Package LGA6x FixPitch- / FreePitch-Sensors

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Abner Kelly Hudson
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1 Package LG6x FixPitch- / FreePitch-Sensors LG6x.HIE.03 Page 1 of 6

2 1. Packaging Package LG6x The sensors are delivered in vacuum sealed, ESD-compliant dry bag. The series delivery form is tape & reel with a packaging unit (PU) of 2500 parts per reel. 2. Storage The shelf life of the dry-packed sensors is 24 months after seal date, stored at non-condensing atmosphere with max. 40 C and max. 90 % relative humidity. The sensors are classified for moisture sensitivity level 2 (MSL2) according to JEDEC J-STD-020. For the use of the sensors after dry pack opening the floor conditions und floor times as defined in JEDEC J-STD-033 must be considered. For bake out times and conditions after the allowed floor time refer to JEDEC J-STD-033. Note: Sensors in tape & reel are not allowed to bake out at temperatures > 45 C. 3. Handling and Mounting 3.1 General dvice The sensors are ESD sensitive. General ESD-precautions need to be observed. When using sensors from already open vacuum packaging, you have to note the instructions of chapter 2. Storage. If necessary a thermal preconditioning of the sensors needs be done (see Tab. 1). The recommendations for the PCB layout and the solder paste should be checked prior to use on the machine. PLESE NOTE THT NONCOMPLINCE WITH ONE OR MORE OF THE DVICES MY RESULT IN THE LOSS WRRNTY. SENSITEC GMBH SHLL BE IN NO CSE BE LIBLE FOR THE CONSE- QUENCES THEREOF. LG6x.HIE.03 Page 2 of 6

3.2 layout recommendation Package lga6x Bottom contacted side 2x0.24 2.5 7 8 Distance min. 80 µm 2x0.36 (5x0.45) 1.56 6 5 4 3 2 1 6x0.24 0.45 6x0.36 1.35 Copper 2.25 Solder resist Fig.

3 3.2 layout recommendation Package lga6x Bottom contacted side 2x Distance min. 80 µm 2x0.36 (5x0.45) x x Copper 2.25 Solder resist Fig. 1: Pad geometry LG6S. Bottom contacted side 5.5 4x0.23 (1.50) Distance min. 80 µm 4x0.36 (5x0.45) x x Copper Solder resist Fig. 2: Pad geometry LG6L. solder Mask solder resist Pad opening (pad 7-10): 0.36 x 0.24 mm Pad opening (pad 7-10): 0.36 x 0.24 mm Pad opening (pad 1-6): 0.24 x 0.36 mm Pad opening (pad 1-6): 2.64 x 0.51 mm lga6x.hie.03 Page 3 of 6

4 3.3 reflow information Package lga6x The solder mask should have a thickness of 125 µm. For more information see details of solder mask manufacturer. Due to the thickness of the solder mask a paste with grain size of type 5 (e.g. Heraeus SC F645 series / #305) should be preferred to ensure a more homogeneous fi lling of the solder deposits. The offi cial manufacturer instructions for the solder paste should be considered. lead-free reflow-profile recommendation (e.g. with sac F645 / #305) peak: C Temperature ( C) temperature time Time (s) C sec C sec. To reach peak sec. > 217 C sec. Fig. 3: Reflow profile. lga6x.hie.03 Page 4 of 6

5 4. tape and reel The sensors are packed in tape on reel with 2500 parts per packing unit. There are different tapes for the variants LG6S (width 3 mm) and LG6L (width 6 mm). Package lga6x drawing lga6 Ø ±0.1 P1 2.9 ±0.1 0 W 3.3 ± ±10% T D1 E B0 P2 2 ±0.05 P D0 Ø xP0= 40 ± ± ±0.05 F K0 1.9 ±0.1 lga6s Type: RC 3689 Material: PS (conductive) Marking for pin 1 towards sprocket hole (to IEC ) Conductivity: Ω/sq Fig. 4: LG6S tape & reel (RC 3689). 4 ± ±0.1 P1 0 W 0.3 ±10% T Ø D2 F 7.5 ± ±0.1 B0 lga6l Type: RC 3689 Material: PS (conductive) Marking for pin 1 towards sprocket hole (to IEC ) Conductivity: Ω/sq P2 2 ±0.1 P0 4 ±0.1 D0 Ø xP0= 40 ± ±0.1 E1 K0 1.9 ±0.1 Fig. 5: LG6L tape & reel (RC 3689). lga6x.hie.03 Page 5 of 6

General Information Disclaimer Package LG6x Sensitec GmbH reserves the right to make changes, without notice, in the products, including software, described or contained herein in order to improve

6 General Information Disclaimer Package LG6x Sensitec GmbH reserves the right to make changes, without notice, in the products, including software, described or contained herein in order to improve design and/or performance. Information in this document is believed to be accurate and reliable. However, Sensitec GmbH does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Sensitec GmbH takes no responsibility for the content in this document if provided by an information source outside of Sensitec products. In no event shall Sensitec GmbH be liable for any indirect, incidental, punitive, special or consequential damages (including but not limited to lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) irrespective the legal base the claims are based on, including but not limited to tort (including negligence), warranty, breach of contract, equity or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Sensitec product aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the General Terms and Conditions of Sale of Sensitec GmbH. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Unless otherwise agreed upon in an individual agreement Sensitec products sold are subject to the General Terms and Conditions of Sales as published at pplication Information pplications that are described herein for any of these products are for illustrative purposes only. Sensitec GmbH makes no representation or warranty whether expressed or implied that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Sensitec products, and Sensitec GmbH accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the Sensitec product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Sensitec GmbH does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using Sensitec products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). Sensitec does not accept any liability in this respect. Life Critical pplications These products are not qualified for use in life support appliances, aeronautical applications or devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Copyright 2018 by Sensitec GmbH, Germany ll rights reserved. No part of this document may be copied or reproduced in any form or by any means without the prior written agreement of the copyright owner. The information in this document is subject to change without notice. Please observe that typical values cannot be guaranteed. Sensitec GmbH does not assume any liability for any consequence of its use. Sensitec GmbH Georg-Ohm-Str Lahnau Germany Tel Fax sensitec@sensitec.com LG6x.HIE.03 Page 6 of 6

Ultra high-speed switching Voltage clamping Protection circuits Mobile communication, digital (still) cameras, PDAs and PCMCIA cards.

Ultra high-speed switching Voltage clamping Protection circuits Mobile communication, digital (still) cameras, PDAs and PCMCIA cards. 3 September 208 Product data sheet. General description 2. Features and benefits 3. Applications 4. Quick reference data Planar encapsulated in a SOD882 leadless ultra small plastic package. Low forward