When can we turn out the lights at Probe?

Transcription

1 STeP Strategic Test Partners When can we turn out the lights at Probe? Ron Leckie

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3 Agenda: Processes People Software Financial Equipment A Pro-Active Step Outlook

4 Semiconductor Manufacturing Mask Mfg. Wafer Fabrication Materials Mgt., Chemical Dist., Automation, CIM Wafer Mfg. Epitaxy Photoresist Photolithography Etch Strip Diffusion/ Implant/ Metal CMP Inspection & Measurement Test, Assembly & Packaging Materials Mgt., CIM, Automation? Wafer Test Dicing Die Bond Wire Bond Encapsulation Test & Burn-in

5 The Flow Material Wafer Wafer Wafer Wafer Wafer / Die Frame Device Device Device Mfg. Step Wafer Fab Wafer probe Laser Repair Mount & Scribe Dicing Die / Wire Bond Packaging Package Test / Burn-in Finishing & Pack Treated as... Process Product Product Process Process Process Process Product Process

6 Assembly & Packaging X X X X X X X X

7 Process issues: Flow Location Cluster Inking Multiple Fab sources OCR / Wafer ID Probe Cleaning

8 Human Factors / Management Batch Process vs. Job Shop Interrupt driven Strategic Vision? Industrial Engineering? Metrics ROI Analysis

9 Software The Tasks: Equipment programming & set-up Wafer Maps Lot Data Device Data Not a major barrier! Technology is available! Takes attention to details!

10 Test Capital Spending Growth Over-Capacity Correction Recovery to Growth Driven by Unit Demand Short Equipment Leadtimes Test Equipment Sales (in $M) $6,000 $5,000 $4,000 $3,000 $2,000 $1,000 $ (E) (F) (F) source: SEMI/SEAJ Consensus Forecast, Nov (F) ISS Forecasts: SEMI -12% 13% 19% - - VLSI Res. Inc. -12% 16% 27% 39% 4%

11 Capital Spending Ratio All Semiconductor Equipment ($billion) % TOTAL SEMICONDUCTORS Total Equipment Capital Ratio 25% 20% 15% 10% % % source: VLSI Research - Fall 1996 actual -> <- forecast

12 Capital Spending Ratio 16.0% 14.0% 12.0% Total Wafer Process Total Test & Related Total Assembly 10.0% 8.0% 6.0% 4.0% 2.0% 0.0% source: VLSI Research Inc. - Fall '96 actual -> <- forecast

13 Capital Spending Ratio 16.0% 14.0% 12.0% Total Wafer Process Total Test & Related Total Assembly 10.0% 8.0% 6.0% 4.0% 2.0% 0.0% source: VLSI Research Inc. - Fall '96 actual -> <- forecast

14 Automation ROI: Utilization Cycle Time Yield Improvement Human Errors Safety

15 Equipment Utilization Fab Equipment Utilized 40% (SEMATECH study) No Material 20% Unsched. Downtime 20% Scheduled Downtime 20%

16 Equipment Utilization Memory Test Utilized 80% Logic / MS Test Utilized 65% Setup Time 5% No Material 5% Unsched. Downtime 5% Scheduled Downtime 5% ASIC Test Setup Time 15% No Material 10% Scheduled Downtime Unsched. 5% Downtime 5% Setup Time 20% Utilized 50% No Material 20% Scheduled Downtime 5% Unsched. Downtime 5%

17 Wafer Probe Test Head Wafer Prober Test Mainframe Electroglas Tokyo Electron Ltd. Tokyo Seimitsu Co. Advantest Credence Hewlett Packard LTX Corp. Schlumberger Teradyne

18 Fixturing - The Real Issue Tool Automation Setup Time is significant Multiple Prober Configurations Loading Alignment Probe Card Tester Form Factors

19 Tester Design From the Inside -> Out

20 Tester Form Factors

21 Interface Variations

22 Interface Proliferation

23 Probe Card Complexity

24 EPICenter Electroglas Probing Integration Center

25 EPICenter Tester Probe Card Prober The Vision To be the center of excellence for integration of the prober, probe card and tester technologies.

26 EPICenter What is the EPI Center? Electroglas Probing Integration Center Is an Industry resource sponsored by Electroglas and Partners where: Partners can fully integrate, optimize and test combined probe solutions prior to delivery to customers. New Probe technologies can be characterized. Customers can see & evaluate standard state-of-the-art wafer probe systems. Public domain information can be shared on probe technology. Is not: A way to gain or lose proprietary intellectual property. Customer specific problem solving

27 EPICenter The Concept Customers: Semiconductor Manufacturers Competitors: Prober Mfgrs. Company Complementors: Tester Mfgrs. Probe Card Mfgrs. Interface Developers. Suppliers: Hardware, Software, OEMs, etc. source: Co-opetition - Brandenburger & Nalebuff

28 EPICenter EPICenter Organization Organization The Partners The Partners EPICenter Customers Temptronics Manufact Cognex Manufact OEM Suppliers Keithley Manufact H.P. Manufact Parametric Tester Manufacturers H.P. Manufacs Schlumberger Manufact Teradyne Manufact Functional Tester Manufacturers FormFactor Manufac Probe Tech. Manufac Wentworth Manufact Cerprobe Manufact Probe Card Manufacturers Manufact Xandex nufact Interface Developers TEL Manufa TSK Manufac Competitors Standards development, etc. only Private Public

29 EPICenter The Partners Keithley Instruments (Parametric Testers) Hewlett Packard (Para. and Functional Testers) Teradyne (Functional Testers) Schlumberger (Functional Testers) Cerprobe (Probe Cards) Wentworth (Probe Cards) Probe Technology (Probe Cards) FormFactor (Probe Cards) Xandex (Probe Products) Temptronic (Thermal Systems)

30 EPICenter The Benefits The Customer Turnkey solutions upon delivery. Reduced integration costs. Reduced time to volume. Optimized performance: Mechanical Setup Electrical Setup Probing Process Throughput / Productivity

31 EPICenter Status Phase 1 - Completed Confirm EGLS Commitment Sign up Initial Partners Press Release Announcement Phase 2 - Started Commence Staffing Set-up Facility Establish Website Initiate First Integration Project

32 Automation Responsibilities Inter-Bay Any Automation Company Intra-Bay Any Automation Company Tool Automation Material Handling - Prober Companies Fixturing setup - Prober / Tester / Probe Card Companies

33 Wafer Probe A Look Forward... Wafer Fab Ship / Assembly Wafer Test Laser Repair Off- Line Ink Material Stock Material Stock Laser Repair Fixture Stock? Mount Scribe Dicing

34 STeP Strategic Test Partners When can we turn out the lights at Probe? Ron Leckie