9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

Transcription

1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : November Version 2 Written by: Sylvain HALLEREAU DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 1

2 Table of Contents Glossary Overview / Introduction Executive Summary Comparison of the Analyzed LEDs Reverse Costing Methodology Oslon LED characteristics 2. Physical Analysis Physical Analysis Methodology Package Characteristics Package X-Ray Package Opening Package Cross-Section Phosphor Package Parameters LED Die GaN Layer Cathode Structure Anode Structure Active Layers LED Synthesis Comparison between Oslon LED and Dragon LED 3. Manufacturing Process Flow. 31 LED Die Process Flow Description of the Wafer Fabrication Units Version 2 : One slide added on the active layers thicknesses. Errors in slide 42 have been corrected. 4. Cost Analysis Synthesis of the Cost Analysis Yields Explanation Yield Hypotheses LED Front-End Cost Front-End : Epitaxy Hypotheses Front-End : Epitaxy Cost Front-End : Epitaxy Cost per Steps Front-End : Other Front-End Cost Front-End : Other Front-End Cost per Steps Front-End Cost per Equipment Family Front-End Cost per Consumable Family Dies per Wafer & Probe Test Back-End 0 : Probe Cost Back-End 0 : Dicing Cost LED Wafer & Die Cost (FE + BE 0) Back-End 1 : Packaging Hypothesis Back-End 1 : Packaging Process Flow Back-End 1 : Packaging Cost Details Back-End 1 : Final Test Cost Component Manufacturing Cost (FE+BE0+BE1) Cost Analysis Evolution Cost Comparison : Oslon versus Platium Dragon 5. Estimated Manufacturer Price Analysis...63 Price definitions Manufacturers financial ratios Binning Impact on Manufacturing Price Ideal manufacturer Price Manufacturing Price with Binning Yield Conclusion by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 2

3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the OSRAM Oslon SSL ultra white LED (ref. LUW CP7P). The Oslon SSL ultra white series have a typical brightness of 100lm with a consumption of 1.12W at 350mA. The component is provided in a specific 2-pins package, compatible with SMT process. It can be used in a wide range of lighting applications, including: Residential retrofits & fixtures Spot lights Task lights Accent lights Professional downlights Shop lighting 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 3

4 Package Characteristics The package is a specific 2-pins package, 3mm x 3mm x 2.2mm Cathode Mark 3mm 2.15mm 3mm 2.2mm Silicone Lens Top view Side view Substrate (Alumina) Anode Thermal Dissipation Pad not electrically connected Cathode The package is a lead-less ceramic carrier, with an overmolded one piece silicone lens. The LED die and protection diode sit on top of a copper plate. Two bond wires are present: one connecting to the LED die and one to the protection diode. Bottom view 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 4

5 Package X-Ray LED Die Via Protection Diode There are only 2 vias connecting the top layers to the bottom electrodes: one for the cathode and one for the anode. The middle electrode is not connected electrically; it is only a heat spreader. Via Plan view XRAY image Anode Heat Sink (unconnected) Cathode Elevation view XRAYS along the X and Y axes 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 5

6 Package Opening Substrate Trace (copper) & heat sink LED Die Substrate (Alumina) Protection Diode Silver epoxy die attach LED Die Bond Wire Protection Diode Top view with lens and fluorescent medium removed SEM image of LED die and protection diode Two wire-bondings are realized to connect the cathode of the LED and protection diode to the ceramic package. The anodes are glued to the trace by a high filled silver epoxy glue by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 6

7 Package Cross-Section LED Die Protection Diode Alumina Substrate Cross-section view Copper Plate Alumina Substrate Copper Plate Cross-section view EDX spectrum of the ceramic package The ceramic package is alumina but a small percentage of yttrium is detected. It could be from yttria or YAG reinforcement by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 7

8 LED Die The OSRAM Oslon die is GaN flipped and bonded to a germanium substrate. The growth substrate has been removed and the GaN active layers thinned and etched to provide a rough emitting surface. Cathode wirebond GaN Optical view : Die emitting Ge substrate Cross-section of die in package : 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 8

9 LED Die Process Flow (1) (2) The main parts of the process: (1) GaN layer composed by buffer GaN, n-gan, MQW and p-gan layers are grown on a sapphire substrate wafer. (2) The p-doped surface is metalized (Ag), mirror layer. (3) Ti, W and Gold layers deposition. (3) 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 9

10 Front-End : Other Front-end Cost Low Yield Medium Yield High Yield Other Front-End Cost Breakdown Cost Breakdown Cost Breakdown Clean Room $22,490 4,7% $22,490 5,5% $22,490 6,5% Equipment $67,250 14,1% $67,250 16,5% $67,250 19,3% Materials $107,630 22,5% $107,630 26,4% $107,630 30,9% Salary $56,820 11,9% $56,820 13,9% $56,820 16,3% Other FE Yield losses $224,441 46,9% $153,825 37,7% $94,275 27,1% TOTAL Other FE Cost $478, % $408, % $348, % FE : Other FE Cost Breakdown Other FE Yield losses 38% Clean Room 6% Equipment 16% The main part of the other front-end cost is due to the yield losses cost (~38%) in the Medium Yield version. This is due to the yield (85% for the medium scenario) and to the high cost of the epi-substrate (~$553). Salary 14% Materials 26% The materials are also important (~26% in the Medium Yield version). The gold used for the contacts is mainly responsible of this value. The germanium substrate is not integrated in the material cost by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 10

11 Front-End : Other Front-end Cost per Steps (1/3) Other FE Steps Cost Breakdown Wafer Inspection $2,00 0,8% Ag Openning - Cleaning $1,58 0,6% Ag Opening - Silver (Ag) Deposition (PVD µm) $1,11 0,4% Ag Openning - Measurement $1,47 0,6% Ag Opening - Litho 1 - Coating $2,54 1,0% Ag Opening - Litho 1 - Baking $0,95 0,4% Ag Opening - Litho 1- Stepper $1,56 0,6% Ag Opening - Litho 1- Development $2,60 1,0% Ag Openning - Measurement $1,47 0,6% Ag Opening - Wet Etching Ag $1,07 0,4% Ag Opening - Litho 1 - PR Removal $1,03 0,4% Ag Openning - Measurement $1,47 0,6% P contact - Cleaning $1,58 0,6% P contact - TiW-Au Deposition (PVD : 0.150µm) $1,38 0,5% P contact - W-Au Deposition (PVD : 0.43µm) $3,45 1,4% P contact - Ti Deposition (PVD : 0.069µm) $1,27 0,5% P contact - Measurement $1,47 0,6% P contact - Cleaning $1,58 0,6% P contact - Litho 2 - Coating $2,54 1,0% P contact - Litho 2 - Baking $0,95 0,4% P contact - Litho 2 - Stepper $1,56 0,6% P contact - Litho 2 - Development $2,60 1,0% P contact - Measurement $1,47 0,6% P contact - Wet Etching Ti $1,20 0,5% P contact - Wet Etching Ti/W W Au $2,70 1,1% P contact - PR Removal $1,03 0,4% P contact - Measurement $1,47 0,6% P contact - Cleaning $1,58 0,6% P contact - Gold-Tin (Au Evaporation (PVD : 0.25µm) $2,72 1,1% P contact - Gold (Au Evaporation (PVD : 2.09µm) $22,55 8,9% P contact - Measurement $1,47 0,6% Bonding Ge substrate $2,07 0,8% Reflow AuSn $2,48 1,0% Sapphire Wafer - Laser Lift-Off $1,80 0,7% CMP Buffer layer $8,12 3,2% Measurement $1,47 0,6% GaN Etching (Rough surface) $0,90 0,4% GaN Pattern - Cleaning $1,58 0,6% GaN Pattern - Litho 3 - Coating $2,54 1,0% Other FE Step Cost Breakdown (1/3) Wafer Inspection Ag Openning - Cleaning Ag Opening - Silver (Ag) Deposition (PVD - Ag Openning - Measurement Ag Opening - Litho 1 - Coating Ag Opening - Litho 1 - Baking Ag Opening - Litho 1- Stepper Ag Opening - Litho 1- Development Ag Openning - Measurement Ag Opening - Wet Etching Ag Ag Opening - Litho 1 - PR Removal Ag Openning - Measurement P contact - Cleaning P contact - TiW-Au Deposition (PVD : 0.150µm) P contact - W-Au Deposition (PVD : 0.43µm) P contact - Ti Deposition (PVD : 0.069µm) P contact - Measurement P contact - Cleaning P contact - Litho 2 - Coating P contact - Litho 2 - Baking P contact - Litho 2 - Stepper P contact - Litho 2 - Development P contact - Measurement P contact - Wet Etching Ti P contact - Wet Etching Ti/W W Au P contact - PR Removal P contact - Measurement P contact - Cleaning P contact - Gold-Tin (Au Evaporation (PVD : P contact - Gold (Au Evaporation (PVD : 2.09µm) P contact - Measurement Bonding Ge substrate Reflow AuSn Sapphire Wafer - Laser Lift-Off CMP Buffer layer Measurement GaN Etching (Rough surface) GaN Pattern - Cleaning GaN Pattern - Litho 3 - Coating 0,0% 5,0% 10,0% 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 11

12 Conclusion Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2010 by SYSTEM PLUS CONSULTING, all rights reserved. OSRAM Oslon SSL ultra white 12