Current Standards Flex-Rigid

Transcription

1 Current Standards Flex-Rigid Würth Elektronik Circuit Board Technology Webinar April 17th, 2018 Speaker: Andreas Schilpp page

2 agenda WHY Flex-Rigid? Hierarchy of Specifications WE Standards Flex-Rigid Standards for EDA Tools Seite 2

3 Introduction: Integration of Module Wiring The Advatages of Flex-Rigid Reliability dynamical Bending Signal Integrity Miniaturisation Seite

4 Application Starting Situation Power Board 8 layers FR4 Connector Board 10 layers FR4 contr. Impedance FPGA Board 16 layers high Tg FR4 contr. Impedance Sensor Board 10 layers FR4 contr. Impedance picture as example Product Management Page 4

5 Application Approach: Flex-rigid xri-4f-xri Power Board 14 layers high Tg FR4 contr. Impedance Connector Board 14 layers high Tg FR4 contr. Impedance FPGA Board 14 layers high Tg FR4 contr. Impedance Sensor Board 14 layers high Tg FR4 contr. Impedance Product Management Page 5

6 Application Solution: Flex-rigid 4Ri-4F-4Ri Power Board 12 layers high Tg FR4 contr. Impedance Connector Board 12 layers high Tg FR4 contr. Impedance FPGA Board 12 layers high Tg FR4 contr. Impedance Sensor Board 12 layers high Tg FR4 contr. Impedance source: ANDOR Miniaturization, Performance, Testability Product Management Page 6

7 agenda WHY Flex-Rigid? Hierarchy of Specifications WE Standards Flex-Rigid Standards for EDA Tools Seite 7

8 Hierarchiy of Specifications Customer PCB Specification General Customer Specification IPC Standards WE Standard: class 2 for example: Acceptability of Printed Boards: IPC-A-600 Material Design: IPC-2223 Qualification and Performance Spec: IPC-6013 General WE PCB Specification Seite 8

9 IPC Standards Classification according IPC Class1 includes limited life products suitable for applications where the requirement is function of the cpmpleted product. Class 2 includes products where continued performance and extended life is required; and for which uninterrupted service is desired but not critical. Class 3 includes products where continued high performance or performance-on-demand is critical, product down-time cannot be tolerated, and the product must function when required Seite 9

10 Design Chain electronic system development a pcb is a complex construction made out of many different materials, produced using a variety of processes for getting tailored functionality! stated conditions Specification page 10

11 agenda WHY Flex-Rigid? Hierarchy of Specifications WE Standards Flex-Rigid Standards for EDA Tools Seite 11

12 Overview Standards IPC Standards General WE PCB Specification Flex-Rigid Design Guide Semiflex Design Rules Flex / TWINflex Stack-up Plans - Standards - customer specific 1F-xRi xri - 2F - xri 2F-xRi page 12

13 New Revision IPC Standard NEW in IPC-2223D - with a grey background - complicated formula before - now estimation bend ratio radius : thickness - flex-to-install: - new Revision Design Guide - new Revisions Design Rules use B: dynamic bending - 1F: 100:1-2F: 150:1 - Multilayer: not recommended! Seite 13

14 New Revision Flex-Rigid Design Guide Corrected and extended Formula: Seite 14

15 New Revision Flex-Rigid Design Guide NFP Non Functional Pads added Seite 15

16 NFPR Non Functional Pad Removal WHY? VdL-Publication Fertigungsgerechtes Design, 1998 FED / VdL Recommendation, Seite 16

17 Why do we need annular rings? Layout / Screen: IPC-A-600H: Real life page 17

18 NFPR Non Functional Pad Removal WHY? Reduction of crosstalk more place on inner layers for routing? NO! NFPR does NOT spend more place on inner layers! Design Rule Check must be performed prior to NFP Removal! Seite 18

19 NFPR Non Functional Pad Removal Special caseflex-rigid: Drilling of Polyimide Cleaning and Plating of Polyimide Examples with flexible layers inside Seite 19

20 Structure of 3D Design Rules Application definition, stack-up examples Basic Information Bending Radii Processing Conditions Material Specifications Link to Standard Stack-up s Definition Standard specific Layout Parameters additionally for Semiflex: Tipps for Bending and Fastening all Design Rules have been revised Internet as guided Documents Revision! page 20

21 Design Rules Flex-Rigid Spacing Vias / Pads Most common Mistake: Standard Rules Item G not regarded Spacing Vias to Flex-Rigid Transition IPC-2223: Distance to the Via Pad! page 21

22 Design Rules Flex-Rigid Distance Vias / Pads Seite 22

23 Seite 23 Standard Stack-up Flex-Rigid Base material Standard 1F-xRi stack-up Rigid: FR4 Tg 150 C, halogen free, filled Flex: Polyimide Tg > 200 C, typ. 50µm thick soldermask, flexible soldermask partially in bending area Inner layer copper thickness: 18µm

24 Seite 24 Standard Stack-up Flex-Rigid Base material Standard xri-2f-xri stack-up Rigid: FR4 Tg 150 C, halogen free, filled Flex: Polyimide Tg > 200 C typ. 50µm thick soldermask, Polyimide Coverlay partially in bending area (BIKINI) Inner layer copper thickness: 18µm

25 Standard Stack-up plans Flex-Rigid Internet Seite 25

26 agenda WHY Flex-Rigid? Hierarchy of Specifications WE Standards Flex-Rigid Standards for EDA Tools Seite 26

27 Design Guide and Design Rules Rules from Flex-Rigid Design guide and from Design Rules must be transferred into Constraint Manager time consuming risk oferror Current Project: Implementation of Flex-Rigid Design Rules into several EDA-Tools Start with Allegro / OrCAD Altium Seite 27

28 Standard Stack-up Plans Flex-Rigid Project: Templates for EDA Tools Allegro / OrCAD until May 2018 Altium IPC-2581 Data Format for Import into additional EDA Tools WE Layer Stack-up Allegro / OrCAD Cross Section Editor Seite

29 Summary Improvement of Reliability by using Flex-Rigid But also: Improvement of Reliability of Flex-Rigid PCBs by using Standards Regarding Design Rules saves Manufacturability and Reliability Implementation of Stack-ups and Design Rules in EDA Tools will reduce Risk of Failures and will improve Productivity More Information in our June-Webinar (EDA Tools) and in our Webinar Archive! Seite 29

30 Thank you very much for your attention!