Outline. Bioplastics in Electronic Applications - NEC S Perspective. 2.Use of Bioplastics in Japan

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1 Outline 1. NEC s environmental friendly plastic for electronic products 2. Use of bioplastics in Japan Bioplastics in Electronic Applications - NEC S Perspective 3. Development of highly functional bioplastics by NEC -Heat-resistant -reinforced bioplastic -Flame-retarding bioplastic Nano Electronics Research Laboratories NEC Corporation 1 -Shape memory bioplastic -Heat-conductive bioplastic 4. Conclusion 2 1. NEC s Environmental Friendly Plastic for Electronic Products Environmental friendliness Petroleum-based plastics Bio-plastics Reduction of petroleum exhaust and CO2 gas generation Decrease of chemical risk (Flame-retardancy with non-halogen and non-phosphorus) NEC aims high environmental friendliness of electronic products by using its original eco-plastics. NEC Labs fundamentally develops original eco-plastics and then, collaborates with material producers in 3the mass-production. Bioplastics aid reduction of petroleum resource exhaust and CO2 gas causing global warming, and thus, get high interests in Japan. Bioplastic (Polylactic acid: ) has been begun to be used in electronic products, in addition to table ware, sealing, and fiber. -Merit: Increase of environmental friendliness of products -Subject: Improvement for practical characteristics with keeping bio-mass content and safety Air CO2 2.Use of Bioplastics in Japan Plants Bioplastics (Polylactic acid: ) Corn 4 Table ware Sealing Fiber Electronic products Practical characteristic should be improved. 1

2 Resent Main News of Use of in Electronic Products in Japan 2 June: Fujitsu firstly started to use it in a part (IR mask) in PC 2 Aug.: Sony used it in housing of Walkman 4 Sep.: NEC used / composite in dummy cards in PC 3. Development of highly functional bioplastics by NEC 5 Jan. : Fujitsu used flame-retarding composite (petroleum-based plastic alloy including phosphorus flame retardant) in PC housing 6 March: NEC and NTT DoCoMo started the use of / composite in ECO-cellular phone (FOMA-N-71iECO) 5 6 NEC s Strategy of Development of Bioplastics ( composites) for Electronic Products Top level biomass-content, safety and performance 1) Improvement of practical characteristics (heat resistance, strength,etc) of by using biomass-based additives - Developing a heat resistant / composite (biomass-content: 9%) and applying it to housing of cellular phone, etc. 2) Increase of flame retardancy of with safe flame retardant to expand its use to main electronic products - Developing a flame-retarding composite by using a metal hydroxide without halogen and phosphorus and applying it to housing in PCs, etc. 3) Increase of performance of by adding unique characteristics to create new products - Developing a shape memory composite and an heat- conductive composite and applying it to new mobile products, etc (1) Heat resistant / Composite [ Accomplishment ] Developing an highly heat-resistant composite by the combination with kenaf fiber (Maintaining high biomass ratio :9%) [ Technical Points ] a) The fiber of (efficiently fixates CO2) increases s heat resistance, modulus and crystallization rate. b) The impact strength was improved by adjusting the fiber length and adding a biomass-based flexibilizer c) The moldability was improved by adding a special crystallization promoter (Molding time: Less than 5 seconds/ 1 o C. ) 87 8 Increases in CO2 gasses cause global warming. CO2 Biomass (Corn,etc.) plantation Fiber Fermentation Polymerization CO2 fixation is 3 to 9 times higher than that of other plants. / Composite Elastic modulus: 1.7 times HDT: 1.8 times ポリ乳酸 Fiber / composite and with kenaf fiber 2

3 What is? High ability to fixate CO 2 Photosynthesis speed is 3-9 times faster than other usual plants Principal use: textile, paper, animal food fiber (5mm length) Other additives Production of / Composite Mixing (18-19 o C) Screw kneader Molding Molded parts field in Australia (Nature Trust Co.) Use of kenaf fiber as filler for plastics Previous studies Compression molding for sheet application of automobile and building NEC s development Injection molding for parts and housing of electronic products 9 4 Cutting Molded parts 1 Injection mold machine Heat resistance Heat distortion temp. / o C Heat Resistance and Modulus of / Composite Petroleum resourced plastic without fiber (ABS) Load:1.8MPa fiber content / wt% Adding of 15%of kenaf-fiber increases heat distortion temp. and modulus of because the fiber retards s deformation. 11 Elastic modulus /GPa Modulus Petroleum resourced plastic without fiber (ABS) fiber content / wt% Improvement of Impact Strength of / Composite fiber Cross section of broken /kenaf fiber composite Impact strength / kj-m Twin screw mixing Single screw mixing + + kenaf kenaf (5mm) (<5mm) without short fiber 1. Keeping adequate length of kenaf fiber + kenaf (5mm) without short fiber +Flexibilizer - fiber without short one increases the amount of energy required for pulling it out when the composite is broken. -Single screw mixing (low shear) of kenaf fiber and prevents cutting of the fiber. 2. Adding flexibilizer A biomass-based copolymer of lactic acid and aliphatic polyester effectively works as a shock absorber for the composite

4 Characteristics of / Composite Practical Production and of / Composite and Using it in ECO-Cellular Phone Biomass-content (wt%) without inorganic components / * composite 1 9 Polycarbonate with glass fiber Practical production of / composite (Top level biomass:9%) by the collaboration with Unitika. LTD DTUL (.45MPa) ( o C) Impact strength (kj/m 2 ) Flexural modulus (GPa) Flexural strength (MPa) Gravity (g/cm 3 ) * Unitika LTD mass-producing FOMA-N71iECO First use of bioplastic : / composite in casings of cellular phones by the collaboration with NTT DoCoMo (March,6) Expanding the use to other mobile products (2) Flame-Retarding Composite [Accomplishment] -Developing a highly flame-retarding composite without toxic chemicals such as halogen and phosphorus to expand its use to main electronic products (PC, etc). [Technical Points] a) The with a metal hydroxide (a component of soil) achieves high flame retardancy (UL V) for the use in housing of electronics products such as PC, etc. Effect of safe flame retardant (a metal hydroxide) Highly flame resistant Average flaming time ( sec. / UL std) Target level was cleared UL std Level:V- Special Metal hydroxide Content (wt%) Special Metal hydroxide Flame-Retarding Behavior of Composite Ignition Flame-retarding composite b) Unique additives can recover other important characteristics, which are comparable to flame-retarding polycarbonate with GF. 15 Absorbing heat during combustion 16 Self-extinguishing 4

5 (3) Shape Memory Composite [ Accomplishment ] Development of new biomass-based plastics performing shape memory and Development recycling (rewritable of a new shape intelligent memory) bioplastic () performing shape memory and recycling (recyclable shape memory) [ Technical Points ] a) Introducing thermo-reversible bonding In the structure of provides it with shape memory and enables it to be recycled (re-molded). b) Application of the plastic in electronics creates new products Free-style products, shapes of which are selected by consumers 17 Melt Products ~16 o C ~6 o C Recycling Thermoswitch Shape memory Recyclable Shape Memory Thermo-Reversible Cross-linked Structure of Shape Memory Composite Thermo-reversible bond (Diels-Alder reaction) Heating Cooling This bond dissociates to two functions by heating and these functions associated by cooling. -Cross-linked can performs shape memory. -Dissociated can be recycled. 18 Thermo-reversible crosslinking structure Molecules of Heating at high temp. Cooling Cross-linked Shape memory Melted Recycling Shape Memory and Recycling Free-style (Wearable) Mobile Products in Future Using Shape Memory Thermo-reversibly cross-linked Heat (6 o C)+ Force Melting and re-molding (16 o C) Recycling Heat (6 o C) Heat (6 o C)+ Force Heat (6 o C) Performing stable shape memory and recycling 19 5

6 (4) Heat-Conductive Composite Heat Diffusion of Heat-Conductive Composites [ Accomplishment ] Creation of a cross-linked structure of carbon fiber in achieves high heat conductivity, which improves heat-release issues caused by future small and thin sized electronic products (mobile phones, note-pcs, etc) < Infrared Thermo-graph: After 3sec > resin Stainless Steel (SUS34) New Bioplastic (CF 3%) Specimen(plate 1.5mmt) Cross-linked structure of carbon fiber in Unique binder (biomass-based) Heat-conductive housing made from the comp. Electronic parts generating heat Heat flow Heat Flow Observed Fluorocarbon resin (PTFE) Heater:7 Carbon fiber (>1%) resin Housing of composite High heat-release in the plane direction of the housing by the cross-linked carbon fiber in Heater (7 o C) The heat diffusion ability of the new bioplastic composites: With CF 1% : Comparable to stainless steel With CF 3% : Twice more than Stainless The densities ( ) of the composites are less than half that of conventional thermally conductive plastics based on petroleum-resourced Temperature change of the reverse side 55 Stainless steel Heat Diffusion in Plane Direction of Heat Conductive Coposite Temperature change of the upper side (after sec) Temperature( o C) New Bioplastic (CF15%) Stainless steel New Bioplastic(CF15%) Time(sec) 23 <Infrared Thermography> Observed Measured After sec Stainless steel:48 o C New Bioplastic:41 o C Heated poise weight :8 o C specimen(plate 1.5t) 4 Conclusion -In Japan, electronics producers have begun to use bioplastic () in their products to increase the environmental friendliness. -NEC developed an heat resistant / composite while keeping high biomass ratio and started to use it in housing of cellular phone from March 6. -To expand its use in electronic products, NEC has developed a flameretarding without toxic halogen and phosphorus and will start to use it in housing of PC, etc. -Also, new functional composites performing shape memory and heat conductivity have been developed for the use in future mobile electronic products. -NEC will replace petroleum-resourced plastics in their electronic products to these bioplastics more than 1% until