REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED. D Update drawing to meet current MIL-PRF requirements. glg Charles Saffle

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1 REVISIONS LTR ESCRIPTION ATE (YR-MO-A) APPROVE A Added case outline letter Y. Added CAGE numbers 6Y440 and for devices 01 through 04. Editorial changes throughout M. A. Frye B Changes in accordance with NOR 5962-R M. A. Frye C Boilerplate update, part of 5 year review. ksr Raymond Monnin Update drawing to meet current MIL-PRF requirements. glg Charles Saffle THE ORIGINAL FIRST OF THIS RAWING HAS BEEN REPLACE. REV REV REV STATUS REV OF S PMIC N/A MICROCIRCUIT RAWING THIS RAWING IS AVAILABLE FOR USE BY ALL EPARTMENTS AN AGENCIES OF THE EPARTMENT OF EFENSE AMSC N/A SCC FORM 2233 PREPARE BY Kenneth S. Rice CHECKE BY Charles Reusing APPROVE BY A icenzo RAWING APPROVAL ATE LA LAN AN MARITIME MICROCIRCUIT, MEMORY, IGITAL, CMOS, 256K X 1 STATIC RAM (SRAM) LOW POWER, MONOLITHIC SILICON A CAGE COE OF E373-15

2 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-ST-883 compliant, non-jan class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: L A rawing number evice type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) evice type(s). The device type(s) identify the circuit function as follows: evice type Generic number 1/ Circuit function Acess time K X 1 low power CMOS static ram 35 ns K X 1 low power CMOS static ram 45 ns K X 1 low power CMOS static ram 55 ns K X 1 low power CMOS static ram 70 ns Case outline(s). The case outline(s) are as designated in MIL-ST-1835 and as follows: Outline letter escriptive designator Terminals Package style L GIP3-T24 or CIP4-T24 24 dual-in-line package X CQCC3-N28 28 rectangular chip carrier package Y CFP4-F28 28 flat package Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage on any input relative to V SS V dc to +7.0 V dc Voltage applied to Q V dc to +6.0 V dc Storage temperature range C to +150 C Maximum power dissipation (P ) W Lead temperature (soldering, 10 seconds) C Thermal resistance, junction-to-case (Θ JC ): Cases L, X, and Y See MIL-ST-1835 Junction temperature (T J ) C 2/ 1.4 Recommended operating conditions. Supply voltage range (V CC ) V dc to 5.5 V dc Supply voltage range (V SS ) V dc Input high voltage (V IH ) V dc to +6.0 V dc Input low voltage (V IL ) V dc to +0.8 V dc Case operating temperature range (T C ) C to +125 C 1/ Generic numbers are listed on the Standard Microcircuit rawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HBK / Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-ST-883. V IL minimum = -3.0 V dc for pulse width less than 20 ns. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 2

3 2. APPLICABLE OCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. EPARTMENT OF EFENSE SPECIFICATION MIL-PRF Integrated Circuits, Manufacturing, General Specification for. EPARTMENT OF EFENSE S MIL-ST Test Method Standard Microcircuits. MIL-ST Interface Standard Electronic Component Case Outlines. EPARTMENT OF EFENSE HANBOOKS MIL-HBK MIL-HBK List of Standard Microcircuit rawings. Standard Microcircuit rawings. (Copies of these documents are available online at or from the Standardization ocument Order esk, 700 Robbins Avenue, Building 4, Philadelphia, PA ) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non- JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL- PRF may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL- PRF is required to identify when the QML flow option is used. 3.2 esign, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein Case outlines. The case outlines shall be in accordance with herein Terminal connections. The terminal connections shall be as specified on figure Truth table. The truth table shall be as specified on figure ie overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-ST-883). The frequency of the internal water vapor testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements as provided by MIL-PRF for classes Q and V. Samples may be pulled any time after seal. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 3

4 Test Symbol TABLE I. Electrical performance characteristics. Conditions -55 C T C +125 C V CC = 4.5 V to 5.5 V V SS = 0 V Group A subgroups evice type unless otherwise specified Min Max Operating supply current I CC1 t AVAV = t AVAV (minimum), 1, 2, 3 All 100 ma 1/ V CC = 5.5 V, CE = V IL, all other inputs at V IL Standby power supply I CC2 CE V IH, all other inputs 1, 2, 3 All 25 ma current, TTL 1/ V IL or V IH, V CC = 5.5 V, f = 0 MHz Standby power supply I CC3 CE (V CC -0.2 V), f = 0 MHz, 1, 2, 3 All 3 ma current, CMOS 1/ V CC = 5.5 V, all other inputs 0.2 V or (V CC -0.2 V) ata retention current 1/ I CC4 V CC = 2.0 V 1, 2, 3 All 900 µa Limits Unit Input leakage current, I ILK V CC = 5.5 V, 1, 2, 3 All ±10 µa any input V IN = 0 V to 5.5 V Off-state output leakage I OLK V CC = 5.5 V, 1, 2, 3 All ±10 µa current V IN = 0 V to 5.5 V ata retention voltage V R V IN 0.2 V or (V CC V), 1, 2, 3 All 2.0 V CE (V CC V) Output high voltage V OH I OUT = -4.0 ma, V CC = 4.5 V, 1, 2, 3 All 2.4 V V IL = 0.8 V, V IH = 2.2 V Output low voltage V OL I OUT = 8.0 ma, V CC = 4.5 V, 1, 2, 3 All 0.4 V V IL = 0.8 V, V IH = 2.2 V Input capacitance C IN V IN = 0 V 4 All 10.0 pf f = 1.0 MHz, T C = +25 C, See 4.3.1c Output capacitance C OUT V O = 0 V 4 All 12.0 pf f = 1.0 MHz, T C = +25 C, See 4.3.1c See footnotes at end of table. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 4

5 Test TABLE I. Electrical performance characteristics continued. Symbol Conditions 2/ -55 C T C +125 C V CC = 4.5 V to 5.5 V, V SS = 0 unless otherwise specified Group A subgroups evice type Chip enable access time t ELQV See figure 4 9, 10, ns Read cycle time t AVAV See figure 4 9, 10, ns Address access time t AVQV See figure 4 4/ 9, 10, ns Output hold after address t AVQX See figure 4 9, 10, 11 All 3.0 ns change Chip enable to output t ELQX See figure 4 5/, 6/ 9, 10, 11 All 3.0 ns active Chip disable to output t EHQZ See figure 4 5/, 6/ 9, 10, 11 01, ns inactive Chip enable to power up t ELPU See figure 4 5/ 9, 10, 11 All 0 ns Chip enable to power down t EHP See figure 4 5/ 9, 10, ns Write cycle time t AVAV See figure 5 9, 10, ns Write pulse width t WLWH See figure 5 9, 10, ns Chip enable to end of t ELEH See figure 5 9, 10, ns write ata setup to end of write t VWH See figure 5 9, 10, 11 01, ns 03, ata hold after end of write t WHX See figure 5 9, 10, 11 All 0 ns Address setup to end of write See footnotes at end of table. Limits t AVWH See figure 5 9, 10, ns Min Max Unit SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 5

6 Test Address setup to beginning of write TABLE I. Electrical performance characteristics continued. Symbol Conditions 2/ -55 C T C +125 C V CC = 4.5 V to 5.5 V, V SS = 0 V unless otherwise specified Group A subgroups evice type Limits Min Max t AVWL See figure 5, (write cycle 1) 9, 10, 11 All 0 ns t AVEL See figure 5, (write cycle 2) 9, 10, 11 All 0 ns Address hold after t WHAV See figure 5 9, 10, 11 All 5.0 ns end of write Write enable to output t WLQZ See figure 5 5/, 6/ 9, 10, ns disable Output active after t WHQX See figure 5 5/, 6/, 7/ 9, 10, 11 All 0 ns end of write eselect time t EHVCCL See figure 6 5/, 8/ 9, 10, 11 All t AVAV (min) ns Recovery time t VCCHEL See figure 6 5/, 8/ 9, 10, 11 All t AVAV (min) ns 1/ I CC is dependent upon output loading and cycle rate. The specified values apply with output(s) unloaded. 2/ AC measurements assume signal transition times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 V to 3.0 V and output loading of 30 pf load capacitance. Output timing reference is 1.5 V, see figure 3. For read cycles 1 and 2, WE is high for entire cycle. 4/ evice is continuously selected, CE low. 5/ Parameter if not tested, shall be guaranteed to the limits specified in table I. 6/ Measured ±500 mv from steady state output voltage. Load capacitance is 5.0 pf, see figure 3. 7/ If WE is low when CE goes low, the output remains in the high impedance state. 8/ Supply recovery rate should not exceed 10 µs per volt from V R to V CC minimum. Unit 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SM PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device Certification/compliance mark. A compliance indicator C shall be marked on all non-jan devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator C shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HBK-103 (see 6.6 herein). The certificate of compliance submitted to LA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to LA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Verification and review. LA Land and Maritime, LA Land and Maritime's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 6

7 evice type Case outline Terminal number L X Y Terminal symbol Pin number A 6 A 7 A 8 A 9 A 10 A 11 A 14 A 15 A 0 Q WE V SS CE A 12 A 13 A 16 A 17 A 1 A 2 A 3 A 4 A 5 V CC A 6 A 7 A 8 NC A 9 A 10 A 11 A 14 A 15 A 0 Q NC WE V SS CE A 12 NC A 13 A 16 A 17 A 1 A 2 A 3 A 4 NC A 5 V CC A 0 A 1 A 2 A 3 A 4 A 5 NC NC A 6 A 7 A 8 Q WE V SS CE A 9 A 10 A 11 A 12 NC NC A 13 A 14 A 15 A 16 A 17 V CC FIGURE 1. Terminal connections. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 7

8 evice types 01 through 04 CE WE Mode I/O Power H X Not selected High Z Standby L L Write High Z Active L H Read OUT Active H = Logic "1" state L = Logic "0" state X = on't care FIGURE 2. Truth table. * Including scope and jig (minimum values) AC test conditions Input pulse levels Input rise fall times Input timing reference levels Output reference levels GN to 3.0 V 5 ns 1.5 V 1.5 V FIGURE 3. Output load circuit. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 8

9 NOTES: 1. WE is high for entire cycle. 2. CE and WE must transition between V IH (min) to V IL (max) or V IL (max) to V IH (min) in a monotonic fashion. 3. evice is continuously selected, CE low. FIGURE 4. Read cycle timing diagrams. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 9

10 FIGURE 5. Write cycle timing diagrams. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 10

11 NOTES: 1. CE and WE must transition between V IH (min) to V IL (max) or V IL (max) to V IH (min) in a monotonic fashion. 2. CE and WE must be V IH during address transitions. FIGURE 5. Write cycle timing diagrams continued. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 11

12 FIGURE 6. Low V CC data retention cycle. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 12

13 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-ST-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-ST-883. (1) Test condition C or. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-ST-883. (2) T A = +125 C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL- ST-883 including groups A, B, C, and inspections. The following additional criteria shall apply Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-ST-883 shall be omitted. c. Subgroup 4 (C IN and C OUT measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. d. Subgroups 7, 8A, and 8B tests shall include verification of the truth table Groups C and inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-ST-883. (1) Test condition C or. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-ST-883. (2) T A = +125 C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-ST PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 13

14 TABLE II. Electrical test requirements. MIL-ST-883 test requirements Subgroups (per method 5005, table I) Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 Groups C and end-point electrical parameters (method 5005) 2, 3, 7, 8A, 8B * PA applies to subgroup 1 and 7. ** See 4.3.1c. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SM's. All proposed changes to existing SM's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform LA Land and Maritime when a system application requires configuration control and the applicable SM. LA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact LA Land and Maritime-VA, telephone (614) Comments. Comments on this drawing should be directed to LA Land and Maritime-VA, Columbus, Ohio , or telephone (614) Approved sources of supply. Approved sources of supply are listed in MIL-HBK-103. The vendors listed in MIL- HBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by LA Land and Maritime-VA. SCC FORM 2234 MICROCIRCUIT RAWING LA LAN AN MARITIME 14

15 MICROCIRCUIT RAWING BULLETIN ATE: Approved sources of supply for SM are listed below for immediate acquisition information only and shall be added to MIL-HBK-103 and QML during the next revision. MIL-HBK-103 and QML will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by LA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HBK-103 and QML LA Land and Maritime maintains an online database of all current sources of supply at Standard microcircuit drawing PIN 1/ Vendor CAGE number LA 3TT XA 3TT2 Vendor similar part number 2/ MT5C2561C35L883C OW6207C3-35 IT71257L35CB EI81256LP35QB P4C1257L-35CMB MT5C2561EC35L883C OW6207CC3-35 EI81256LP35LB P4C1257L-35LMB YA 3TT2 P4C1257L-35FMB LA MT5C2561C45L883C OW6207C3-45 IT71257L35CB EI81256LP45QB 3TT2 P4C1257L-45CMB XA MT5C2561EC45L883C OW6207CC3-45 3TT2 EI81256LP45LB P4C1257L-45LMB YA 3TT2 P4C1257L-45FMB LA 3TT2 MT5C2561C55L883C OW6207C3-55 IT71257L35CB EI81256LP55QB P4C1257L-55CMB XA 3TT2 MT5C2561EC55L883C OW6207CC3-55 EI81256LP55LB P4C1257L-55LMB YA 3TT2 P4C1257L-55FMB LA 3TT XA 3TT2 MT5C2561C70L883C OW6207C3-70 IT71257L35CB EI81256LP70QB P4C1257L-70CMB MT5C2561EC70L883C OW6207CC3-70 EI81256LP70LB P4C1257L-70LMB YA 3TT2 P4C1257L-70FMB See footnotes at end of table. Page 1 of 2

16 MICROCIRCUIT RAWING BULLETIN continued. ATE: / The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the Vendor to determine its availability. 2/ Caution: o not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Not available from an approved source. Vendor CAGE number Vendor name and address 3TT2 Pyramid Semiconductor Corporation 1249 Reamwood Avenue Sunnyvale, CA The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Page 2 of 2