S P E C I F I C A T I O N S GW7MMC**GSC

Transcription

1 25W Ra80 SPM series Spec No. Issue DG-14Y Nov-14 S P E C I F I C A T I O N S Product Type LED module Model No. GW7MMC**GSC ** : 30, 40 These specifications contain 17 pages including the cover and appendix. If you have any objections, please contact us before issuing purchasing order. CUSTOMERS ACCEPTANCE DATE: BY: Preliminary PRESENTED BY: T. Uemura Dept. General Manager REVIEWED BY: PREPARED BY: M.Ikeuchi H.Koizumi Development Department Ⅱ Lighting Device Division Electronic Components And Devices Group SHARP CORPORATION

2 Model No. GW7MMC**GSC Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions. (1) Please do verify the validity of this part after assembling it in customer s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph (3), even for the following application areas, be sure to observe the precautions given in Paragraph (3). Never use the products for the equipment listed in Paragraph (4). Office electronics Instrumentation and measuring equipment Machine tools Audiovisual equipment Home appliances Communication equipment other than for trunk lines (3) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. Control and safety devices for airplanes, trains, automobiles, and other transportation equipment Mainframe computers traffic control systems Gas leak detectors and automatic cutoff devices Rescue and security equipment Other safety devices and safety equipment, etc. (4) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. Aerospace equipment Communications equipment for trunk lines Control equipment for the nuclear power industry Medical equipment related to life support, etc. (5) please direct all queries and comments regarding the interpretation of the above four Paragraphs to a sales representative of the company. Please direct all queries regarding the products covered herein to a sales representative of the company.

3 GW7MMC**GSC 1 of 15 GW7MMC**GSC specifications 1. Application These specifications apply to the light emitting diode module Model No. GW7MMC**GSC. [ COB_LED (InGaN Blue LED chip + Phosphor) ] Main application : Lighting (features) 2,700 lm class light source included Ready to use LED module Low profile structure (Already attached Thermal Interface Material) Easy to connect by poke-in connector 2. External dimensions and equivalent circuit Refer to Page Ratings and characteristics Refer to Page Absolute maximum ratings 3-2. Electro-optical characteristics 3-3. Derating curve 4. Reliability Refer to Page Test items and test conditions 4-2. Failure criteria 5. Quality level Refer to Page Applied standard 5-2. Sampling inspection 5-3. Inspection items and defect criteria 6. Supplements Refer to Page Chromaticity rank table 6-2. Packing 6-3. Label 6-4. Indication printed on product 7. Precautions Refer to Page Characteristics diagram (TYP.) Refer to Page 15.

4 3.40 (0.7)* DG-14Y025 GW7MMC**GSC 2 of External dimensions and equivalent circuit Unit = mm Top View (Φ19) Φ44 Φ3.1 (M3 screw holes) LED emission area (COB_LED) (Tc measure point window) 35.0 Side View Thermal Inferfacing Material(TIM) sheet 2 1 (poke-in connector holes) Tolerance ±0.5mm unless stated otherwise Shipped as LED Module including holder,cob_led and TIM sheet * Including TIM protection film and protrusion of COB_LED (Note) Values inside parentheses are reference values. Terminal connections 1 +terminal 2 -terminal (Note) 12 series 7 parallel = 84 pcs of LEDs Unit Material Weight Main body:pbt TIM : Phase Change Material mm External connection:poke-in ( 10 g ) LED surface:silicone resin (Tin plating) Drawing No

5 GW7MMC**GSC 3 of External dimensions and equivalent circuit(continued) Rear View Unit = mm 20 Protection film peeling edge (Red line) Φ3.1 (M3 screw holes) TIM sheet with protection film (Φ43) COB_LED (Under TIM sheet) Perspective View 35.0 Tolerance ±0.5mm unless stated otherwise Shipped as LED Module including holder,cob_led and TIM sheet (Note) Values inside parentheses are reference values. Unit Material Weight Drawing No. Main body:pbt TIM : Phase Change Material mm External connection:poke-in ( 10 g ) LED surface:silicone resin (Tin plating)

6 GW7MMC**GSC 4 of Ratings and characteristics 3-1. Absolute maximum ratings Item Symbol Rating Unit Power Dissipation *1 P 40.4 W Forward Current *1 I F 1050 ma Reverse Voltage *2 V R -15 V Operating Temperature *3 T opr - 30 ~ Storage Temperature T stg - 40 ~ Junction Temperature Tj 145 *1 The LED Case Temperature (Tc) must be maintained within the limits defined by the derating curve (Section 3-3). *2 The LED is not designed to withstand a permanent Reverse Voltage. The value stated here only applies to momentary voltages resulting from improper connection of the LED. *3 Operating temperature is the Case temperature Tc. Refer to Section 3-3 for Tc measurment location. The Forward Current must be maintained within the limits defined by the derating curve (Section 3-3).

7 GW7MMC**GSC 5 of Electro-optical characteristics (T j = 90 ) ** Item Symbol Condition MIN TYP MAX Unit common Forward Voltage *5 V F I F = 700 ma 32.5 (35.0) 38.5 V Luminous Flux *6 Ф (2 900) lm x - ( ) - - Chromaticity Coordinates *7 30 y I F = 700 ma - ( ) - - Color Temperature - - (3 000) - K General Color Rendering Index *8 Ra 80 (82) - - Luminous Flux *6 Ф (3 100) lm x - ( ) - - Chromaticity Coordinates *7 40 y I F = 700 ma - ( ) - - Color Temperature - - (3 980) - K General Color Rendering Index *8 Ra 80 (82) (After 20 ms drive, Measurement tolerance: ± 3 %) 7 Monitored by Sharp's 1m integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 10 %) 8 Monitored by Sharp's 1m integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 0.005) 9 Monitored by Sharp's 1m integrating sphere and Otsuka electronics MCPD-LE3400 (After 20 ms drive, Measurement tolerance: ± 2)

8 Forward Current IF [ma] DG-14Y025 GW7MMC**GSC 6 of Derating curve 1200 Forward Current Derating Curve Case Temperature Tc [ ] (Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to be secured by using an adequate heat sink. Please ensure the maintenance of heat radiation does not exceed case temperature over the rating in operation. Please take note of the following, when measuring case temperature Tc. The LED module mounting surface should be flat/plain surface. You have to set the bottom of LED module faced in parallel with the heat sink surface. And then optimal screw torque is requred that TIM thickness is to be less than 100um for good thermal spread. When measure the case temperature,please use the Tc point. When measuring Tc, make sure the temperature on LED module is uniform. Tc measuring point Thermal Resistance:1.8 /W (Typical value of Tc to Tj)

9 GW7MMC**GSC 7 of Reliability The reliability of products shall be satisfied with items listed below Test items and test conditions Confidence level: 90 % No. Test item Test conditions Samples Defective LTPD n C (%) 1 Temperature Cycle - 40 (30 min) ~ (30 min), 100 cycles Steady State Operating Tc = 90, IF = 700mA, Time = 1000 h Life Shock Acceleration: 7000 m/s 2, Pulse width: 0.5 ms Direction: 3 directions (X, Y and Z) 3 trials in each direction Vibration Frequency: 100 to 2000 Hz for 4 minutes per trial Acceleration: 200 m/s 2 Direction: 3 directions (X, Y and Z) 4 trials in each direction Failure criteria No. Parameter Symbol Failure criteria 1 Forward Voltage V F V F > Initial value Luminous Flux Ф Ф< Initial value 0.7

10 GW7MMC**GSC 8 of Quality level 5-1. Applied standard ISO Sampling inspection A single normal sampling plan, level S Inspection items and defect criteria No. Item Defect criteria Classification 1 No radiation No light emitting Major defect 2 Electro-optical Not conforming to the specification characteristics (Forward voltage, Luminous flux and Chromaticity values) 3 External Not conforming to the specified dimensions dimensions 4 Appearance Nonconformity observed in product appearance is determined Minor as defective only when electro-optical characteristics is affected by. defect <If any question arises regardless of above mentioned criterion> Foreign material, scratch, or bubble at emitting area: 0.8 mm φ Fiber generation at emitting area: 0.2 mm in width and 2.5 mm in length AQL (Note) Products with removable foreign material attached on are not determined to be defective.

11 y DG-14Y025 GW7MMC**GSC 9 of Supplements 6-1. Chromaticity rank table (Tolerance: x,y ± 0.005) (I F = 700 ma, T j = 90 ) **: 30 (3000K model) Rank 1 Range Chromaticity coordinates Point 1 Point 2 Point 3 Point 4 x y Chromaticity Diagram K 3000K 2900K x

12 y DG-14Y025 GW7MMC**GSC 10 of 15 **: 40 Rank 1 (4000K model) Range Chromaticity coordinates Point 1 Point 2 Point 3 Point 4 x y (Tolerance: x,y ± 0.005) (I F = 700 ma, T j = 90 ) Chromaticity Diagram K 4000K 3800K 4100K 3900K x

13 6-2. Packing One tray composed of 20 pieces 5 trays (100 pieces) and one upper lid-plastic corrugated board in one moisture-proof bag 2 bags (200 pieces) in one carton Dimensions of outer carton: mm (Reference value) (Note) State of packing is subject to change. <Outer carton> <One bag> 100 pieces 2 bags = 200 pieces 20 pieces 5 trays = 100 pieces and lid-corrugated board DG-14Y025 GW7MMC**GSC 11 of 15 Temporary <One tray> 4 5 = 20 pieces (345mm) (225mm)

14 GW7MMC**GSC 12 of Label 1)Outer carton Following label is attached on outer carton. SHIPMENT TABLE PART No.GW7MMC**GSC QUANTITY. 200 (GW7MMC**GSCx) LOT No. XX13A01 RANK 1 SHARP CORPORATION MADE IN XXXXXXXXXX SHARP LABEL R.C 2)Moisture-Proof bag Following label is attached on moisture-proof bags. SHIPMENT TABLE PART No.GW7MMC**GSC (GW7MMC**GSCx) QUANTITY. 200 RANK 1 LOT No. XX31G01001A SHARP CORPORATION MADE IN XXXXXXXXXX SHARP LABEL R.C Model number (Model number + suffix code) Quantity Lot No. Rank Production country MADE IN JAPAN MADE IN INDONESIA Model number (Model number + suffix code) Quantity and rank Lot No. Bar code Production country MADE IN JAPAN MADE IN INDONESIA 1) Lot No. indication X X 1 4 A Production plant code A 2 Shipping year(year last 2 digits) 3 Shipping month (from January to December in ABC order) 4 Shipping date(01~31) 1) Lot No. indication X X 4 1 G A Production plant code B 2 Shipping year(year last digit) 3 Shipping month (1~9 or O, N, D) 4 Fixed code G 5 Shipping date(01~31) 6 Serial No. 7 Backup code A 6-4.Indication on product Printed label is attached on the product. Label Size:10x5mm 1) Model No. Abbreviated Model No. "7MMC**GS" is indicated. ** : 30, 40 2) Control No. Indicated as follows; xx 1 4 J Production plant code 2 Year of production (the last two figures of the year) 3 Month of production (to be indicated alphabetically with January corresponding to A) 4 Date of production (01~31) 5mm Model No. Control No. Example 7MMC * *GS SA14 J12 Model No. Control No. Letter Size:1mm 10mm

15 GW7MMC**GSC 13 of Precautions 1 Storage conditions Following storage conditions should be obeyed before and after opening aluminum moisture proof bag: Before opening: Temperature 0 ~ 40, Relative humidity less than 90 % After opening: Temperature 5 ~ 30, Relative humidity less than 60 % This product should be used within a year of delivery. After opening, the LED module should be kept in an aluminum moisture proof bag with a moisture absorbent material (silica gel). Avoid exposing to air with corrosive gas. 2 Usage conditions This product is not designed for the use under any of the following conditions. Please carefully check the performance and reliability well enough in case of using under any of the following conditions; In a place with a lot of moisture, dew condensation, briny air, or corrosive gas. (Cl, H 2 S, NH 3, SO 2, NO X, Br etc.) Under the direct sunlight, outdoor exposure, or in a dusty place. In water, oil, medical fluid, or organic solvent. Please do not use component parts like rubber which may contain sulfur (gasket packing, adhesive material, etc.). Please note that any strong acidic or alcoholic elements could effect the silicon resin used in the LED module. The heat and light released from the LED module, could generate halogen gas from the surrounding materials, which may have adverse impact on the module. Before using please carefully conside this issue. 3 Heat radiation and Installation Operating the LED unit without an adequate thermal solution will cause damage to the LED module. Please always use an appropriately specified heat sink to avoid excessive LED junction temperatures. The size and specification of heat sink required are strongly dependent on the design and operating environment of the final application. Therefore it is up to the customer to determine an appropriate thermal solution. If there is any crack line along the COB_LED outline in TIM, you can use that module. Before facing and mouinting the LED module on the heat sink, you have to remove the protection film of TIM sheet. The LED module must be secured to the heat sink using two customer-supplied M3x4(Minimum depth) mounting screws. Each mounting screws should be tightened to a torque between 0.4 to 0.6Nm. The surface of the heat sink on which LED module will be mounted must be flat and free from scratches and debris. If the surface of the heat sink is not flat (e.g. convex), thermal resistance will increase, and thus decreases heat dissipation, potentially leading to over-heating and ultimately failure of the LED. Moreover, any foreign materials on the surface may also cause same problems. Therefore, check that the mating surface of the LED module and heat sink are clean with out any foreign materials on the surface. Make sure the LED module is flat against the heat sink surface. The TIM thickness will be below 100µm at optimal torque allowing good thermal spread. 4 Handling Do not touch resin part (including white resin part) on the surface of LED module. Any external stress on the resin part could damage the resin, or damage the wire connections underneath, and may lead to module failure. Please hold the side part of the holder when mounting the LED module. Design in such a way that no stress will continuously apply on to the LED module after installment.

16 GW7MMC**GSC 14 of 15 5 Connecting method (Refer to Application note) This LED module contains poke-in wire connectors. This LED module accepts stranded,solid or fused wire sizes 22,20,18 AWG. The wire must be stripped 10-12mm to insert it in the connector. Do not use over stripped wire because the wire conductor may contact the heat sink and short. Arrange the wire layout to avoid pulling the wires out. This puts stress on the poke-in connector. 6 Replacemant and Repair The LED holder can be removed from the heat sink by removing the customer-supplied mounting screws. We recommend you remove the COB_LED from the TIM under high temperature.(avove 50 ) Defective or damaged LED module must not be used.the LED module must not be re-used by removing the wires. If you are forced to replace the module, refer to 'Application Note' and follow it's procedure. 7 Static electricity This product is a device that is sensitive to electrostatic discharge. Please use an antistatic wrist band when handling. Install circuit protection device to drive circuit, if necessary. 8 Drive method When the LED is in operation or not in operation, avoid applying reverse voltage. In this product, LED chips are connected in both series and parallel. LED voltage will decline with increasing temperature. Therefore, do not use constant voltage power supplies as current may increase beyond safe limits. A constant current power supply is strongly recommended. Be cautious while turning on/off the power supply, as an excess current, excess voltage or reverse voltage may applied. Do not connect this product in parallel. 9 Cleaning Avoid cleaning the LED module, since silicone resin may be eroded. 10 Color-tone variation Chromaticity of this product is monitored by integrating sphere right after the operation. Chromaticity varies with measuring method, light spread condition, and ambient temperature. Please verify conditions before use. 11 Safety Looking directly at LEDs for a long time may result in hurting your eyes. Excess current or nearby combustible materials can cause abnormal heat generation, smoke, or fire. Please confirm the safety standards or regulations of application devices. 12 Other cautions Do not dismantle and reassemble this product. This could degrade the heat dissipation performance, and also loosen the whole unit. Guarantee covers the compliance to the quality standards mentioned in the specifications. However it does not cover the compatibility with application of the end-use, including assembly and usage environment. In the case any quality problems occurred in the application of end-use, details will be separately discussed and determined between the parties. Please consult a nearby Sharp representative if you have any other questions. Do not drop the LED module.

17 Relative Luminous Flux [%] Forward Voltage V F [V] Relative Luminous Flux [%] Forward Current I F [ma] DG-14Y025 GW7MMC**GSC 15/15 8. Characteristics diagram (TYP.) Forward Current vs. Relative Luminous Flux Forward Voltage vs. Forward Current 160 T j = T j = Forward Current I F [ma] Forward Voltage V F [V] Case Temperature vs. Relative Luminous Flux Case Temperature vs. Forward Voltage 120 I F = 700 ma 41 I F = 700 ma Case Temperature T c [ ] Case Temperature T c [ ] (Note) Characteristics data shown here are for reference purpose only. (Not guaranteed data)