North America 3DS-IC (Three-dimensional Stacked Integrated Circuits) Standards Committee Meeting Summary and Minutes

Transcription

1 North America 3DS-IC (Three-dimensional Stacked Integrated Circuits) Standards Committee Meeting Summary and Minutes NA Standards Spring 2011 Meetings 29 March 2011, Pacific Time SEMI Headquarters in San Jose, California Committee Announcements Next Committee Meeting In conjunction with SEMICON West 2011 July 11-14, 2011 San Francisco Marriott Marquis Hotel in San Francisco, California Table 1 Meeting Attendees Italics indicate virtual participants Co-Chairs: Urmi Ray (Qualcomm), Sesh Ramaswami (Applied Materials), Chris Moore (Semilab), Andy Rudack (SEMATECH) SEMI Staff: Paul Trio Company Last First Company Last First 3MTS Bottoms Bill KLA-Tencor Chew Kean Altera Long Jon NIST Allen Rich Amkor Huemoeller Ron Powertec Technology Emmett Paul Applied Materials Beica Rozalia Qualcomm Ray Urmi Applied Materials Kumar Niranjan Rudolph Technologies Grant Mitch Applied Materials Ramaswami Sesh SEMATECH Ferrell Jackie ASE Yee KC SEMATECH Smith Larry ASE Du Yong Semilab Moore Chris Canon U.S.A. Shelton Doug Shin-Etsu Polymer Kashimoto Akira Corning Matthews James Suss MicroTec Bair Wilfried Corning Trott Gary Suss MicroTec Sood Sumant DAETEC Moore John Texas Instruments Brighton Jeffrey esilicon de la Cruz Javier EVG Oakes Garrett SEMI Trio Paul KLA-Tencor Rivera Manny Table 2 Leadership Changes Group Previous Leader New Leader NA 3DS-IC Committee Sesh Ramaswami (Applied Materials) NA 3DS-IC Committee 1 March 29, 2011

2 Table 3 Ballot Results Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review. Failed ballots and line items were returned to the originating task forces for re-work and re-balloting. Document # Document Title Committee Action Table 4 Authorized Ballots # When SC/TF/WG Details Table 5 Authorized Activities # Type SC/TF/WG Details 5173 SNARF Bonded Wafer Stacks TF New Standard: Specification for Parameters for Bonded Wafer Stacks 5174 SNARF Bonded Wafer Stacks TF 5175 SNARF Thin Wafer Handling TF --- TFOF & SNARF(s) New Standard: Specification for Identification and Marking for Bonded Wafer Stacks New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers A new task force will be chartered to develop standard(s) for dimensions and sizes for carrier wafers as well as edge trimming of the device wafer. The proposed task force and associated SNARFs will be approved via the Global Coordinating Subcommittee (GCS) Note: SNARFs and TFOFs are available for review on the SEMI Web site at: Table 6 New Action Items Item # Assigned to Details 2011Mar #01 Chris Moore (Semilab) Draft TFOF and associated SNARF(s) for the proposed task force that will develop standard(s) for dimensions and sizes for carrier wafers as well as edge trimming of the device wafer. 2011Mar #02 3DS-IC Committee Contact Chris Moore or Paul Trio to volunteer for the proposed carrier wafer task force. Members Table 7 Previous Meeting Actions Items Item # Assigned to Details 1 Welcome, Reminders, and Introductions Chris Moore, committee co-chair, called the meeting to order at 3:15 PM. After welcoming all attendees, the agenda was reviewed. Chris Moore then presented and explained the SEMI meeting reminders on membership requirements, antitrust, patentable technology, and meeting guidelines. Attachment: 01, SEMI Standards Required Meeting Elements NA 3DS-IC Committee 2 March 29, 2011

3 2 Review of Previous The committee reviewed the minutes of the previous meeting held January 12, 2011 via teleconference/web meeting: Motion: By / 2 nd : Discussion: Vote: Attachment: Accept the minutes of the previous meeting as submitted. Ron Huemoeller (Amkor)/ Rich Allen (NIST) 17-0 in favor. Motion passed. 02, NA 3DS-IC January 12, 2011 meeting minutes 3 SEMI Staff Report Paul Trio (SEMI) gave the SEMI Staff Report. The key items were as follows: 2011 Global Calendar of Events o SEMICON China/FPD China (March 15-17, Shanghai) o Europe PV Fab Managers Forum (March 20-22, Berlin, Germany) o CS Europe (March 22, 2011, Frankfurt, Germany) o SEMICON Singapore (May 11-13, Suntec) o SEMICON Russia (May 31 June 2, Moscow) o Intersolar Europe (June 8-10, Munich, Germany) o SEMICON Taiwan (September 7-9, Taipei) o SEMICON Europa (October 11-13, Dresden, Germany) NA Standards Spring 2011 Meetings o March o Most Standards meetings will be held at SEMI Headquarters in San Jose, California Facilities & Gases I&C MEMS/NEMS Metrics PV Traceability HB-LED 3DS-IC o Applied Materials in Santa Clara, CA will host EHS meetings o Intel in Santa Clara, CA will host Silicon Wafer and PIC meetings Upcoming NA Meetings o NA Liquid Chemicals Committee (April 12, hosted by ICL in St. Louis, MO) o NA Compound Semiconductor Materials (May 18, in conjunction with CS MANTECH in Indian Wells (Palm Springs), CA o NA Standards Meetings at SEMICON West (July 11-14, San Francisco Marriott Marquis Hotel in San Francisco, CA) o NA Standards Fall 2011 Meetings (TENTATIVE: October 24-28, SEMI Headquarters in San Jose, CA) Technical Ballot Critical Dates for SEMICON West 2011 Meetings o Cycle 3: due April 11 / April 25 May 25 o Cycle 4: due May 16 / May 31 June 30 o 2011 Technical Ballot Critical Dates now available at the SEMI website: February 2011 Publication Cycle o New Standards 7 (+2 AUX), Revised Standards 26, Reapproved Standards 16, Withdrawals 2, Total in portfolio 805 Attachment: 03, SEMI Standards Staff Report NA 3DS-IC Committee 3 March 29, 2011

4 4 Task Force Reports 4.1 Bonded Wafer Stacks Task Force Rich Allen (NIST) provided the Bonded Wafer Stacks TF report. The key items were as follows: Members were tasked to submit standardization proposals for consideration. Currently, there are currently 47 items on the wish list Three SNARFs (Standards New Activity Report Form) were drafted by the task force and presented to the committee for review and approval: o New Standard: Specification for Parameters for Bonded Wafer Stacks (Doc # 5173) Rationale: Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Wafer thickness, edge bevel, notch, mass, bow/warp and diameters are changed when wafer stacks are bonded together, or wafer stacks bonded and thinned. These deviations from wafer parameters specified in SEMI M1 have numerous impacts in other equipment and hardware standards that reference SEMI M1, and drives a new standard to reflect wafer parameters associated with bonded and bonded/thinned wafer stacks. Scope: Develop a standard that will meet the needs of bonded wafer stacks using temporary bonding to carrier wafers. This standard will reflect the new parameters (including thickness, edge bevel, notch, mass, bow/warp and diameters, etc.) associated with bonded wafer stacks including bonded and thinned stacks. This standard will include both Silicon and glass carrier wafers. Motion: By / 2 nd : Discussion: Vote: Approve SNARF New Standard: Specification for Parameters for Bonded Wafer Stacks Rich Allen (NIST) / Bill Bottoms (3MTS) 20-0 in favor. Motion passed. o New Standard: Specification for Transport and Storage Containers for Bonded Wafer Stacks Proposed Rationale: Current standards for transport and storage containers (tool cassettes, shipping boxes, FOUP, FOSBs) do not adequately address the needs of bonded wafer stacks. Thickness, edge bevel, mass and diameters are changed when wafer stacks are bonded together, exceeding the design criteria of current wafer transport and storage containers, leading to potential wafer damage/breakage Proposed Scope: Develop a carrier standard that will meet the needs of bonded wafer stacks using temporary or permanent bonding to carrier wafers or multiple wafer stacks. This standard will reflect the new wafer thickness edge bevel, bow/warp, mass, and diameters associated with bonded wafer stacks including bonded and thinned stacks. The initial focus will be nominal 300 mm and others as driven by contributions. Committee Discussion: In order for the task force to develop a standard on transport and storage containers for bonded wafer stacks, the task force must first complete the development of parameters for bonded wafer stacks (SNARF #5173). And before the parameters for bonded wafer stacks could be determined, the committee believed that a new task force should first be chartered to develop standard(s) for dimensions and sizes for carrier wafers as well as edge trimming of the device wafer. The committee, therefore, decided not to authorize this activity (transport and storage containers for bonded wafer stacks) at this time and have the committee members focus on carrier wafer dimensions/sizes first. NA 3DS-IC Committee 4 March 29, 2011

5 The TFOF (task force organization form) and associated SNARF(s) of the proposed task force will be submitted shortly for approval. o New Standard: Specification for Identification & Marking for Bonded Wafer Stacks (Doc #5174) Rationale: Current wafer identification standards and wafer marking standards do not adequately address the needs of bonded wafer stacks. Location (e.g. backside near notch for SEMI T7) will be removed during backside thinning operations or edge-trim operations, or buried under an opaque layer of silicon and rendered un-readable by optical readers when bonded. Multiple wafer stacks will combine wafers with multiple process history, including tracking of temporary carrier wafers, and a standard needs to be developed to combine and track bonded wafer stacks with multiple wafer histories. Scope: Develop an identification standard that will meet the needs of bonded wafer stacks. The initial focus will be temporary bonding and permanent bonding as driven by contributions. Motion: By / 2 nd : Discussion: Vote: Approve SNARF New Standard: Specification for Identification and Marking for Bonded Wafer Stacks Rich Allen (NIST) / Sesh Ramaswami (Applied Materials) 19-0 in favor. Motion passed. Action Item: 2011Mar #01, Chris Moore (Semilab) to draft TFOF and associated SNARF(s) for the proposed task force that will develop standard(s) for dimensions and sizes for carrier wafers as well as edge trimming of the device wafer. Action Item: 2011Mar #02, 3DS-IC committee members to contact Chris Moore or Paul Trio if they wish to volunteer for the proposed carrier wafer task force. Sumant Sood (Suss MicroTec), Niranjan Kumar (Applied Materials), and Gary Oakes (EVG) will participate in the carrier wafer task force. Attachments: 04, SNARF #5173 New Standard: Specification for Parameters for Bonded Wafer Stacks 05, SNARF #5174 New Standard: Specification for Identification and Marking for Bonded Wafer Stacks 4.2 Inspection & Metrology Task Force Chris Moore (Semilab) provided the Inspection & Metrology TF report. The key items were as follows: TF will develop and distribute a process flow map with known, as well as potential, areas for metrology identified. Members are asked to report which of these areas they can contribute IMEC presentation on Metrology for Bonding SNARF drafted for 3DS-IC TSV Physical Parameters o Rationale: A number of different technologies exist which can be used to measure various physical parameters of a TSV or arrays of TSV s such as pitch, top CD, top area, depth, taper (or sidewall angle), bottom area, bottom CD. However at this time it is difficult to try to compare and/or correlate results from the various technologies for the various ranges of TSV dimensions. In some cases parameter are called by similar names but are different aspects of the same measurement. This standard would attempt to group the various NA 3DS-IC Committee 5 March 29, 2011

6 o o technologies results in such a way that correlations and comparisons are valid or in cases where they are not clearly indicate this Scope: Define terms currently used to describe TSV parameters which are not defined in current SEMI Standards and list those that are already defined in current SEMI Standards.. For each parameter (or groups of parameters), the various technologies that are used will be listed along with any limitations and/or issues and needs particular to that technology and making valid comparisons to the others. Include applicable ranges for valid measurements where possible. SNARF will be finalized and submitted for approval 4.3 Thin Wafer Handling Task Force Urmi Ray (Qualcomm) provided the Thin Wafer Handling TF report. The key items were as follows: SNARF drafted by the task force and presented to the committee for review and approval: o New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (Doc # 5175) Rationale: Current standards for wafer transport and storage containers (shipping boxes, FOUP, FOSBs) do not adequately address the reliable storage and transportation of thin wafers and dice on tape frame used in 3DS-IC manufacturing. Wafer thicknesses of um will need significant changes to the current design criteria of current wafer transport and storage containers. This will address robust handling and shipping of thin wafers, including changes in securing the wafers. New inspection processes will be addressed in the Inspection and Metrology TF Scope: Develop a thin wafer handling and shipping guide that will meet the needs of 3DS-IC manufacturing. Include: Standards for tape frame Standards for thin wafer on tape frame Requirements of capacity of containers Transportation/vibration and mechanical shock requirements Motion: By / 2 nd : Discussion: Vote: Approve SNARF New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers Bill Bottoms (3MTS) / Jeff Brighton (Texas Instruments) 21-0 in favor. Motion passed. The task force also reviewed the SEMI Standard on tape frame (SEMI G74) Attachment: 06, SNARF #5175 New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers 5 Old Business. NA 3DS-IC Committee 6 March 29, 2011

7 6 New Business 6.1 New TFOFs & SNARFs Listing of all new TFOFs, SNARFs, and other activities approved by the committee. # Type SC/TF/WG Details 5173 SNARF Bonded Wafer New Standard: Specification for Parameters for Bonded Wafer Stacks Stacks TF 5174 SNARF Bonded Wafer Stacks TF 5175 SNARF Thin Wafer Handling TF --- TFOF & SNARF(s) New Standard: Specification for Identification and Marking for Bonded Wafer Stacks New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers A new task force will be chartered to develop standard(s) for dimensions and sizes for carrier wafers as well as edge trimming of the device wafer. The proposed task force and associated SNARFs will be approved via the Global Coordinating Subcommittee (GCS) Note: SNARFs and TFOFs are available for review on the SEMI Web site at: 7 Action Item Review 7.1 Open Action Items Paul Trio (SEMI) reviewed the open action items. These can be found in the Open Action Items table at the beginning of these minutes. 7.2 New Action Items Paul Trio (SEMI) reviewed the new action items. These can be found in the New Action Items table at the beginning of these minutes. 8 Next Meeting and Adjournment The next meeting of the North America 3DS-IC committee is scheduled for Tuesday, July 12 in conjunction with SEMICON West The tentative schedule is provided below: North America Standards Meetings at SEMICON West 2011 July 11-14, 2011 San Francisco Marriott Marquis Hotel (across from Moscone Convention Center) 55 Fourth Street San Francisco, California U.S.A. Tuesday, July 12 Inspection & Metrology Task Force (8:00 AM to 10:00 AM) Wafer Bonded Stacks Task Force (10:00 AM to 12:00 Noon) Thin Wafer Handling Task Force (1:00 PM to 3:00 PM) NA 3DS-IC Committee (3:00 PM to 5:00 PM) The schedule above is subject to change. The committee is considering parallel TF meetings (vs sequential) at SEMICON West. NA 3DS-IC Committee 7 March 29, 2011

8 For more information, please visit: For more information about SEMICON West 2011, please visit: Having no further business, a motion was made to adjourn the NA 3DS-IC Committee spring 2011 meeting at SEMI Headquarters in. Adjournment was at 4:50 PM. Respectfully submitted by: Paul Trio Senior Manager, Standards Operations SEMI North America Phone: ptrio@semi.org Minutes approved by: Sesh Ramaswami (Applied Materials), Co-chair May 9, 2011 Urmi Ray (Qualcomm), Co-chair May 5, 2011 Andy Rudack (SEMATECH), Co-chair May 5, 2011 Chris Moore (Semilab), Co-chair Table 8 Index of Available Attachments #1 # Title # Title 1 SEMI Standards Required Meeting Elements 4 SNARF #5173 New Standard: Specification for Parameters for Bonded Wafer Stacks 2 NA 3DS-IC January 12, SNARF #5174 New Standard: Specification for Identification and Marking for Bonded Wafer Stacks 3 SEMI Standards Staff Report 6 SNARF #5175 New Standard: Guide for Multi- Wafer Transport and Storage Containers for Thin Wafers #1 Due to file size and delivery issues, attachments must be downloaded separately. A.zip file containing all attachments for these minutes is available at For additional information or to obtain individual attachments, please contact Paul Trio at the contact information above. NA 3DS-IC Committee 8 March 29, 2011