Change Summary of MIL-PRF Revision L December 06, Update/ clarification

Transcription

1 (Rev. L) Added BME capacitor specification reference MIL-PRF Capacitors, BME Chip, Multiple Layers, Fixed, Ceramic Dielectric, Established Reliability and Non- Established Reliability, General Specification For Update ESD test method for HBM and added CDM test method. ESDA/JEDEC JS-001- For Electrostatic Discharge Sensitivity Testing - Human Body Model (HBM) ESDA/JEDEC JS For Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM). Add BME capacitor requirements by adding new BME cap specification Update ESD requirements and add CDM test method for reliability and safety. JEDEC JC-13/G-12 / Space community. ; NASA/ESDA/JEDEC & (QM plan) Add ANSI/ESD S as an alternate JEDEC JESD625 requirement Update ESD control program requirements per JEDEC JESD625 and ANSI/ESDA S20.20 requirement Update/Add burn-in JEDEC publication JEP163 of the products to meet the quality and reliability performance requirements of MIL-PRF Add ANSI/ESD S for reliability Update ESD control program per ANSI/ESDA S20.20 and JESD625 for reliability Add burn-in and life test requirements perjep163 for reliability ; NASA/ESDA/JEDEC/ ; NASA/ESD/JEDEC/ESD EP study outcome /JC-13.2/G-12/ Deleted paragraph c as duplicated with paragraph code for assembly site. Update/ clarification DLA VQ/Army- MI,CR and JC-13.2 Page 1 of 10

2 (Rev. L) Update RHA levels designator Update/ clarification to consistent with RHA appendix C / JC Update BGA/CGA device lead finish letter F: Tin-lead alloy (BGA/CGA package) as defined in the applicable device document. Update/ clarification: If the manufacturer has more than one facility for assembly in a given country, a unique single letter code shall be assigned for the assembly sites used. Update/ clarification DLA VQ/JC Update electrostatic discharge (ESD) sensitivity identifier references test method HBM and added CDM test method Required HBM and CDM ESD test for reliability and safety Add environmental biobased materials requirement Update per MIL-STD Add BME Capacitor requirements and add new spec MIL-PRF requirements. Add new thin layer BME/PME capacitors requirement per MIL-PRF for reliability /G-12 /G ESD requirement update ESD test requirement update/ clarification Page 2 of 10

3 (Rev. L) Table IA (screening) Table II (group B) Update footnote 3/; 15/ and 17/ Update/Clarification. DLA and JC-13.2 community Subgroup 1: b. Internal gas analysis (IGA) test term used Update footnote 2/, 4/ and 5/ Update/Clarification. DLA and JC-13.2 community Table V (group D) Subgroup 6: Update Internal gas analysis (IGA) test term used Update footnote 11/ and 12/ Update/Clarification. DLA and JC-13.2 community Add definition of Thin layer capacitor for MIL-PRF BME and PME capacitors uses. Clarification of Thin layer capacitor for BME and PME capacitor uses in MIL- PRF DLA 6.9 Deleted 6.9 Environmentally preferable material Update/Clarification. DLA Page 3 of 10

4 (Rev. L A Delete reference DSCC-VQC-42:- Baseline Sheet for Update and canceled the reference DLA-VQ Microcircuits Materials and Construction. A.2.3 Update Non-Government publications/documents Update /clarification DLA references A Update RHA level designator Update /clarification DLA A Update ESD HBM test method references Update /clarification DLA EP study outcome A Update major change notification of product or quality assurance program and delete class 1 Update /clarification Govt. Working Group(GWG) recommendation A IGA sample size : 3(0) IGA sample size update for clarification, AF-85 and AF-19 Table A-I Major change Update footnote 1/ and add footnote 2/ for major change and fabrication move Clarification, JC TG/GWG A h. Type H: Tin-lead alloy solder balls, bumps or columns for Ball grid array (BGA) and column grid array(cga) packages. Add BGA and CGA packages lead or terminal materials/alloy types for solder bumps, balls or columns for reliability. / JC 13.2 TG recommendations A Lead finish thickness measurements shall be taken at the seating plane on surface mount leads (such as J- bend and gull-wing type leads) and approximately halfway between the seating plane and the tip of the lead on all round shape lead types. Clarification Page 4 of 10

5 (Rev. L A Hot solder dip Update description of figure A-1. Solder dipping area when seating plane is not defined For top brazed and bottom brazed flat pack packages, the hot solder dip shall be within inch (1.78 mm) of the lead/package interface. Update /clarification for hot solder dip requirement for brazed flat pack Manufacturer /JC A Laser scribing may be used for wafer grooving before using traditional diamond saw for die separation, or full grooving for die separation. If manufacturer uses laser scribing for die grooving, the applicable inspections shall be performed for checking damage in the die active region and seal ring. Laser trim of resistors and shorting bars and laser scribed package external markings are not prohibited unless otherwise specified. Update laser scribing requirements for wafer grooving die separation EP study outcome Page 5 of 10

6 (Rev. L A Lead finish Lead finish letter F: Types H, J with tin-lead alloy as applicable to BGA and CGA device document. Update/clarification A Electrostatic discharge (ESD) sensitivity identifier : or can be found from web link standard microcircuits cross reference (SMCR). ESD test requirements update/clarification / EP study outcome A Update Internal gas analysis (IGA) term used. Update/clarification A ESD HBM test method reference update ESD test update/clarification A d Group C coverage is required for each year of die or device production on each microcircuit group. Update/clarification VQ A (Burn-in) Update Burn-in requirement paragraph by using JEDEC publication JEP163 for burn-in and life test Update/clarification for reliability LA Land and Maritime/ JC-13.2/G-12/ Page 6 of 10

7 (Rev. L B.4.3 c Table V, group D test requirements for package technology style characterization testing Update typo DLA (see table H-IIA), Appendix C Entire RHA requirements to Appendix C has been updated/re-written. Major topics includes: RHA QM plan update Total ionizing dose(tid) test requirements Annealing test requirements ELDRS test requirements Single event effects (SEE) test requirements RHA process capability demonstration Natural environment appropriate tests Manmade environments appropriate tests RHA group E subgroup 2 update Update / clarification of RHA QM plan and RHA test methodology update based on RHA environment JEDEC JC-13.4 RHA subcommittee and - EP study final report outcome Page 7 of 10

8 (Rev. L G.2.3 Update Non-Government publications Update/clarification DLA H.2.3 Update Non-Government publications Update/clarification DLA H Update Non-Government publications Add burn-in life test reference JEDEC JEP163 per JC-13.2 TG for reliability. JEDEC JC-13.2 and EP study outcome H Update wafer fabrication technology validation for class level S devices/sec burn-in frequency requirement Update and clarification for burn-in frequency of complex devices for reliability. JEDEC JC-13.2 and Space community Page 8 of 10

9 (Rev. L) H (flip chip) Add requirement for Flip-chip devices assembly on following items under package integrity demonstration test plan(pidtp): 5) Underfill materials evaluation criteria shall be documented to PIDTP. 5.1) Long term reliability test for underfill. 6) Lid attach/thermal interface materials (TIM) evaluation criteria shall be documented in the PIDTP. Required PIDTP for flip chip devices underfill, TIM evaluation criteria and underfill long term reliability test documentation for reliability and safety. Required lot date code for flip chip non-hermetic devices during underfil cure for traceability. JEDEC JC-13/G-12 and Space community and DLA Land and Maritime EP study outcome 8) Marking lot date code for flip chip non-hermetic devices. TABLE H-IA Typo correction die attach process bond strength test TM2011 instead of TM2010 and wire bond test method TM2010 instead of TM2011 for die cracks for hermetic and non-hermetic packages. Underfill evaluation criteria update Update/clarification Space community, JC-13.2 and DLA Land and Maritime TABLE H-IIA Update ESD test method for HBM reference ESDA/JEDEC JS-001 Underfill evaluation criteria update Update/clarification DLA EP study outcome TABLE H-IIB Update ESD test method for HBM model reference ESDA/JEDEC JS-001 Update/clarification DLA ESD EP study outcome Page 9 of 10

10 (Rev. L) J.2.3 Update Non-Government publications reference Update/clarification DLA ESD EP study outcome J.3.4 Update Internal gas analysis (IGA) term used. Update/clarification J.3.5 Update Burn-in life test requirements by adding JEDEC JEP163 publication Update/clarification for reliability JC 13.2 TG and DLA J.3.12 Update/modification of test optimization requirements Update/clarification for reliability. JC-13.2 TG and DLA Page 10 of 10