BGA gel flux series IF Physical and chemical properties: : sweet, mild Halide content : none ph (5% aq.sol) : 3 IPC/ EN : RE L0 137 C.

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1 BGA gel flux series IF 8300 INTERFLUX ELECTRONICS N.V. Technical data IF 8300 series Ver: 1, 25-jan-08 latest version on Page 1 No-clean, halide free tacky gel flux Description: Interflux IF 8300 is a noclean, halide free tacky gel flux. The IF 8300 gel flux series is compatible with both lead-free and lead containing alloys. IF 8300 series provides resinlike rheological properties. More information: Reflow profile 2 Profile recommendations SnPb alloys Profile recommendations Pb free alloys 2 3 Test results 4 IF 8300 exhibits good wetting on virtually all surface finishes including OSP, NiAu, I-Sn...etc. The residue is minimal and transparent and does not require any cleaning. The IF 8300 series can be applied by printing, dispensing or by brush. IF 8300 is available in different viscosities for different applications. Physical and chemical properties: State : viscous Colour : yellow Odour : sweet, mild Halide content : none ph (5% aq.sol) : 3 IPC/ EN : RE L0 Key advantages: True halogen free Classification to IPC and EN: RE L0 Excellent wetting on Sn/Pb, Ni/Au, OSP, Ag/Pd Availability IF 8300 IF IF Flash point 158 C 144 C 137 C Solubility in water insoluble insoluble insoluble Auto-ignition point Specific gravity Viscosity at 20 C > 370 C 1,032 g/ml ± cps > 370 C 1,020 g/ml ± cps > 370 C 1,013 g/ml ± cps

2 Technical data IF 8300 series Page 2 Reflow profile General description In general a soak profile is advised and may be used when temperature differences across a board, due to a high mix of components or large board sizes, need to be levelled out. Or when the number of voids, if present because of material combination, need to be decreased. When soldering in air the profile s peak temperature should occur within a frame time of maximum 300sec or 5 minutes from the profile s starting point. The correct conveyor speed (m/min) can be calculated by dividing the total chamber length (m) of the heating zones by the desired process time (min). Soldering under nitrogen has fewer limitations. When soldering an assembly in a lead free solder process, care must be taken not to overheat components especially when using air convection or IR ovens. It is very important to know the temperature limitations of the components used on the board. To get a good thermal mapping of the board it is advised to use thermocouples and a thermal measuring tool. Measure on small outline, big outline and temperature sensitive components. Measure on the board side near the conveyor chain, in the middle of the board and close to, or on heat sinks. Profile recommendations SnPb and SnPbAg alloys Preheat From room temperature until ±150 C at a rate of 1-3 C/s. Faster rates could result in component cracking due to absorbed moisture evaporating. Soak zone Around 150 C. A soak zone is used to level out temperature differences on a board. It is often used in IR ovens and on boards with a big diversity of components and Cu distribution. Ramp to reflow From 150 C to peak temperature. of different thermal expansion coefficients inside the components. Reflow Peak temperature related to component specifications, in general from C. Time above liquidus: In general 30s-90s Cool down of different thermal expansion coefficients of the materials involved. Max : +4 C/sec Min : 30sec Max : 120sec Max : 230 C Min : 200 C Min: +0,5 C/sec Max : +3 C/sec Max : +1 C/sec Max : +6 C/sec Min : +2 C/sec preheat soak reflow cooling

3 Technical data IF 8300 series Page 3 Profile recommendations SAC and SnAg alloys Preheat From room temperature until ±150 C at a rate of 1-3 C/s. Faster rates could result in component cracking due to absorbed moisture evaporating. Soak zone Around 170 C. A soak zone is used to level out temperature differences on a board. It is often used in IR ovens and on boards with a big diversity of components and Cu distribution. Ramp to reflow From 170 C to peak temperature. of different thermal expansion coefficients inside the components. Reflow Peak temperature related to component specifications, in general from C. Time above liquidus: In general 30s-90s Cool down of different thermal expansion coefficients of the materials involved. Max : +4 C/sec Min : 30sec Max : 120sec Max : 245 C Min: +0,5 C/sec Min : 230 C Min : +2 C/sec Max : +3 C/sec Max : +1 C/sec Max : +6 C/sec preheat soak reflow cooling

4 Technical data IF 8300 series Page 4 Test results conform EN (2002) and IPC J-STD-004A Property Result Method Chemical copper mirror pass J-STD-004A IPC-TM qualitative halide silver chromate (Cl, Br) pass J-STD-004A IPC-TM acid value by titration 28,9 mg KOH/g Environmental SIR test pass J-STD-004A IPC-TM D i s c l a i m e r Because we cannot anticipate or control the many different conditions under which this information and our products may be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation. Users of our products should make their own test to determine the suitability of each such product for their particular purposes. The product discussed is sold without such warranty, either express or implied. Product information in other European languages can be obtained at Interflux Electronics NV, 9042 Gent. Because we cannot anticipate or control the many different conditions under which this information and our products may be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation. Users of our products should make their own tests to determine the suitability of each such product for their particular purposes. The products discussed are sold without such warranty, either expressed or implied. Copyright: INTERFLUX ELECTRONICS For the latest version of this document please consult:

5 REPAIR & REWORK ACCESSORIES No Clean Flux Pen MODEL NO. : N (11.5 ML) No clean flux easy to apply Tech Spray, USA No dirty table Easy apply high Precision Application Flux is resin and halide free. Provide optimum wetting on wide range of surfaces. Excellent wetting ability. Excellent for poor solder ability surfaces. circuit board repair and rework. Solvent Dispencer Model AT-180SD Solvent dispenser ESD safe with steel less steel pump protect against cross contamination by keeping fluid from returning to dispenser. output of liquid is restricted to spell on worktable using cap type design From: AT ESD Safe Refillable Flux Pen BON 102 ESD Safe Conductive Pen MODEL NO. : N (4.89 ML) Fast dry silver Ink design to make quick conductive traces. Repair traces link components make smooth jumpers. circuit board repair and rework. From: TechSpray, USA Overcoat Pen MODEL NO. : GN (5 ML) Insulate traces against high voltage arcing Provide protection from moisture and fungus. Precision application suitability. circuit board repair and rework. From: TechSpray, USA Conformal Coating Remover MODEL NO. : N (10 ML) Quick removal of conformal coating like acrylic, urethane and silicon type. From: TechSpray, USA Non-corrosive. Evaporate quickly. circuit board repair and rework. TIP REFRESHER MODEL NO. : BS-2 Remove the oxides on tip & restore the wetting capability on the tip. One can use tip for longer time. Very useful in lead free process as tips are getting oxide fast.? From :Goot Japan Before After ESD Safe and Refillable ( use Flux of your choice) Extra Brush available. Workout much economical for user. Flux easy to apply No dirty table Easy apply for high Precision Application No extra flux on work job. No Clean Rohs VOC FREE Flux also supportedby us in 1 Ltr Packing of Interflux. NEEDLE FLUX DISPENSERS Stainless Steel Replacement Needles UNIQUE, NO LEAK DESIGN! MEETS ANSI (J-STD-001B) Plato new POS-A-LOC leak proof liquid dispensers offer a convenient way to dispense precise amounts of a variety of liquids without dripping, spilling or Waste. ESD Safe NO LEAK Plato Flux Bottles From Plato, USA have all the features of our standard flux bottles, and meet the requirements of ANSI (J-STD-001B). FD-21-2 oz. dispenser bottle with.010" (.25mm) needle. SF-01-2 oz. ESD Safe, dispenser bottle with.010" (.25mm) needle. Brush Scrub Bottle Handy 2 oz. (59ml) polyethylene solvent dispenser with scrub brush provides an inexpensive and safe method to spot clean PCB assemblies. SB-2N - 2 oz. bottle with nylon bristles that have medium stiffness for general flux Removal. Durable and works well for flux removal and general cleaning. Combination of static dissipative jacket and natural material meets ANSI (J-STD-001B). Leak Proof Double Seal Pos-A-Loc No Leak Assembly ½

6 Solder Assist Offset chip holder 0 Split 45 lever Square scraper/chisel 0 45 chip holder Slotted shaft Knife From: Goot Japan SOLDER ASSIST (6 TOOLS PER SET) MODEL SA-10 Desoldering Wick Curved needle Tapered needle Stainless steel brush Spring hook Tapered reamer Brass brush MODEL NO. : CP - SERIES Cleaning SMD component surface before Placing new component. Desoldering PTH components Bridge removing excess solder removing. Manufactured in Japan to high quality standards. Individually sealed packaging Non-chlorine, negligible halogen content, No-Clean RMA flux. Low cost Greater heat transfer from soldering iron tip through only one layer of copper braid. Reduced damage to the PCB surface. Since heat transfers faster to the surface (through only one layer of braid), solder removal, in small areas, can be accomplished at lower soldering iron temperatures. Much less residue left on the work surface! Less flux used in processing more friendly on the environment Great for removing solder from tiny areas or in fiddly positions. Very suitable for lead free soldering applications. The higher melting point of lead free alloys often means that users must operate at high temperatures to heat the solder through the desoldering braid. Since the F-Type braid is thinner, heat transfers faster, melting the solder faster. Very suitable for Bridge Repair temperature. From : goot Japan Solder Wire No Clean Alloy 63/37 & LEAD FREE Deferent dia available Solder Meet QQ-S-571 Quality Flux Meet Bell core and IPC Standard Provide Fast wetting Low smoke generation Long solder tip life Perfect even for SMT Application SMD/BGA Repair Flux ( gel form) IF-8300 We have many other type fluxes alcohol based too for commercial application to military grade application, Please contact us for your requirements. This is completely halogen free and guarantee long term reliability and good solderability capabilities Withstand high temperature and evaporate on sufficient heat. The minimum transparent residue need not to clean it can be applied with help of Brush, dispensing syringe and can be liquefied as per utility using thinner in 30% ratio. Depending upon application. Flux is tacky and can hold SMD component. Standard Packing is 100 gm Jar Packing. Contact back for TD, MSDS and test reports. Solder Reel Holder Maximum load of 1kg. Heavy base ensures extra stability. Guide spring to avoid solder tangle.*solder is not included. Spindle diameter : Ø16mm From :Goot Japan Dimension W (93) X D (120) X H (110) mm, Wt. 650 gm. MODEL NO. : ST-51 Other Useful Products Fume Absorber Soldering Stations Magnifiers Soldering/desoldering PTH SMD Rework system Desoldering Gun PTH Flash magnifier All dimensions are shown before tinning and are subject to manufacturing tolerances. ADVANCE TECH SERVICES PVT. LTD , GD-ITL Towers, B-8, Netaji Subhash Place, Pitampura, Ring Road, New Delhi Ph : upto 27, Fax : info@advancetechonline.in web: B.O : Bangalore Pune PRODUCT RANGE: Soldering Desoldering for SMD/PTH, Solder POT, Electric Screw Drivers, Pneumatic Screw Driver, Torque Meter, Screw Torque deciders, Screw Feeders, Balancer, Torque Arm, Air Dispenser, Air Free Dispenser, Syringes and Barrel for dispenser, Flux, Spray Fluxer, Desolder Wick, Static Charge Meter, Ionizers, Ion Gun, Illuminated Magnifiers, Hand tools (Cutter, strippers, Pliers, crimper, Cable cutters etc.. ESD Products, Peelable Mask, Solder Bath Treatment, Rework Pens (Conductive pen, flux pen, green over coat pen, conformal coating remover pen), Imported stations soldering bits, Bit Cleaning sponge, Screw driver bits and many more... 2/2