Notice for TAIYO YUDEN products

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1 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 20. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. notice_e-0

2 WIRE-WOUND CHIP POWER INDUCTORS(BR SERIES) REFLOW FEATURES Suitable for the use as a choke coil in smaller DC/DC converters. APPLICATIONS BR-series are suitable for an anti-noise measure on the power supply circuit of DSC, DVC, ebook, LCD-TV, mobile phones,pc, game equipments, various communication equipments and etc.. OPERATING TEMP. ORDERING CODE - 40 ~ 5 (Including-self-generated heat) B R T 2 R 2 M ❶ ❷ ❸ ❹ ❺ ❻ ❼ BR ❶Type Wound Chip Power Inductors ❷Characteristic Spec FL, L, HL Low profile C High Current ❸External Dimensions (W L) : mm (inch) 608 (0603).6 0.8mm 202 (0805) 2.0.2mm 206 (0806) 2.0.6mm 255 (06) 2.5.5mm 258 (07) 2.5.8mm 3225 (2) mm ❹Packaging T Tape & Reel ❺Nominal μh example R R R=decimal point ❻ tolerance M K ±% ❼Internal code EXTERNAL DIMENSIONS/STANDARD QUANTITY T e Type A B C L Unit : mm W A Recommended Land Patterns Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. B A C Type L W T e BR L608.6±0.2 (0.063±0.008) BR C608.6±0.2 (0.063±0.008) BR L ±0.2 (0.079±0.008) BR C ±0.2 (0.079±0.008) BR C ±0.2 (0.079±0.008) BR L255 BRFL258 BR L258 BRHL258 BR C258 BR L ±0.2 (0.26±0.008) 0.8±0.2 (0.03±0.008) 0.8±0.2 (0.03±0.008).25±0.2 (0.049±0.008).25±0.2 (0.049±0.008).6±0.2 (0.063±0.008).5±0.2 (0.060±0.008).8±0.2 (0.07±0.008).8±0.2 (0.07±0.008).8±0.2 (0.07±0.008).8±0.2 (0.07±0.008) 0.7 max (0.028 max) 0.8±0.2 (0.03±0.008).0 max (0.040 max).4 max (0.056 max).6±0.2 (0.063±0.008).2 max (0.048 max).00 max (0.040 max).2 max (0.048 max).5 max (0.060 max).8±0.2 (0.07±0.008).7 max (0.068 max) 0.45±0.5 (0.06±0.006) 0.45±0.5 (0.06±0.006) 0.75±0.2 (0.03±0.008) Standard Quantity [pcs] Paper Tape Embossed Tape Unit : mm AVAILABLE INDUCTANCE RANGE Range Type Imax [ma] BR L608 BR C608 BR C608 6 BR L202 BR C202 BR C206 BR L255 BRFL258 BR L258 BRHL258 BR C258 BR L3225 [ma] [ma] 0.2μH [ma] 0.43μH 0.082,050 [ma] [ma] [ma] [ma] [ma] [ma] [ma] [ma] Rdc 0.27μH 0.47μH , μh ,400 μh 0.06,0 μh 0.085,350 μh 0.070,200 μh 0.090,000 μh 0.080,400 μh 0.055,650 μh , ,000 0., , μH μh μH μH μH 4.7μH 4.7μH 4.7μH μH μH 0μH 0μH 0μH 68 wound07_e-02

3 PART NUMBERS 608(0603)TYPE BR L608TR0M RoHS BR L608TR5M RoHS BR L608T RoHS BR L608T3R3M RoHS BR L608T4R7M RoHS BR L608T6R8M RoHS BR L608T0M RoHS BR L608T50M RoHS BR C608TR43M 6 RoHS ,400,0 BR C608TR50M 6 RoHS ,200,050 BR C608TR60M 6 RoHS ,0 940 BR C608TR72M 6 RoHS ,000 8 BR C608TR82M 6 RoHS BR C608TR0M 6 RoHS BR C608TR20M RoHS , BR C608TR35M RoHS ,400 8 BR C608TR45M RoHS , BR C608TR56M RoHS , BR C608TR77M RoHS , BR C608TR0M RoHS BR C608TR5M RoHS BR C608T RoHS INDUCTORS POWER INDUCTORS 202(0805)TYPE BR L202TR47M RoHS ,0,050 BR L202TR0M RoHS BR L202TR5M RoHS BR L202T RoHS BR L202T3R3M RoHS BR L202T4R7M RoHS BR L202T6R8M RoHS BR L202T0M RoHS BR L202T50M RoHS BR L202T220M RoHS BR L202T330M RoHS BR L202T470M RoHS BR L202T680M RoHS BR L202TM RoHS BR C202TR0M RoHS ,500,400 BR C202TR5MD RoHS ,200,0 BR C202TD RoHS ,0,000 BR C202T3R3MD RoHS BR C202T4R7MD RoHS (0806)TYPE Please specify the inductance tolerance code. (M or K) )The saturation current value () is the DC current value having inductance decrease down to 30%. (at 20 ) )The temperature rise current value () is the DC current value having temperature increase up to 40. (at 20 ) BR C206TR0M RoHS ,350,0 BR C206TR5M RoHS ,0 820 BR C206T RoHS BR C206T3R3M RoHS BR C206T4R7M RoHS BR C206T6R8M RoHS BR C206T0 RoHS BR C206T50 RoHS BR C206T220 RoHS BR C206T330 RoHS 33 ±% BR C206T470 RoHS BR C206T680 RoHS BR C206T RoHS wound07_e-02 69

4 PART NUMBERS 255(06)TYPE BR L255TR0M RoHS ,500,350 BR L255TR5M RoHS ,200,50 BR L255T RoHS ,000,000 BR L255T3R3MD RoHS BR L255T4R7MD RoHS (07)TYPE BRFL258TR0M RoHS ,200,200 BRFL258TR5M RoHS ,0,000 BRFL258T RoHS BRFL258T3R3M RoHS BRFL258T4R7M RoHS BR L258TR0M RoHS ,600,000 BR L258TR5M RoHS , BR L258T RoHS , BR L258T3R3M RoHS BR L258T4R7M RoHS BRHL258TR0M RoHS ,000,400 BRHL258TR5M RoHS ,700,0 BRHL258T RoHS ,500,000 BRHL258T3R3MD RoHS , BRHL258T4R7MD RoHS ,0 750 BR C258TR0M RoHS ,550,650 BR C258TR5M RoHS ,0,300 BR C258T RoHS ,800,000 BR C258T3R3M RoHS , BR C258T4R7M RoHS , BR C258T6R8M RoHS , BR C258T0 RoHS BR C258T50 RoHS BR C258T220 RoHS BR C258T330 RoHS 33 ±% BR C258T470 RoHS BR C258T680 RoHS BR C258T RoHS (2)TYPE BR L3225TR27M RoHS ,500 2,850 BR L3225TR36M RoHS ,300 2,750 BR L3225TR5M RoHS ,600 2, Please specify the inductance tolerance code. (M or K) () )The saturation current value () is the DC current value having inductance decrease down to 30%. (at 20 ) )The temperature rise current value () is the DC current value having temperature increase up to 40. (at 20 ) BR L3225TR0M RoHS ,400 2,200 BR L3225TR5M RoHS ,200,750 BR L3225T RoHS ,850,600 BR L3225T3R3M RoHS ,450,200 BR L3225T4R7M RoHS ,300,000 BR L3225T6R8M RoHS , BR L3225T0 RoHS BR L3225T50 RoHS BR L3225T220 RoHS BR L3225T330 RoHS 33 ±% BR L3225T470 RoHS BR L3225T680 RoHS BR L3225T RoHS wound07_e-02

5 ELECTRICAL CHARACTERISTICS DC Bias characteristics Measured by HP4285A 0 BRL608 BRC608 BRC BRL202 H 50M 4R7M R0M H R77M R20M H R0M R72M R43M H 0 M 0M R0M BRC202 0 BRC206 BRL255 BRFL258 H 4R7MD D R0M H 0 R0M H 4R7M R0M H 4R7M R0M INDUCTORS POWER INDUCTORS H BRL258 4R7M R0M H BRHL258 4R7MD R0M H 0 BRC258 0 R0M H 0 BRL R0M wound07_e-02 7

6 PACKAGING Minimum Quantity Type Standard Quantity [pcs] Paper Tape Embossed Tape BR C608 ー 3,000 BR L608 ー 3,000 BR L202 ー 3,000 BR C202 ー 2,000 BR C206 ー 2,000 BR L255 ー 2,000 BR C258 ー 2,000 BRHL258 ー 2,000 BR L258 ー 3,000 BRFL258 ー 3,000 BR L3225 ー 2,000 4Leader and Blank portion 5Reel size Blank portions Chip cavity Blank portions Leader 60 to 320mm 6.3 to 2.6 inch Direction of tape feed 60 to 200 mm 6.3 to 7.9 inch 400 to 560 mm 5.7 to 22.0 inch 2Tape Material 2.5 or less 0.098max.0.5 ( ) 3Taping dimensions Embossed Tape 8mm wide (0.35 inches wide) Card board carrier tape 8mm wide (0.35 inches wide) ) ) 6Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Type BR L608 BR C608 BR L202 BR C202 BR C206 BR L255 BRFL258 BR L258 BRHL258 BR C258 BR L Chip cavity Insertion pitch Tape thickness A B F T K.±0. (0.043±0.004).±0. (0.043±0.004).45±0. (0.057±0.004).45±0. (0.057±0.004).75±0. (0.069±0.004).8±0. (0.07±0.004) 2.3±0. (0.09±0.004) 2.3±0. (0.09±0.004) 2.±0. (0.083±0.04) 2.5±0. (0.085±0.004) 2.8±0. (0.±0.004).9±0. (0.075±0.004).9±0. (0.075±0.004) 2.2±0. (0.087±0.004) 2.37±0. (0.093±0.004) 2.±0. (0.083±0.004) 2.8±0. (0.±0.004) 2.8±0. (0.±0.004) 2.8±0. (0.±0.004) 2.8±0. (0.±0.004) 2.7±0. (0.6±0.004) 3.5±0. (0.38±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 4.0±0. (0.57±0.004) 0.2±0.05 (0.008±0.002) (0.0±0.002) (0.0±0.002) (0.0±0.002) 0.3±0.05 (0.02±0.002) (0.0±0.002) (0.0±0.002) 0.3±0.05 (0.02±0.002) 0.3±0.05 (0.02±0.002) 0.3±0.05 (0.02±0.002) (0.0±0.002) 0.9MAX (0.035MAX).2MAX (0.047MAX).2MAX (0.047MAX).59MAX (0.063MAX).9MAX (0.075MAX).45MAX (0.057MAX).3MAX (0.05MAX).45MAX (0.057MAX).7MAX (0.067MAX) 2.2MAX (0.087MAX).9MAX (0.075MAX) Unit : mm (inch) wound07_pack_e-0 wound07_pack-p

7 RELIABILITY DATA Wound Chip power inductor(br-series). Operating Temperature Range Including self-generated heat ー 40~+5 2. Storage Temperature Range(after soldering) ー 40~+85 Please refer the term of "7.Storage conditions" in. 3. Rated current Within the specified tolerance 4. Within the specified tolerance LCR Meter : HP 4285A or equivalent, : Specified 5. Within the specified tolerance DC ohmmeter : HIOKI 3227 or equivalent 6. Self resonance Within the specified tolerance Inpedance analyzer/material analyzer : HP429A or equivalent HP49A, 492A or equivalent 7. Temperature characteristic change : Within ±5% Based on the inductance at 20 and Measured at the ambient of -40 ~ Resistance to the bendability No damage. The given sample is soldered on the board and then the back side of the board is pushed until it bends 2mm like the figure. Dimension of the board : mm (0.8mm thickness for 608(0603) inductors) Material of the board : Glass-epoxy Thickness of soldering paste : 0.2mm Force Rod 20 R230 Board R5 45 2mm Test Sample 45 2mm 9. Temperature characteristic 202~ Appiled force : N Duration : sec. 608size Appiled force : 5N Duration : sec. No damage.. Adhesion of terminal electrodes Not to removed from the board. The given sample is soldered to the board and then it is kept for 5sec with N stress (5N for 608(0603) inductors) like the figure. N (5N for 608(0603) inductors. Resistance to vibration change : Within ±% The given sample is soldered to the board and then it is tested depending on the conditions of the following table. Vibration Frequency ~55Hz Total Amplitude.5mm (May not exceed acceleration 96m/s 2 ) Sweeping Method Hz to 55Hz to Hz for min. X Time Y Z For 2 hours on each X, Y, and Z axis. Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. wound07_reli-rp wound07_reli_e-0

8 RELIABILITY DATA Wound Chip power inductor(br-series) 2. Solderability At least 90% area of the electrodes is covered by new solder. The given sample is dipped into the flux and then it is tested depending on the conditions of the following table. Flux : Methanol solution containing rosin 25%. Solder Temperature Time 245±5 5±0.5 sec. 3. Resistance to soldering heat change : Within ±% 3 times reflow having the temparature profile of 5sec of ー 5 and 40sec of more than 230. Test board thickness :.0mm Test board material : glass epoxy-resin 4. Thermal shock change : Within ±% The given sample is soldered to the board and then its is measured after 0cycles of the following conditions. Conditions of cycle Step Temperature ( ) Duration (min) ー 40±3 30±3 2 Room temperature Within ±2 30±3 4 Room temperature Within 3 5. Damp heat change : Within ±% The given sample is soldered to the board and then it is kept at the following conditions. Temperature 60±2 Humidity 90~95%RH Time 00 hours. Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs. 6. Loading under damp heat change : Within ±% The given sample is soldered to the board and then it is kept at the following conditions. Temperature 60±2 Humidity 90~95%RH Applied current Rated current Time 00hours. Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs. 7. Low temperature life test change : Within ±% The given sample is soldered to the board and then it is kept at the following conditions. Temperature ー 40±2 Duration 00hours Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs. 8. High temperature life test change : Within ±% The given sample is soldered to the board and then it is kept at the following conditions. Temperature 85±2 Duration 00hours Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs. 9. Standard conditions Standard test condition : Unless otherwise specified, temperature is 20±5 and 65of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 20±2 of temperature, 65±5% relative humidity. is in accordance with our measured value. wound07_reli_e-0 wound07_reli-rp2

9 PRECAUTIONS Wound Chip power inductor(br-series). Circuit Design Operationg Ambient The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the measuring equipment, the household equipment and so on. Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any influences for the human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control systems, the medical equipment and so on. 2. PCB Design Land pattern design. Please refer to a recommended land pattern. Land pattern design Surface Mounting. The conditions of the picking and placing should be checked in advence. 2. The products are only for reflow soldering. 3. Considerations for automatic placement Adjustment of mounting machine. Excessive fisical impact should not be imposed on the products for picking and placing onto the PC boards. 2. Mounting and soldering conditions should be checked in advance. Adjustment of mounting machine The products might be broken if too much stress is given for the picking and placing. 4. Soldering Reflow soldering. Please apply our recommended soldering conditions on the specification as much as possible. 2. The products are only for reflow soldering. 3. Please do not give any stress to a product until it returns in room temperature after reflow soldering. Lead free soldering. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the specification is used. Recommended conditions for using a soldering iron (NR050 Type) Touch a soldering iron to the land pattern not to the product directly. The temperature of a soldering iron is less than 350degC. The soldering is for 3 seconds or less. Reflow soldering. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions. Temperature sec 30 sec 230 min 5sec max Peak 260 0/ 5 0 eating Time sec 5. Cleaning 6. Handling Cleaning conditions. Please don't wash by the ultra-sonic waves. Cleaning conditions. Washing by the ultra-sonic waves might break the product. Handling. Keep the product away from any magnets. Cutting the PC boards. Please don't give any stress of the bending or the twisting for the cutting process of PC boards. 2. Please don't give any shock and stress to the products in transportation. Mechanical. Please don't give too much shock to the product. 2. Please don't give any shock and stress to the products in transportation. The stress for picking and placing. Please don't give any shock into an exposed ferrite core. Packing. Please don't pile the packing boxes up as much as possible. Cutting the PC boards. Please don't give the bending stress or the twisting stress to the products because they might break in such cases. Mechanical. The mechnical shock might break the products. 2. The products might break depending on the handling in transportation. Pick-up pressure. The electrical characteristics of the products might be shifted by too much ficical shock and stress. Packing. The products and the tape might break, if the packing boxes are piled up. 7. Storage conditions Storage. The packing boxes can be kept at the ambient which the temperature is from 0 to 40degC and the humidity is less than 70%. 2. Tthe ambient temperature of less than 30degC is recommended not to get the tape and the solderability worse. 3. Please solder the products by a half year after they have been shipped. Otherwise please use them after checking the solderability in advance. Storage. The ambient of high temperature or high humidity might accelerate to make the solderability and the tape worse. wound07_reli-rp3 wound07_reli_e-0