ESD IEC EN IPC-A- 610-F ISO 9001 ISO 13485

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1 L-Tek Production

2 L-Tek specialises in the production of prototypes, small and medium-sized serial products. Our offer includes all phases of the product s life cycle: design of electronic circuits (PCBs), software development, purchase of suitable components, production, assembly, testing, control and dispatch, IoT, development and manufacture of medical products. L-Tek employs more than 40 highly motivated and qualified engineers specializing in software, electronics and electromechanics. Based on extensive knowledge and experience, our team is able to develop, create and produce various types of electronics and related software from the conceptual stage to the realization. All processes are carried out in an ESD environment and in accordance with IEC EN and IPC-A- 610-F requirements and with the quality system ISO 9001 and ISO In order to ensure continuous production, we manage our inventories of more than ten thousand different components. All components are provided by verified suppliers and the compliance of components is indicated by RoHS2 and REACH statements. Both in the production of prototypes and in the execution of production operations, L-Tek relies on the expertise of its highly specialized technical groups in the design, development and realization of customer s requirements. When carrying out orders, our work process is composed of the following steps: Conceptualization Design of printed circuit boards (PCBs) Creating documentation Prototyping Software Preparation Functionality testing Testing in extreme and special conditions Thermographic measurements Serial production

3 1. 3. PREPARATION PREPARATION OF PRODUCTS PRODUCTION OF SMD THT PRODUCTION ALLOCATION OPENING 10. PACKING 9. FINAL OVERVIEW COMPOSITION PROGRAMMING AND TESTING 7.

4 Storage The components can be stored in a repository with automated control of temperature and humidity, which prolongs their life. Components that require storage under special conditions are stored in drying cabinets according to the requirements of the IPC standard (MSL Level). The maximum life of components is thus ensured. Preparation Before the start of production, the material is prepared in the warehouse, the technological procedure is defined by the technologist, and machines and materials are prepared by the operator for smooth work. Traceability Traceability is ensured by labelling components with serial numbers, which makes them traceable through all stages of the product manufacturing process. Each order is provided with a work order comprising the list of the required materials. In the event of tracking requirements per component, or of manufacturing medical products or at the request of the subscriber, a full tracking system is used. Our internal full tracking system allows us to identify the components used in the product.

5 SMD and THT Manufacturing For the application of solder paste, we use high-tech equipment which allows for solder and adhesive to be dosed. We offer two-sided printing (step-by-step), as well as dispensing without printing and templates. We can use a low melting paste for thermally sensitive products/components. We offer formulation of templates, within which the form of drops is examined and shaped technologically according to the desired volume and surface of the paste application, as well as production of formwork and advice on the production of PCBs with regard to the production process (sizes, plates, bridges, technological edge, V-cut, etc.). We use machine cleaning of templates as well as cleaning of offset prints (misprints). We use four state-of-the-art lines for laying components that are installed on a printed circuit board, either by means of vacuum or mechanical gripping devices. Each installed component is checked by a high-resolution optical camera before laying to verify its suitability and orientation. Components can also be glued. After the components are laid, automatic control of AOI is carried out to check the correctness of the laid components (rotation, delay, position, etc.). The deposited ingredients can be refilled using various technological processes, such as a tunnel oven and a steam chamber soldering device (steam phase). L-Tek carries out selective machine soldering of circuits in a nitrogen atmosphere with a large number of SMT and THT components and soldering of special components by hand when machine soldering is not possible.

6 Our production consists of four lines consisting of state-of-the-art PCB assembly equipment: Automatic Loading Solder paste printing SPI control SMT assembly Pre-reflow control Reflow soldering Automatic unloading AOI Automatic optical inspection Features: SMT: Components of size from to 50 x 50 x 31 mm BGA Ø = 0.25mm, min raster: 0.4mm option; BGA Ø = 0.2mm, min raster: 0.3mm PoP (package on package) TIV: size from 60 x 60 mm to 800 x 450 mm (IINEO1 - enogenic) size from 60 x 60 mm to 450 x 510 mm (IINEO2 - two-headed) Capacity of production according to components: up to 55,000 components/hour PCB thickness: mm THT: Selective soldering with ERSA Inert gas technology (Nitrogen) PCB size from 60 to 406 mm, length up to 508 mm

7 Testing Reparation Composition Test and programming devices for specific products may be developed at the request of the client or delivered by the buyer. Products can be tested already in the production phase or as final products in the casing. If a product needs to be repaired, we use the Rework station, which enables precise repositioning of BGA components. We offer the possibility of assembling various parts, which can be either grouped together or into the finished product. We can thus assure the customer the delivery of the final product with the traceability of all components.

8 Control Process AOI Automatic Optical Inspection System Visual Control The quality of our products is ensured by performing component input control, control of the first piece in the series, interim control and final control. We also perform an optical scan of the circuits (AOI), in which the correct position and the corresponding compatibility of the deposited components are automatically checked. SPI Solder Paste Inspection Automatic optical scanning is a key technology when scanning electronic circuits. It provides a quick and accurate overview of electronic circuits in order to ensure adequate high-quality products. AOI detects errors such as contacts, component delays, and other maladjustments in laying. The procedure is performed with one main and four side cameras. Laser is used to measure the height, which allows viewing in 3D technology. At all stages of the production process, checks are carried out visually, enabling us to detect irregularities during the manufacturing process. SPI allows for examining the application of solder paste while electronic circuits are being laid. Application of solder paste is one of the key steps that influence the composition of circuits and the quality of finished products. In the process, we use angular cameras that capture the 3D image, thus measuring the volume of the paste and checking its alignment.

9 Certificates At L-Tek, we have the appropriate facilities for producing small and medium-sized series according to the requirements of the ISO 9001 standard at competitive prices. We offer the development and production of medical products in accordance with the requirements of the medical standards ISO and ISO 14791, ISO and ISO We also carry out operations according to the IPC-610 standard and in accordance with the RoHS2 and REACH directives. L-Tek d.o.o., Obrtna cesta 18, 8310 Šentjernej - SLOVENIJA t: f: info@ltek.si