Wafer Thinning Using a Versatile, State-of-the-Art Single Wafer Processor

Transcription

1 Wafer Thinning Using a Versatile, State-of-the-Art Single Wafer Processor October 7, 2014 Semiconductor Equipment Company DAINIPPON SCREEN MFG. CO., LTD. By Mark Goeke Product Manager Dainippon SCREEN (Deutschland) GmbH 1

2 Dainippon SCREEN Mfg.Co. Headquarters: Kyoto, Japan Foundation: Oct. 11, 1943 CEO: Akira Ishida COO: Eiji Kakiuchi Employees: 4,968(Consolidated) 2,228(Non-consolidated) (Fiscal year ended March 31, 2014) Revenues: (Fiscal year ended March 31, 2014) 240 billion (Consolidated) 191 billion(non-consolidated) White Canvas Rakusai (Rakusai Plant) Process Technology Center (Hikone Plant) Media & Precision 22.1% PCB related 3.5% Grafic Arts Equipm. 18.6% FPD Equipm. 8.4% Others 0.4% Semiconductor Equipment 69.1% Fab. FC-1, FC-2 (Hikone Plant) Taga Plant 2

3 Wafer Size DRAM Integration (bit/chip) Min Line Width (nm) 5inch 6inch 8inch 64k 256k 1M 4M 16M 64M 256M 1G 4G 16G History SWC Tools Φ300mm 16k 300mm SU-3000 SU SS-3000 SS-3100 SR-3000 MP-3000 SU-3100 ~Φ200mm NEW AS-2000 MP-2000 SCW-421 D-Spin636 SP-W612 SP-W813 SSW60A/80A SR-2000 SU-2000 Dec SS-80BW-AR 3

4 Frontier Product Line Up CW-1500 Compact Wet Station DW-3000 Direct Imager 3D Packaging Green Devices ZI-2000 Patterned Defect Inspection SU-2000 Single Wafer Processor 4

5 SU-2000 Single Wafer Processor In all areas of the electronics industry, technologies and products designed to reduce enviromental impact, known as green devices, are receiving attention. Demand has increased for power semiconductors, MEMS and backside illuminated image sensors (BIS). In response to these market trends, Dainippon Screen launched it s Frontier project in 2010 to develop manufacturing equipment for the green device market. As it s fourth product within this line-up, Dainippon Screen is proud to present the SU-2000, a single wafer processor, ideally suited for green device manufacturing. 200 mm SU-2000 is built on SCREEN s experience with advanced etching/cleaning tools translated to GREEN device applications. Ideal for many kinds of 200mm, small lot-size processes in high mix production environments. Offering advantages of single wafer cleaning: Different processing of front- and backside, Possibility to use or mix always fresh chemicals & water, Flexibility to easily change cleaning sequence, Short cycle time. 5

6 SU-2000 Process Applications Thin wafer cleaning Both side cleaning for thin wafer High particle removability No metal contamination Water mark less dry Si etching Hybrid chuck Multifunctional chemical cabinet In-situ monitor Good etching uniformity In-situ thickness measuring Chemical control Critical cleaning High particle removability No metal contamination Drying without water marks Shield plate Nanospray Unique cup structure Post-cleaning SPM capability Up to three different chemical treatments in one chamber 6

7 SU-2000 Flexibility 2 Chamber Configuration 4 Chamber Configuration 7

8 Fundamentals - Wet Etching of Si Isotropic Si etch: HNA HF/Nitric/Acetic Acid Oxidation: Si + 4HNO 3 SiO 2 + 4NO 2 + 2H 2 O Complex building: SiO 2 + 6HF 2H + + SiF H 2 O Replacing water with acetic acid (dielectric constantε r = 6.15) leads to lower dissociation of HNO 3 and better wettability of hydrophocic Si surface For use in single wafer processors, CH 3 COOH is replaced with more viscous Phosphoric/Sulfuric acid mixtures, which do not alter the reaction kinetics, but increase the mass transfer resistance [1] [1] L. Mauer, J. Taddei, R. Youssef, The Role of Wet Etching in Silicon Wafer Thinning Compound Semiconductor. 8

9 Stress Relief Si Etch Why is Si back-side etch needed? o Wafer grinding causes damage layer o Damage layer thickness: 1-30µm o Si back-side etching to remove the damage layer Grinded Wafer back-side Damage layer Device-side Si back-side etching 9

10 Summary: SU-2000 Concept & Features Wide Range of Applications Critical Cleaning/ Si Etch/ Post Cleaning/ BEOL Cleaning, etc Good Process Performance PRE: 95%, 100% (DNA from high end 300mm tool) Compact All in one concept Good Productivity Max 150wph w/ 4 chamber configuration 10

11

12