Part No.: ZLMR1608 Series Specification

Transcription

1 1. Scope This Specification is applied to the Pb free SMD Chip Ferrite bead for ZLMR1608 Series Product. 2. Part Number Code ZLMR 1608 D 121 G T (1) (2) (3) (4) (5) (6) (1) Series Number: ZLMR-Magnetic bead; ZLDL-Multilayer Inductor; ZLMS-Common Mode Choke; ZLNR-Magnetic Inductance; ZLML-High Frequency Winding inductance; ZLHC-Power Inductor; ZL2S-Color Loop Inductance; ZL2W-DR Core; ZLRH-Shielding Inductance; ZLSR-Integrated Inductor; etc. (2) Dimension Code: 0603/1005/1608/2012/3216 etc means L1.6mm*W0.8mm. (3) Production Code: A,B,C,D...T...etc., (4) Inductance Code: for example: 300=30Ω; 121=120Ω, 102=1000Ω etc. (5) Type Code: G: For General Use; J:For High Speed; P: For Large ; H: For high Frequency (6) Packaging Code: T-Tape; B-Bulk 3. External Dimensions Unit: mm [inch] Series Name L W T A ZLDL ± ± ± ±0.1 [0402] [.039±.006] [.020±.006] [.020±.006] [.010±.004] ZLDL ± ±0.2 [0603] [.063±.006] [.012±.008] ZLDL (+0.3, -0.1) 1.25± ± ±0.3 [0805] [.079 (+.012, -.004)] [.049±.008] [.033±.008] [.020±.012] ZLDL ± ± ± ±0.3 [1206] [.126±.008] [.063±.008] [.033±.008] [.020±.012] 4. Electrical Characteristics For General Use Part Number Impedance Z Test Frequency Max.DC Resistance Max.Rated Thickness Units Ω MHz Ω ma mm [inch] Symbol Z Freq. DCR Ir T ZLMR1608D050GT 3~ ZLMR1608D110GT 7~ ZLMR1608D300GT 30±25% ZLMR1608D600GT 60±25% ZLMR1608D800GT 80±25% Page 1 of 6

2 ZLMR1608D101GT 100±25% ZLMR1608D121GT 120±25% ZLMR1608D221GT 220±25% ZLMR1608D301GT 300±25% ZLMR1608D471GT 470±25% ZLMR1608D601GT 600±25% ZLMR1608D751GT 750±25% ZLMR1608D102GT 1000±25% ZLMR1608D152GT 1500±25% ZLMR1608D182GT 1800±25% ZLMR1608D222GT 2200±25% ZLMR1608E800GT 80±25% ZLMR1608E121GT 120±25% ZLMR1608E181GT 180±25% ZLMR1608E301GT 300±25% ZLMR1608E601GT 600±25% ZLMR1608E102GT 1000±25% ZLMR1608E202GT 2000±25% ZLMR1608U050GT ZLMR1608U100GT ZLMR1608U300GT 30±25% ZLMR1608U600GT 60±25% ZLMR1608U121GT 120±25% ZLMR1608U221GT 220±25% ZLMR1608U301GT 300±25% ZLMR1608U471GT 470±25% ZLMR1608U601GT 600±25% ZLMR1608U102GT 1000±25% For High Speed Part Number Impedance Z Test Max.DC Max.Rated Thickness Frequency Resistance Units Ω MHz Ω ma mm [inch] Symbol Z Freq. DCR Ir T ZLMR1608G220JT 22±25% ZLMR1608G600JT 60±25% ZLMR1608G121JT 120±25% ZLMR1608G221JT 220±25% ZLMR1608G331JT 330±25% ZLMR1608G471JT 470±25% ZLMR1608G601JT 600±25% ZLMR1608G102JT 1000±25% ZLMR1608K121JT 120±25% ZLMR1608K221JT 220±25% ZLMR1608K331JT 330±25% Page 2 of 6

3 ZLMR1608K471JT 470±25% ZLMR1608K601JT 600±25% ZLMR1608K102JT 1000±25% ZLMR1608K152JT 1500±25% ZLMR1608K202JT 2000±25% ZLMR1608K252JT 2500±25% For Large Part Number Impedance Z Test Frequency Max.DC Resistance Max.Rated Thickness Units Ω MHB Ω ma mm [inch] Symbol Z Freq. DCR Ir T ZLMR1608D300PT 30±25% ZLMR1608D750PT 75±25% ZLMR1608D121PT 120±25% ZLMR1608U100PT 5~ ZLMR1608U300PT 30±25% ZLMR1608U600PT 60±25% ZLMR1608U121PT 120±25% ZLMR1608U221PT 220±25% ZLMR1608U301PT 300±25% For High Frequency Part Number Impedance Max. DC Min. Resistan ce 直流 Rated Units Ω Ω ma mm [inch] Symbol Z DCR Ir T ZLMR1608K301HT 300±25% ZLMR1608K471HT 470±25% ZLMR1608K601HT 600±25% ZLMR1608K102HT 1000±25% ZLMR1608U181HT 180±25% ZLMR1608U301HT 300±25% ZLMR1608U471HT 470±25% ZLMR1608U601HT 600±25% ZLMR1608U102HT 1000±25% : Products with other electrical characteristics can be provided upon customer s request. Please contact your local sales. Page 3 of 6

4 5. Equipment Impedance Impedance shall be measure with HP-4286A impedance analyzer or equivalent system. DC Resistance DC resistance shall be measured using HP 4338 digital mili-ohm meter with 4 terminal method. 6. Mechanical Characteristics Electrical Performance Test No. Test Item Specification Test Condition / Method 1 Terminal Strength 2 Substrate Bending Test Without deformation cases Inductance shall be satisfied ± 20% DC resistance shall be satisfied. Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec. After soldering a chip to a test substrate, bend the substrate by 3mm hold for 10s, and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering. 4 Resistance To Solder Heat No visible damage Electrical characteristics and mechanical characteristics shall be satisfied. Consult standard MIL-STD-202 METHOD 210 Preheating : 100 to 150, 1 minute.. SOLDER TEMPERATURE:265 ±3 Immersion time : 6±1 sec Measurement to be made after keeping at room temp for 24±2 hrs. Solder : Sn96.5-3Ag-0.5Cu 5 Solder-ability Test 95% min. coverage of all metabolised area Consult standard J-STD-002 Solder temp. : 240±5 Immersion time : 3±1 sec Solder : Sn96.5-3Ag-0.5Cu Page 4 of 6

5 Reliability & Environment Test and Test Conditions No. Test Item Specification Test Condition / Method Appearance: Temperature +85 ±2 1 HIGH TEMPERATURE RESISTANCE No Mechanical Damage Inductance should be Within ±20% of the Applied current:rated current Testing time:1008±12hrs (maximum value) Measurement:After placing at room ambient Initial Value temperature for 24 hours minimum Humidity:90 to 95 % RH Temperature:60±2 S 2 HUMIDITY RESISTANCE Applied current:rated current (maximum value) Testing time:1008±12hrs (maximum value) Measurement:After placing at room ambient temperature for 24 hours minimum Temperature -40,+85 kept stabilized for 30 minutes each Cycle:100 cycles. Measurement:After placing at room ambient 3 TEMPERATURE CYCLE temperature for 24 hours minimum Step temp±3 30±3 minutes Step2. Room temperature 2 to 5 minutes Step temp±2 30±3 minutes Step4. room temperature 2to5 minutes Temperature -40 ±2 4 LOW TEMPERATURE STORAGE LIFE TEST Testing time:1008±12hours Measurement:After placing for 24 hours minimum at room ambient temperature Temperature -40,+85 kept stabilized for 30 minutes each 5 THERMAL SHOCK Cycle:100 cycles Measurement:After placing for24 hours minimum at room ambient temperature Waveform: Sine wave Frequency:10~55~10 Hz. 6 VIBRATION TEST Sweep time:1min Amplitude:1.5mm(peak-peak) Direction: X,Y,Z(3 axes) Duration:2 hrs./axis, total 6 hrs. Page 5 of 6

6 7. Soldering Recommends Recommendable Reflow soldering profile Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max.also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 max. Unenough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode, When soldering is repeated, allowable time is the accumulated time. Reworking with soldering iron Reworking should be limited to only one time. Note:Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 8. Packaging Information Package Dimension and Quantity Type 1608 Package Amount(PCS) 4000 Paper 9. RoHS compliant Declaration We hereby declare that the components delivered to your company are compliant with RoHS directive 2011/65/EU. 10. Storage Attention: 1) The solderability of the external electrode may be deteriorated if packages are stored where they are at 40 or less and 70 % RH or less. 2) The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). 3) Packaging material may be deformed if packages are stored where they are exposed to heat or direct sunlight. 4) Minimum packages, such as polyvinyl heat-seal packages shall not be opened until just before they are used. If opened, use the reels as soon as possible. Page 6 of 6