optical emission incorporated Inventors A. Subrahmanyam, Krishna Valleti IIT Madras, Chennai, INDIA. Shrikanth
More informationLect. 2: Basics of Si Technology
Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from fractions of nanometer to several micro-meters
More informationneeded for the SOFC electrolyte membrane application. Few directed vapor deposition
Chapter 3 Experimental Procedure 3.1 Overview Prior to this study, DVD has not been used to create the type of dense metal oxide layers needed for the SOFC electrolyte membrane application. Few directed
More informationPrevious Lecture. Vacuum & Plasma systems for. Dry etching
Previous Lecture Vacuum & Plasma systems for Dry etching Lecture 9: Evaporation & sputtering Objectives From this evaporation lecture you will learn: Evaporator system layout & parts Vapor pressure Crucible
More information4-in-1 Nano Machine & Technology
4-in-1 Nano Machine & Technology Machine combines 1) CVD, 2) PVD, 3) ion saturation and 4) ion-treatment processes in one (1) production cycle in one machine that produces functional coatings used to harden
More informationMODEL 1051 TEM Mill ION MILLING. Ion milling is used on physical science. specimens to reduce thickness to electron
MODEL 1051 TEM Mill A state-of-the-art ion milling and polishing system offering reliable, high performance specimen preparation. It is compact, precise, and consistently produces high-quality transmission
More informationBe careful what you wish for
Be careful what you wish for Four Point Probe Key measurement tool in microelectronics fabrication What is Four Point Probing Four Point Probing is a method for measuring the resistivity of a substance.
More informationMODEL SEM Mill. Two independently adjustable TrueFocus ion sources
MODEL 1060 SEM Mill A state-of-the-art ion milling and polishing system. It is compact, precise, and consistently produces high-quality scanning electron microscopy (SEM) samples for a wide variety of
More informationPlatypus Gold Coated Substrates. Bringing Science to the Surface
Platypus Gold Coated Substrates Bringing Science to the Surface Overview Gold Coated Substrates - Gold Coating Introduction - Glossary of Terms - Gold Coating Methods - Critical Features Platypus Gold
More informationII. NEG THIN FILM DEPOSITION
Deposition of Non-Evaporable Getter Thin Films and Vacuum Pumping Performances Ankit Sur Engineering Department, Wayne State University, Detroit, MI 48202 The ERL (Energy Recovery Linac) proposed at Cornell
More informationHigh Performance Optical Coatings Deposited Using Closed Field Magnetron Sputtering
High Performance Optical Coatings Deposited Using Closed Field Magnetron Sputtering D.R. Gibson, I.T. Brinkley, and J.L. Martin Applied Multilayers LLC, 1801 SE Commerce Avenue, Battle Ground, WA 98604
More informationTribomechanical Properties of DLC Coatings Deposited by Magnetron Sputtering on Metallic and Insulating Substrates
Tribomechanical Properties of DLC Coatings Deposited by Magnetron Sputtering on Metallic and Insulating Substrates Dr. Iván Fernández Martínez Indianapolis, May 10th, 2016 Diamond Like Carbon (DLC) Diamond-like
More informationVERSATILE DEVICE FOR IN-SITU MULTIPLE COATINGS OF LONG, SMALL DIAMETER TUBES Ady Hershcovitch 1, Michael Blaskiewicz 1, J. Michael Brennan 1, Art
VERSATILE DEVICE FOR IN-SITU MULTIPLE COATINGS OF LONG, SMALL DIAMETER TUBES Ady Hershcovitch 1, Michael Blaskiewicz 1, J. Michael Brennan 1, Art Custer 2, Mark Erickson 2, Wolfram Fischer 1, Chong-Jer
More informationA STUDY OF THE EFFECTIVENESS OF THE REMOVAL OF HYDROCARBON CONTAMINATION BY OXIDATIVE CLEANING INSIDE THE SEM.
A STUDY OF THE EFFECTIVENESS OF THE REMOVAL OF HYDROCARBON CONTAMINATION BY OXIDATIVE CLEANING INSIDE THE SEM. Neal Sullivan, Tung Mai, Scott Bowdoin* and Ronald Vane** A poster paper presented at Microscopy
More informationOptimization of the Sputtering Process for Depositing Composite Thin Films
Journal of the Korean Physical Society, Vol. 40, No. 3, March 2002, pp. 511 515 Optimization of the Sputtering Process for Depositing Composite Thin Films M. Farooq Pakistan Council of Renewable Energy
More informationCERTESS Carbon Diamond-like-Carbon (DLC) Tribological coatings Extreme Hardness + Very low friction = Exceptional Wear Resistance
www.hefusa.net sales@hefusa.net Carbon Diamond-like-Carbon (DLC) Tribological coatings Extreme Hardness + Very low friction = Exceptional Wear Resistance PVD Coatings Overview Physical Vapor Deposition
More informationSupporting Information: Model Based Design of a Microfluidic. Mixer Driven by Induced Charge Electroosmosis
Supporting Information: Model Based Design of a Microfluidic Mixer Driven by Induced Charge Electroosmosis Cindy K. Harnett, Yehya M. Senousy, Katherine A. Dunphy-Guzman #, Jeremy Templeton * and Michael
More informationQ150R Series Rotary Pumped Coaters
Q u o r u m Te c h n ologies Q150R Modular Coating Systems Q Series Rotary Pumped Coating Systems Innovative and versatile sputter High vacuum sputtering and carbon coater and carbonfor evaporator evaporation
More informationEffective Closed-Loop Control for Reactive Sputtering Using Two Reactive Gases
Effective Closed-Loop Control for Reactive Sputtering Using Two Reactive Gases D.C. Carter, W.D. Sproul, and D.J. Christie, Advanced Energy Industries, Inc., Fort Collins, CO Key Words: Reactive sputtering
More informationCourse: Technology of Surface Coating. Prof. A. K. Chattopadhyay
Course: Technology of Surface Coating Prof. A. K. Chattopadhyay Lecture: 1 Introduction 1. State some functions of solid material 2. State some desirable combination of mechanical properties of materials.
More informationNONTRADITIONAL MANUFACTURING PROCESSES
NONTRADITIONAL MANUFACTURING PROCESSES Lasers & Laser Beam Machining Basic NTM Process Groups: * Thermal NTM Processes - Laser Beam Machining (LBM) - Electron Beam Machining (EBM) - Plasma Arc Machining
More informationRoll-to-roll Technology for Transparent High Barrier Films
Roll-to-roll Technology for Transparent High Barrier Films Presented at the AIMCAL Fall Technical Conference, October 19-22, 2008, Myrtle Beach, SC, USA Nicolas Schiller, John Fahlteich, Matthias Fahland,
More informationP. N. LEBEDEV PHYSICAL INSTITUTE OF THE RUSSIAN ACADEMY OF SCIENCES PREPRINT
P. N. LEBEDEV PHYSICAL INSTITUTE OF THE RUSSIAN ACADEMY OF SCIENCES PREPRINT 18 CHANNELING A.V. BAGULYA, O.D. DALKAROV, M.A. NEGODAEV, A.S. RUSETSKII, A.P. CHUBENKO, V.G. RALCHENKO, A.P. BOLSHAKOV EFFECT
More informationFormation mechanism of new corrosion resistance magnesium thin films by PVD method
Surface and Coatings Technology 169 170 (2003) 670 674 Formation mechanism of new corrosion resistance magnesium thin films by PVD method a, a a a b M.H. Lee *, I.Y. Bae, K.J. Kim, K.M. Moon, T. Oki a
More informationPlasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate
Plasma Etching Rates & Gases Gas ratios affects etch rate & etch ratios to resist/substrate Development of Sidewalls Passivating Films Sidewalls get inert species deposited on them Creates passivating
More informationCharacterisation studies of the pulsed dual cathode magnetron sputtering process for oxide films
Surface and Coatings Technology 142 144 2001 621 627 Characterisation studies of the pulsed dual cathode magnetron sputtering process for oxide films J. O Brien, P.J. Kelly Centre for Materials Research,
More informationEffect of pulsed magnetron sputtering process for the deposition of thin layers of nickel and nickel oxide
Materials Science-Poland, 36(1), 2018, pp. 69-74 http://www.materialsscience.pwr.wroc.pl/ DOI: 10.1515/msp-2017-0092 Effect of pulsed magnetron sputtering process for the deposition of thin layers of nickel
More informationInfluence of Oxygen Flow Rate on the Variation of Surface Roughness of Fused Silica during Plasma Polishing Process
Available online at www.sciencedirect.com Physics Procedia 18 (2011) 107 111 The Fourth International Conference on Surface and Interface Science and Engineering Influence of Oxygen Flow Rate on the Variation
More informationECE 440 Lecture 27 : Equilibrium P-N Junctions I Class Outline:
ECE 440 Lecture 27 : Equilibrium P-N Junctions I Class Outline: Fabrication of p-n junctions Contact Potential Things you should know when you leave Key Questions What are the necessary steps to fabricate
More informationI. PHYSICAL ELECTRONICS. Prof. W. B. Nottingham L. E. Sprague C. J. Marcinkowski R. Steinberg W. E. Mutter M. Wilkinson A. ELECTRON-EMISSION PROBLEMS
I. PHYSICAL ELECTRONICS Prof. W. B. Nottingham L. E. Sprague C. J. Marcinkowski R. Steinberg W. E. Mutter M. Wilkinson A. ELECTRON-EMISSION PROBLEMS 1. Work Functions and Electrical Conductivity of Oxide-Coated
More information