STEAG AWP-PR-STRIPPER

Transcription

1 STEG WP-PR-STRIPPER Processes available : PRS 1000 IP/NMP Gripper Clean QDR MRNGONI-Dryer Wafer Transfer Station Load/Unload Wafer Size: 8 Main Body Size : W 1765 x L 4550 x H 2400 (mm)

2 WP - PR-Stripper Critical Nature of this Tool _ 1.1 Critical Nature of this Tool The tool is provided with protection measures and was subjected to safety testing. However, there could be through operator error, mishandling or operation not according to it intended use, danger: to life and limb of the users, to the tool and other material assets of the management. 1.2 Use as Directed The tool WP - PR-Stripper (WP = utomated Wet Processor) conducts the chemical processing of Silicon-Wafers with a 200mm diameter in Low Mass Carriers 8 with 25 wafers each. Specifications: Process-Carrier 8, Fluroware Type 192B-80MC Wafer Ø8 / thickness mm, not sharp-edged, according to SEMI- Standard Only the specified carriers and wafers are allowed to be brought into the unit. ccording to Layout /B the tool is specified for the following functions: Type Location Module Function Process module 1 Module 1 PRS 1000 The PRS 1000 bath is removing organic from the wafer. The solution comes ready mixed into the prepping tank. There is no further mixing and preparation of chemicals necessary. Process module 2 Module 2 PRS 1000 The PRS 1000 bath is removing organic from the wafer. The solution comes ready mixed into the prepping tank. There is no further mixing and preparation of chemicals necessary. Process module 3 Module 3 IP/NMP The IP-module is for removing residues after a dry etch process. The Temperature of the bath is ambient. The normal process time is about 5-10 min. Gripper Clean Module 4 GC Spraying the gripper with DI-H 2O hot and drying through N 2 blower Rinse module 1 Module 5 QDR amb. with Quick-Dump-Function for DI-H 2O cold Dryer Module 6 DMG Drying by means of MRNGONI Dryer (using MRNGONI principle) uxiliary Places Module 6 UX 1 auxiliary place for empty process carriers on each MRNGONI Dryer Buffer station Module 7 PP 2 2 Buffer positions for process carriers Input station Module 8 I/O Station Input station with three positions for two process carriers each,... Operator site Equipped with PC, Keyboard and Monitor to operate the tool For reasons of safety, unauthorized modification is not allowed. (Note: ny changes made by Steag authorized service personnel in the course of installation or optimization are of course in agreement with the manufacturer as our authorized representative. Later modifications to change the tool, such as upgrading, exchanging or adding a module must be approved by our construction department. It is recommended that such modifications be made by Steag personnel.) The use of non-original replacement parts or non-approved equivalent parts cancels the liability for any ensuring results due to this replacement. (Note: Due to non-availability or other extenuating circumstances non-original parts may be used, but they must first be approved by our construction department as equivalent or better.) _ S54520.DOC/Rev.00/ STEG MicroTech GmbH 1-2

3 WP - PR-Stripper Module Descriptions _ Modules and Operation concept The WP - PR-Stripper is a modular automatic wet bench for the chemical processing of wafers with process and rinse tanks as described in chapter one. The Operator controls the tool from the Input/Output station and work station utilizing the keyboard, monitor, and positions provided. The operator manually places the transport carrier in the loading station by placing it in the appropriate location crossing under the light barriers. The light barrier and the sensors located above the doors (they register if door is closed), ensure that the handler can not operate (same as Emergency Stop Robot button) when an operator is in the process area. It is then transferred from the transport carriers into the process carriers (using buffer positions provided). The robot can then move the process carrier to one of the other two buffer stations of the tool, or remain in the transfer buffer position. From the buffer station they are transported by robot to the first module on the far end of the tool. There is a laser beam over the top of the process tanks from the I/O station to a reflector on the end wall of the tool and back to the I/O station to detect the presence of a carrier in the handler arm (see warning in chapter 1 on laser radiation). This is a safety measure against the handler trying to retrieve a carrier when it is already loaded or thinking that it has picked up a carrier when it is still empty. s a safety measure for the operator, the laser is tied into the robot and emergency off circuits such that the laser is turned off by a hardware interlock if a door or service port on the front of the tool is opened. There is a door interlock disable in the form of a key switch on the tool for maintenance and service, which allows the laser to operate while the doors are open. Only specially trained personnel are allowed to work on the tool in this configuration. This disable is equipped with a signal light. The wafers are then processed through the tool according to the current recipe. When the carrier is in the final rinse the gripper is cleaned in the gripper clean module. fter the final rinse the carrier is placed in the MRNGONI dryer(s) and the gripper (claw) of the robot is cleaned and dried in the gripper clean module again. fter the drying cycle is complete the carrier is removed to the transfer station position. When a carrier is in one of the two buffer positions the station can replace the wafers in the transport carriers and then slide forward and the carrier can then be manually removed by the operator (crossing the light barrier) Carrier General Information Low-mass carriers are designed specifically to match Steag MicroTech s WP Generation III tools for the highest mechanical and process performance. For efficient semiconductor manufacturing, high standards of dimensional accuracy and cleanliness must be maintained. Because of direct contact with chemicals, frequent temperature changes during process, and mechanical stress during wafer transfer, Steag MicroTech low-mass carriers should be checked at regular intervals and replaced as required. Steag MicroTech supplies only quality approved low-mass carriers, either molded from PF or machined from TFM. Since packaging and shipping can temporarily alter a carrier s dimensions, it is strongly recommended that newly received carriers be unpacked and normalized in the factory s ambient environment for 24 hours prior to inspection or use. _ J54520.DOC/Rev.00/ STEG Micro Tech GmbH 2-4

4

5 WP - PR-Stripper Operator Panels and Functions Front View Fig.: Front View Fig 1 Fig. 2 Fig. 3 Fig 4 Fig. 5 Fig. 6 Fig 7 Fig. 8 Fig. 9 Light tower Control Panel Dwyer exhaust measuring PC interface Teach In Panel CO2 Fire Suppression System Keyboard and monitor Rescue Scissors EMO and ROBOT STOP STEG MicroTech GmbH 2-53

6 WP - PR-Stripper Operator Panels and Functions Back View Fig. B:Back View Fig B1 Fig B2 Fig B3 CO2 FIRE SUPPRESSION SYSTEM EMERGENCY OFF BUTTON MYCOM STEG MicroTech GmbH 2-63

7 WP - PR-Stripper Operator Panels and Functions Control Cabinet C1 C2 C3 Inside RITTL RITTL RITTL 54520c.cdr Fig.C: Control Cabinet Fig. C1 Fig. C2 Fig. C3 RCK (inside) EMO and Control on/off Main switch and type plate STEG MicroTech GmbH 2-66

8 WP - PR-Stripper Technical data 2.5 Technical data Type plate Typ Type WP - PR-Stripper Fabrikationsnummer Serial Number Baujahr Year of Production Stromlaufpl. Zeich.-Nr. Circuit Diag. Draw. No January Normal Netz / Normal Power Supply Spannung Voltage Strom Current Phasen Phase Spannung Voltage Strom Current Phasen Phase 120/ V Bemessungsstrom Rated Uninterrupted Current Kurzschlußstrom Short-circuit Current V Bemessungsstrom Rated Uninterrupted Current Kurzschlußstrom Short-circuit Current UPS Frequenz Frequency Leistung Power Hauptschalter / Main Circuit Breaker 120/208 3 Ph / N / PE 25 I= u I = r m Frequenz Frequency Leistung Power 3 Ph / N / PE Hauptschalter / Main Circuit Breaker I= u I = r m 60 23, , Hz kv Hz kv Emissionen Der -bewertete äquivalente Dauerschalldruckpegel < 70 db () STEG MicroTech GmbH 2-75

9 WP - PR-Stripper Technical data Carrier Types Low- Low-Mass Profile 25 ns 50 hs 50 ns 50 ns 50 hs 100 hs* Material PF PF PF Machined TFM1600 TFM1600 Manufacturing Process Molded Molded Molded Molded Machined Machined Supplier Fluoroware Fluoroware Fluoroware Steag Steag Steag Part Number M- 02XX LZ-02XX B50M Reinforcement Rods N N 4 Carbon None None 4 Carbon Max. Temperature (ºC) Suitable for Solvent Yes Yes Yes Yes No No pplications? Wafer Thickness (mm) Wafer Edge Excl. (mm) Rec. exchange time (mo.) HF (up to 30 C) DHF (up to 30 C) SC1/SC2 (up to 70 C) SPM/SOM (up to 145 C) 12 n.a n.a. n.a. Hot Phos (up to 165 C) 12 n.a n.a. n.a. Solvent (up to 100 C) Recommended Inspection Interval Monthly Monthly Monthly Monthly Monthly Monthly Key hs = half space ns = normal space * Under qualification STEG MicroTech GmbH 2-79