SEMEEE3-08 Monitoring and analysing data from semiconductor processes

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1 Monitoring and analysing data from semiconductor processes Overview This standard identifies the competences you need to monitor and analyse data from semiconductor manufacturing processes, in accordance with approved procedures. You will be required to access the appropriate specifications, to check that they are of the latest issue and to extract all necessary information, in order to monitor and analyse data from a wafer fabrication or die assembly and test process. You will be expected to use approved organisational procedures to collect and analyse the semiconductor process data and to present this in an approved format. You will also be expected to produce reports of your monitoring and analysis of data (which may include functional D, process yield, process capability (Cpk), cycle time), which was collected using appropriate tools and methods (such as statistical process control (SPC) and failure mode and effect analysis (FMEA)). Your responsibilities will require you to comply with organisational policy and procedures for the monitoring and analysing semiconductor processes and to report any problems with these activities that you cannot personally resolve, or are outside your permitted authority, to the relevant people. You will be expected to work with a minimum of supervision, taking personal responsibility for your own actions and for the quality and accuracy of the work that you carry out. Your underpinning knowledge will provide a good understanding of your work and will provide an informed approach to applying monitoring/analysis procedures to semiconductor manufacturing processes. You will understand the organisational requirements and procedures for monitoring and analysing data and their application and you will know about the specific semiconductor process being monitored, in adequate depth to provide a sound basis for carrying out the activities to the required specification. You will understand the safety precautions required when working in a semiconductor-processing environment and with the equipment that is used. You will be required to demonstrate safe working practices throughout and will understand the responsibility you owe to yourself and others in the workplace. 1

2 Performance criteria You must be able to: P1 work safely in accordance with the regulations for your work environment P2 ensure that you have the necessary test data on which to conduct the analysis P3 resolve promptly any inconsistencies in the data P4 analyse the data using approved methods and procedures P5 check that the data analysis is accurate and thorough and takes account of the test conditions P6 compare the analysis against the product or asset specification and identify any faults or variations from specification P7 record the results of the analysis in the appropriate format 2

3 Knowledge and understanding You need to know and understand: K1 the specific safety precautions to be taken when undertaking monitoring/analysis of semiconductor processes K2 the personal protective equipment (PPE) to be worn whilst carrying out the monitoring and analysis activities (such as protective suits, gloves, eye protection) K3 the hazards associated with working in a semiconductor processing environment (such as heat, radiation, chemicals, electrostatic discharge (ESD)) and how to minimize them K4 the correct use of electrostatic discharge (ESD) equipment (such as mats, earthing points and straps) K5 how to obtain the necessary authority to enter the relevant work areas and any specific permit-to-work procedures that are used K6 how to obtain and use specifications for the product, assets or processes being monitored/analysed K7 the basic operating principles of other semiconductor processes and how they relate to the particular area in the process being monitored and analysed K8 related processes in other areas of a semiconductor facility undertaking wafer processing and die assembly/test processes K9 the tools, methods and techniques used to monitor and analyse semiconductor processes and how to use them for the process being monitored and analysed (such as statistical process control (SPC), failure mode effect analysis (FMEA)) K10 how to explain the terms and how to calculate mean, median, mode, standard deviation, range and variance K11 how to explain and calculate process capability (Cp and Cpk) K12 the meaning of a failure mode, failure effect or failure cause K13 the rating scale used in potential failure modes and effects projects (to include the severity rating scale, the occurrence rating scale and the detection rating scale) K14 how to calculate and use risk priority numbers (RPN) K15 how to carry out a design of experiment project and the tools and techniques used K16 where to obtain the data required to carry out the design of experiment K17 how to calculate the sample size to be used in the design of experiment K18 what is meant by Alpha risk and Beta risk K19 the formats and levels of detail required for recording and preparing reports for the relevant categories of data being monitored/analysed K20 suitable methods for the presentation of data (such as in tables, charts, graphically) K21 how and why experiments are designed and implemented and by whom K22 the problems that can occur with the data monitoring and collection 3

4 activities and how they can be avoided K23 sources of expert help when you have problems with the activities that you cannot resolve or are outside your permitted authority K24 the extent of your own responsibility and whom you should report to if you have problems that you cannot resolve 4

5 Additional Information Scope/range related to performance criteria You must be able to: 1. carry out all of the following during the data monitoring and analysis activities: 1.1 use the correct issue of drawings, job instructions and specifications 1.2 follow risk assessment procedures and COSHH regulations 1.3 follow clean room/work area protocols 1.4 carry out all activities in line with organisational procedures 1.5 store records of the data analysis in accordance with appropriate procedures 2. monitor and analyse data for one of the following wafer processing or die assembly/test area processes: 2.1 photolithography 2.2 final inspection/probe 2.3 mould 2.4 etching (wet/dry) 2.5 wafer saw 2.6 trim/form 2.7 diffusion 2.8 die fix 2.9 debled mark/plate 2.10 deposition 2.11 wire bond 2.12 test 2.13 implantation 2.14 other process (specify) 3. use monitoring and analysis methods and procedures which satisfy all of the following: 3.1 quality requirements (such as statistical process control (SPC), failure mode effect analysis (FMEA)) 3.2 the frequency of the monitoring and analysis required 3.3 the aspects, characteristics and complexity of data being monitored/analysed (such as functional D, process yield, process capability (Cpk), cycle time) 3.4 applying various designed experiments 4. present reports of activities by the following methods: 4.1 verbally Plus one other method from the following: 4.2 electronic mail 5

6 4.3 computer based presentation 4.4 written/typed report 4.5 other appropriate media (such as web based tools) 5. prepare reports for monitoring/analysis purposes, which include three of the following: 5.1 customer reports 5.2 design of experiments 5.3 manufacturing data 5.4 process control data 5.5 quality control data 6

7 Developed by SEMTA Version number 2 Date approved February 2013 Indicative review date Validity Status Originating organisation Original URN Relevant occupations February 2018 Current Original SEMTA Engineering technicians; Engineering and manufacturing technologies; Engineering; maintenance team technician; manufacturing technologies; production and process engineers Suite Electrical and Electronic Engineering Suite 3 Key words Engineering; electrical; electronic; monitor; analyse; data; semiconductor; wafer fabrications; die assembly; die test; process; specification 7