SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450MM WAFERS

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1 SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450MM WAFERS The information in this Document has been furnished by the 450 mm International Physical Interfaces & Carriers Task Force, operating under the auspices of the SEMI Standards Physical Interfaces & Carriers Committee, for informational use only and is subject to change without notice. The Semiconductor Equipment and Materials International (SEMI ) Standards Program is publishing this information as furnished by the group in the form of Auxiliary Information so that it may be referenced by the industry, as desired. No material in this document is to be construed as an official or adopted standard. SEMI assumes no liability for the content of this document, which is the sole responsibility of the authors, nor for any errors or inaccuracies that may appear in this document. SEMI grants permission to reproduce and distribute this document provided that (1) the document is maintained in its original form, and (2) this disclaimer and the notice below accompany the document at all times. NOTICE: By publication of this document, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned herein. Users of this document are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights, are entirely their own responsibility Copyright 2010 by SEMI (Semiconductor Equipment and Materials International, 3081 Zanker Road, San Jose, CA 95134). See above for information on limited rights for reproduction and distribution; all other rights reserved. 1 SEMI AUX SEMI 2011

2 450mm SEMI Standards Overview

3 1.Purpose A purpose of this document is to promote the understanding of the summary of 450mm SEMI standards to extend over Silicon Wafer Technical Committee, Physical Interface & Carrier Technical Committee and Information & Communication Technical Committee. This document is based on the latest revision of the each standards at June 10,

4 2.The list of published 450mmSEMI standard SEMI M : Specification for 450mm Diameter Mechanical Handling Polished Wafer SEMI M : Specification for Developmental 450mm Diameter Polished Single Crystal Wafer SEMI E : Mechanical Interface for 450mm Load Port SEMI E : Mechanical Specification for 450mm AMHS Stocker to Transport Interface SEMI E : Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling SEMI E : Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450mm Wafers 3

5 3.Overview of 450mm SEMI Standards Developing (LP status indicator) SEMI E156(Stocker Interface) SEMI E84(Carrier Hand off Parallel I/O) Carriers: SEMI E158(450FOUP), SEMI E159(450 MAC), Publication Process(450 FOSB) Wafers: SEMI M74 (For Handling) SEMI M76 (For Test) Developing (For Product) SEMI E144(RF Air Interface) E154(FOUP & MAC Load Port) or Publication Process(FOSB Load Port) SEMI E84(Carrier Hand off Parallel I/O) SEMI E83(PGV Docking Flange) 4

6 4.450mm/300mm Comparison table Item 300mm 450mm Standard Name - M74 Mechanical Handling Polished Wafer Wafer M1 Developing (M1) Polished Single Crystal Si Wafer M28 M76 Developmental Polished Single Crystal Si Wafer E83 PGV Docking Flange Load Port FOUP E15.1 Load Port E62 FIMS E63 E154 BOLTS-M E64 Cart Docking Flange E110 LP Status Indicator (developing) E57 Kinematic Coupling E1.9 E158 Cassette E47.1 Front Opening Unified Pod MAC N/A E159 Multi Application Carrier FOSB M31 Publication Process Front Opening Shipping Box Load Port for FOSB N/A Publication Process Mechanical Interface Specification for 450 mm FOSB Load Port STK I/F E85 E156 Stocker Interface E84 Carrier Hand off Parallel I/O Communication E99 Carrier Reader/Writer Functional E144 RF Air Interface 5

7 5.Overview of 300mm SEMI Standards (Reference) E110(Operetor Interface) Carriers: E47.1(FOUP), E1.9(Cassette), M31(FOSB), E119(FOBIT) E22.1(Cluster-Tool End Effector) E72(Equipment Footprint, Height, and Weight) E21.1(Cluster-Tool Module Interface) M1(Wafer) E144(RF Air Interface) E57(Kinematic Coupling) E62(FIMS) E15.1(Load Port) E84(Carrier Hand off Parallel I/O) E64(Cart Docking Interface) E83(PGV Docking Flange) E85(Stocker Interface) E63(BOLTS-M) and/or E92(BOLTS-Light) or E131(IMM) 6

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