PRODUCT CATALOGUE 2013 / THERMAL INTERFACE MATERIALS /

Transcription

1 PRODUCT CATALOGUE 2013 / THERMAL INTERFACE MATERIALS / CREATING DIMENSIONS

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3 PRODUCT CATALOGUE 2013 / THERMAL INTERFACE MATERIALS /

4 PAGE 04 CONTENT HALA THERMAL NAVIGATOR 06 Selecting the right material THE WAY WE THINK 08 Tomorrow is today and yesterday 09 Service 10 Quality has a principle PARTNERS OF HALA 11 CELSIA TECHNOLOGIES. NanoSpreader, two-phase vapour chamber 12 TTM TOTAL-THERMAL-MANAGEMENT. Your alliance of companies and experts specialising in products and services for Management THERMAL INTERFACE MATERIALS Product Code Conductivity 13 1 GAP FILLER W/mK 14 Silicone Gap Filler / soft TGF-C-SI Silicone Gap Filler / soft TGF-M-SI Silicone Gap Filler / soft TGF-R-SI Silicone Gap Filler / soft TGF-S-SI Silicone Gap Filler / soft TGF-V-SI Silicone Gap Filler / soft TGF-Y-SI Silicone Gap Filler / soft TGF-Z-SI Silicone Gap Filler / very soft TGF-JUS-SI Silicone Gap Filler / very soft TGF-JXS-SI Silicone Gap Filler / very soft / TGF-MSS-SI 2.4 optional fibreglass reinforced 24 Silicone Gap Filler / very soft / TGF-MXS-SI 2.4 optional fibreglass reinforced 25 Silicone Gap Filler / very soft TGF-MUS-SI Silicone Gap Filler / very soft TGF-NXS-SI Silicone Gap Filler / very soft TGF-SSS-SI Silicone Gap Filler / very soft TGF-SXS-SI Silicone Gap Filler / very soft TGF-WSS-SI Silicone Gap Filler / very soft / fibreglass reinforced TGF-CXS-SI-GF Silicone Putty / plastic TGF-XP-SI Silicone Putty / plastic TGF-ZP-SI Silicone Putty / dispensable TGL-F-SI Silicone Putty / dispensable TGL-W-SI Part Gap Filler / dispensable TDG-J-SI-2C Silicone potting gel / 2 parts TCR-I-SI-2C Silicone potting gel / 2 parts TCR-M-SI-2C Silicone-free Gap Filler / siloxane-free TGF-HSS-NS Silicone-free Gap Filler / siloxane-free TGF-Z-NS 15

5 PAGE 05 Product Code Conductivity 41 2 SILICONE FOIL/CAPS W/mK 42 Silicone foil / fibreglass reinforced TFO-A-SI Silicone foil / fibreglass reinforced TFO-C-SI Silicone foil / fibreglass reinforced TFO-D-SI Silicone foil / fibreglass reinforced TFO-H-SI Silicone foil / fibreglass reinforced TFO-K-SI Silicone foil / fibreglass reinforced TFO-T-SI Silicone foil / fibreglass reinforced TFO-X-SI Silicone foil / not reinforced TFO-L-SI Silicone cap TCP-C-SI INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE 52 Insulating film / coated TFO-B-SI 53 Insulating film / coated TFO-F-SI 54 Kapton Film / phase change coated TPC-S-KA 55 PSA Insulating tape / with insulating film TAT-H-CO Acrylate adhesive / thermally conductive TAD-M-AC-2CG INTERFACE MATERIALS ELECTRICALLY NON-INSULATING 58 Phase change film Aluminium film / phase change coated TPC-Z-PC TPC-Z-PC-AL 59 Aluminium film / phase change coated TPC-S-AL 60 Aluminium film / phase change coated TPC-T-AL-CB 61 Phase change compound / dispensable / printable TPC-X-PC-NC Phase change compound / dispensable / printable TPC-Z-PC-D/ P/LV Silicone Gap Filler / highly conductive TEL-R-SI Silicone Gap Filler / highly conductive TEL-X-SI Silicone Gap Filler / highly conductive TEL-Z-SI Graphite foil / anisotropic TFO-S-CB / TFO-S-CB-UL 3.4 z: 8 x y: Silicone adhesive / thermally conductive TAD-G-SI-1C 1K Silicone adhesive / thermally conductive TAD-I-SI-1C 1K RTV Silicone adhesive / thermally conductive TAD-O-SI-1C 1K Silicone adhesive / thermally conductive TAD-P-SI-1C 1K RTV Silicone adhesive / thermally conductive TAD-I-SI-2C 2K RTV Silicone grease / highly thermally conductive TGR-W-SI HALA CLIPS 74 Hala Clip for TO-220 TO Hala Clip for TO-247 TO Hala Clip for TO-264 TO LEGAL INFORMATION

6 PAGE 06 / THERMAL NAVIGATOR HALA THERMAL NAVIGATOR 1 Gap Filler thermally conductive Thickness >~ 0mm / Pressure < 30, 0 for potting gels, dispensable gap fillers, putties All data without warranty and subject to change /Release 11 / 2012 Conductivity [W/mK] Dielectric Strength [kv/mm] Hardness [Shore 00] Operating Temperature [ C] UL Flammability or Equivalent SILICONE Gap Filler Soft TGF-C-SI TGF-M-SI TGF-R-SI TGF-S-SI TGF-V-SI TGF-Y-SI TGF-Z-SI Very soft TGF-JUS-SI TGF-JXS-SI TGF-MSS-SI TGF-MXS-SI TGF-MUS-SI TGF-NXS-SI TGF-SSS-SI TGF-SXS-SI TGF-WSS-SI Fibreglass reinforced TGF-CXS-SI-GF SILICONE Putty Plastic TGF-XP-SI TGF-ZP-SI Dispensable TGL-F-SI TGL-W-SI 2-PART Gap Filler Dispensable TDG-J-SI-2C SILICONE Potting gels 2 parts TCR-I-SI-2C TCR-M-SI-2C SILICONE-FREE Gap Filler TGF-HSS-NS TGF-Z-NS 2 SILICONE FOILS/CAPS thermally conductive Thickness mm / Pressure > 30 THERMAL NAVIGATOR Minimum Thickness [mm] Min. Thickness p ca. 150 [ C-inch²/W] Breakdown Min. Thickness [kv] Operating Temperature [ C] UL Flammability or Equivalent SILICONE Foils Fibreglass reinforced TFO-A-SI TFO-C-SI TFO-D-SI TFO-H-SI TFO-K-SI TFO-T-SI TFO-X-SI Unreinforced TFO-L-SI SILICONE Cap TCP-C-SI

7 PAGE 07 HALA Contec GmbH & Co. KG Blumenstraße 12 / D Deizisau / Germany Fon / Fax / info@hala-tec.de / 4 INTERFACE MATERIALS thermally conductive / ELECTRICALLY NON-INSULATING Thickness mm / Pressure > 10, 0 for adhesives Minimum Thickness [mm] Min. Thickness p ca. 30 [ C-inch²/W] Phase-Change Temp. [ C] Operating Temperature [ C] UL Flammability or Equivalent PHASE-CHANGE Film TPC-Z-PC Aluminium film Phase-change coating TPC-S-AL TPC-T-AL-CB TPC-Z-PC-AL Compound Dispensable Printable TPC-X-PC-NC TPC-Z-PC-D TPC-Z-PC-P TPC-Z-PC-LV SILICONE Gap Filler Highly conductive TEL-R-SI TEL-X-SI TEL-Z-SI GRAPHITE Film Anisotropic heat conductive TFO-S-CB TFO-S-CB-UL SILICONE Adhesive ly conductive TAD-G-SI-1C TAD-I-SI-1C TAD-O-SI-1C TAD-P-SI-1C TAD-I-SI-2C SILICONE Potting gel Highly conductive TGR-W-SI 3 INSULATING INTERFACE MATERIALS thermally conductive Thickness mm / Pressure > 10, 0 for adhesives Minimum Thickness [mm] Min. Thickness p ca. 30 [ C-inch²/W] Breakdown Min. Thickness [kv] Operating Temperature [ C] UL Flammability or Equivalent INSULATING FILMS KAPTON FILM PSA INSULATING TAPE ACRYLATE ADHESIVE Silicone coated TFO-B-SI TFO-F-SI Phase-change coated TPC-S-KA With Insulating film TAT-H-CO ly conductive TAD-M-AC-2CG

8 PAGE 08 / TOMORROW IS TODAY TOMORROW IS TODAY AND YESTERDAY Competence and know-how is one side. Development and innovation the other. Our wide portfolio of products and services in the Management stands for best products for every type of application. On the other hand we co-operate with partners worldwide to develop future solutions, considering all technologic trends and scientific experiences. The outcome of all this is: Our customers success and satisfaction. Today but more than ever tomorrow.

9 SERVICE / PAGE 09 THE BASIS OF OUR SERVICE We work precisely according to your specifications, adding our know-how and experience. We understand ourselves as development partners from A to Z. Thus we do not strive for the processing only, but take over the whole project management. It starts by doing the design-in and ends up with supplying perfect products. This means prototypes, single parts, small batches and final full-production run. And that is really convenient: through our versatile machinery consisting of punching machines, plotters and printers we do the processing and conversion of raw materials to customized products. PRINTING punching PLOTTiNG

10 PAGE 10 / QUALITY QUALITY HAS A PRINCIPLE The way we live and see things is simple: From the beginning of a project until production start and delivery, specifications and controls are decisive and indispensable. At the same time we audit our partners regularly as much as we push up our own quality standards pro-actively. Our team members are all committed to quality, thus bringing in line our company targets and assuming responsibilities: The best performance. We are certified according to DIN EN ISO In the end we realize prototypes ready for production and deliver samples in a very short time. We look forward to being challenged by your individual ideas. Trust us, you re in good hands!

11 CELSIA TECHNOLOGIES / PAGE 11 HALA is Partner OF Celsia Technologies CELSIA TECHNOLOGIES CELSIA NANOSPREADER Celsia NanoSpreader are copper encased, extremely flat two-phase vapour chambers for highly effective heat spreading and direct heat transfer from semiconductors, LEDs, any electronic components and wherever hot spots occur.

12 PAGE 12 / Total--Management HALA is Partner OF TTM TTM Total--Management TTM is an alliance of companies and experts specialising in products and services for Management. TTM with vast experience of solving thermal problems, project management, procurement and delivery. TTM working across borders and globally from initial idea to product maturity. TTM has partners in Austria, France, Germany, Italy, Switzerland, UK and Finland. PROJECT MANAGEMENT As project managers we develop and optimize system solutions for thermal management. We can work with you from the initial idea to end product in your language in your country. Our approach is to consider all components, taking into account mechanical, thermal, electronic and manufacturing interactions. Time to Market Using modern development methods and early involvement across all engineering disciplines, we reduce time and development costs and minimize the number of prototypes thus reducing time to market. Keeping your technical requirements in mind we will be able to deliver the optimum economic and quality solution. TTM System Solutions

13 GAP FILLER / PAGE 13 GAP FILLER / SILICONE GAP FILLER / SILICONE PUTTY / 2 PART GAP FILLER / SILICONE POTTING GEL / SILICONE- FREE GAP FILLER /

14 PAGE 14 / GAP FILLER SILICONE Gap Filler TGF-C-SI soft, flexible TGF-C-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a good thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimised. Soft and compliable conductivity: 1.5 W/mK Operates at low pressure Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock-absorbing Sheet 290 x 290 mm (0.5 mm) Sheet 310 x 310 mm (1.0 to 3.5 mm) Sheet 250 x 250 mm (4.0 to 5.0 mm TGF-CXXXX-SI) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-C0500-SI TGF-C1000-SI TGF-C2000-SI TGF-C3000-SI Colour Pink Pink Pink Pink Thickness mm Hardness Shore UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.40 ( (0.80) 1.45 (1.60) 2.21 (2.40) Thickness C-inch²/W (mm) 0.47 (0.43) 0.88 (0.85) 1.79 (1.75) 2.75 (2.60) Thickness C-inch²/W (mm) 0.50 (0.46) 0.95 (0.90) 1.90 (1.90) 2.90 (2.80) Conductivity W/mK Operating Temperature Range C - 50 to to to to +150 Electric Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.6 x x x x All data without warranty and subject to change Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm / 3.5 mm / 4.0 mm / 4.5 mm / 5.0 mm mm vs. () / Rth vs. () 6,0 5, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 6,0 5, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm mm 4,0 3,0 2,0 Rth [ C-inch²/W] 4,0 3,0 2,0 1,0 1,

15 SILICONE Gap Filler TGF-M-SI soft, flexible GAP FILLER / PAGE 15 TGF-M-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Soft and compliable conductivity: 2.5 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 480 x 460 mm (Thickness 0.5/1.0 mm) Sheet 460 x 460 mm (Thickness 2.0 mm) Sheet 450 x 460 mm (Thickness 3.0 mm) Tacky on both sides (TGF-MXXXX-SI) Tacky on one side (TGF-MXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering/ Industrial PCs Property Unit TGF-M0500-SI TGF-M1000-SI TGF-M2000-SI TGF-M3000-SI Colour Light blue Light blue Light blue Light blue Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.27 (0.38) 0.45 (0.71) 0.75(1.31) 0.96 (1.76) Thickness C-inch²/W (mm) 0.29 (0.42) 0.50 (0.80) 0.84 (1.50) 1.09 (2.07) Thickness C-inch²/W (mm) 0.32 (0.45) 0.55 (0.90) 0.95 (1.75) 1.26 (2.46) Conductivity W/mK Operating Temperature Range C - 60 to to to to Electrically Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x x Dielectric 1 khz Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm mm vs. () / Rth vs. () mm 3,0 2,0 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm Rth [ C-inch²/W] 1,5 1,0 0, ,5 mm 1,0 mm 2,0 mm 3,0 mm

16 PAGE 16 / GAP FILLER SILICONE Gap Filler TGF-R-SI soft, flexible TGF-R-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Soft and compliable conductivity: 3.0 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 480 x 460 mm (Thickness 0.5/1.0 mm) Sheet 460 x 460 mm (Thickness 2.0 mm) Sheet 450 x 460 mm (Thickness 3.0/4.0 mm) Sheet 450 x 450 mm (Thickness 5.0 mm) Tacky on both sides (TGF-RXXXX-SI) Tacky on one side (TGF-RXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications/ Laptops / Medicine engineering / Industrial PCs Property Unit TGF-R0500-SI TGF-R1000-SI TGF-R2000-SI TGF-R3000-SI Colour Light blue Light blue Light blue Light blue Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.22 (0.39) 0.40 (0.73) 0.68 (1.31) 0.95 (1.86) Thickness C-inch²/W (mm) 0.24 (0.42) 0.44 (0.81) 0.77 (1.49) 1.09 (2.15) Thickness C-inch²/W (mm) 0.26 (0.46) 0.48 (0.90) 0.88 (1.72) 1.25 (2.50) Conductivity W/mK Operating Temperature Range C - 60 to to to to Electrically Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x x Dielectric 1 khz Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm / 4.0 mm / 5.0 mm mm vs. () / Rth vs. () mm 3,0 2,0 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm Rth [ C-inch²/W] 1,5 1,0 0, ,5 mm 1,0 mm 2,0 mm 3,0 mm

17 SILICONE Gap Filler TGF-S-SI soft, flexible GAP FILLER / PAGE 17 TGF-S-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. Soft and compliable conductivity: 3.0 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Sheet 305 x 305 mm (0.5 mm) Sheet 305 x 305 mm (1.0 to 3.5 mm) Sheet 245 x 245 mm (4.0 to 5.0 mm) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-S0500-SI TGF-S1000-SI TGF-S2000-SI TGF-S3000-SI Colour Grey Grey Grey Grey Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.18 (0.30) 0.36 (0.60) 0.72 (1.20) 1.08 (1.80) Thickness C-inch²/W (mm) 0.25 (0.39) 0.45 (0.79) 0.90 (1.50) 1.40 (2.30) Thickness C-inch²/W (mm) 0.28 (0.43) 0.55 (0.95) 1.10 (1.81) 1.65 (2.75) Conductivity W/mK Operating Temperature Range C - 50 to to to to Electrically Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.6 x x x x Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm / 3.5 mm / 4.0 mm / 4.5 mm / 5.0 mm mm vs. () / Rth vs. () 5,0 4, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 3,0 2, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm mm 3,0 2,0 Rth [ C-inch²/W] 2,0 1,5 1,0 1,0 0,

18 PAGE 18 / GAP FILLER SILICONE Gap Filler TGF-V-SI soft, flexible TGF-V-SI is an electrically insulating thermally conductive high performance gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. The material is double-side self-tacky or alternatively one-side tacky through lamination with a thermally conductive film. Soft and compliable conductivity: 5.0 W/mK Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing One or two-side self-tacky Sheet 210 x 420 mm (Thickness mm) Sheet 200 x 200 mm (Thickness mm) Tacky on both sides (TGF-VXXXX-SI) Tacky on one side by film laminate (TGF-VXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-V0500-SI TGF-V0700-SI TGF-V1000-SI TGF-V2000-SI TGF-V3000-SI Colour Grey Grey Grey Grey Grey Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.30 (0.43) 0.38 (0.60) 0.46 (0.85) 0.55 (1.56) 0.78 (2.29) Thickness C-inch²/W (mm) 0.37 (0.46) 0.41 (0.64) 0.50 (0.91) 0.62 (1.70) 0.86 (2.47) Thickness C-inch²/W (mm) 0.41 (0.48) 0.49 (0.68) 0.54 (0.95) 0.68 (1.79) 0.94 (2.70) Conductivity W/mK Operating Temperature Range C - 40 to to to to to Electrically Dielectric Strength kv / mm >10 >10 >10 >10 >10 Volume Resistivity Ohm - cm > 1.0 x > 1.0 x > 1.0 x > 1.0 x > 1.0 x Thicknesses: Double-side tacky 0.7 mm / 1.0 mm / 1.5 mm / 2.0 mm / 3.0 mm One-side tacky 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 3.0 mm mm vs. () / Rth vs. () mm 3,0 2,0 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm Rth [ C-inch²/W] 1,2 1,0 0,8 0,6 0, ,5 mm 1,0 mm 2,0 mm 3,0 mm 0,

19 SILICONE Gap Filler TGF-Y-SI soft, flexible GAP FILLER / PAGE 19 TGF-Y-SI is an electrically insulating thermally conductive very high performance gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an outstandingly high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Through lamination with a thermally conductive film the material is one-side tacky. Soft and compliable conductivity: 7.0 W/mK Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing One-side self-tacky Sheet 210 x 420 mm (Thickness mm) Sheet 200 x 200 mm (Thickness mm) Tacky on one side by film laminate (TGF-YXXXX-SI) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-Y0500-SI TGF-Y1000-SI TGF-Y2000-SI Colour Grey / Brown Grey / Brown Grey / Brown Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Thickness C-inch²/W (mm) 0.22 (0.40) 0.33 (0.80) 0.49 (1.28) Thickness C-inch²/W (mm) 0.23 (0.43) 0.36 (0.86) 0.53 (1.50) Thickness C-inch²/W (mm) 0.24 (0.47) 0.38 (0.94) 0.57 (1.74) Conductivity W/mK Operating Temperature Range C - 40 to to to Electrically Dielectric Strength kv / mm >10 >10 >10 Volume Resistivity Ohm - cm > 1.0 x > 1.0 x > 1.0 x Thicknesses: 0.5 mm / 0.7 mm / 1.0 mm / 1.5 mm / 2.0 mm / 3.0 mm mm vs. () / Rth vs. () 2,0 1, ,5 mm 0,7 mm 1,0 mm 2,0 mm 0,8 0, ,5 mm 0,7 mm 1,0 mm 2,0 mm mm 1,0 Rth [ C-inch²/W] 0,4 0,5 0,

20 PAGE 20 / GAP FILLER SILICONE Gap Filler TGF-Z-SI soft, flexible TGF-Z-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an extremely high thermal conductivity. Through its softness and plasticity the material perfectly mates to irregular surfaces thus optimizing the thermal contact. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Soft and compliable conductivity: 11 W/mK Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 200 x 300 mm Tacky on both sides (TGF-ZXXXX-SI) Tacky on one side by talcum coating (TGF-ZXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Capacitors For use in Automotive applications / Laptops / Medicine engineering / Embedded-boards Property Unit TGF-Z1000-SI TGF-Z1500-SI TGF-Z2000-SI Colour Light grey Light grey Light grey Density g/cm Hardness mm Thickness Shore UL Flammability (Equivalent) UL 94 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Resistance C-inch²/W 0.90 mm 1.40 mm 1.80 mm Resistance C-inch²/W 0.70 mm 1.20 mm 1.60 mm Conductivity W/mK Operating Temperature Range C - 50 to to to Electrically Dielectric Strength kv / mm >10 >10 >10 Dielectric Constant Ohm - cm 7.0 x x x Volume Resistivity 1 MHz ca. 7.5 ca. 7.5 ca. 7.5 Thicknesses: 1.0 mm / 1.5 mm / 2.0 mm

21 SILICONE Gap Filler TGF-JUS-SI very soft, flexible GAP FILLER / PAGE 21 TGF-JUS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a good thermal conductivity. Through its extremely high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Extremely soft and compliable conductivity: 2.0 W/mK Operates at minimum pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 480 x 460 mm (1.0 mm) Sheet 460 x 460 mm (2.0 mm) Sheet 450 x 460 mm (3.0 mm) Tacky on both sides (TGF-JUSXXXX-SI) Tacky on one side (TGF-JUSXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-JUS0500-SI TGF-JUS1000-SI TGF-JUS2000-SI TGF-JUS3000-SI Colour Grey Grey Grey Grey Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes thickness C-inch²/W (mm) 0.60 (0.35) 1.00 (0.65) 1.40 (1.10) 1.70 (1.60) thickness C-inch²/W (mm) 0.70 (0.40) 1.20 (0.75) 1.80 (1.30) 2.10 (1.85) thickness C-inch²/W (mm) 0.80 (0.45) 1.50 (0.85) 2.30 (1.58) 2.80 (2.25) Conductivity W/mK Operating Temperature Range C - 60 to to to to Electrically Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x x Dielectric 1 khz Thicknesses:0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm / 3.5 mm / 4.0 mm / 4.5 mm / 5.0 mm mm vs. () / Rth vs. () mm 4,0 3,0 2, ,5 mm 1,0 mm 1,5 mm 2,0 mm 2,5 mm 3,0 mm 3,5 mm Rth [ C-inch²/W] 5,0 4,0 3,0 2, ,5 mm 1,0 mm 1,5 mm 2,0 mm 2,5 mm 3,0 mm 3,5 mm 1,0 1,

22 PAGE 22 / GAP FILLER SILICONE Gap Filler TGF-JXS-SI very soft, flexible TGF-JXS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a high thermal conductivity. Through its extreme softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. The material is double-side self-tacky or alternatively one-side tacky through lamination with a thermally conductive film. Extremely soft and compliable conductivity: 2.0 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 210 x 420 mm ( mm) Sheet of 210 x 350 mm ( mm) Tacky on both sides (TGF-JXSXXXX-SI) Tacky on one side by film laminate (TGF-JXSXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs Smemory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-JXS0500-SI TGF-JXS1000-SI TGF-JXS2000-SI TGF-JXS2500-SI TGF-JXS3000-SI Colour Light blue Light blue Light blue Light blue Light blue Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.16 (0.17) 0.20 (0.29) 0.25 (0.48) 0.28 (0.60) 0.33 (0.70) Thickness C-inch²/W (mm) 0.20 (0.26) 0.26(0.41) 0.34 (0.69) 0.40 (0.86) 0.44 (1.04) Thickness C-inch²/W (mm) 0.28 (0.35) 0.35 (0.55) 0.46 (1.00) 0.52 (1.25) 0.60 (1.55) Conductivity W/mK Operating Temperature Range C - 40 to to to to to+ 200 Electrically Dielectric Strength kv / mm >10 >10 >10 >10 >10 Volume Resistivity Ohm - cm 1.0 x x x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 2.5 mm / 3.0 mm / 4.0 mm / 5.0 mm / 6.0 mm mm vs. () / Rth vs. () mm 2,0 1,5 1, ,5 mm 1,0 mm 2,0 mm 2,5 mm 3,0 mm Rth [ C-inch²/W] 0,8 0,6 0, ,5 mm 1,0 mm 2,0 mm 2,5 mm 3,0 mm 0,5 0,

23 SILICONE Gap Filler TGF-MSS-SI very soft, with or without fibreglass reinforcement GAP FILLER / PAGE 23 TGF-MSS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its very high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable preassembly. The optional conductive fibreglass reinforced laminate on one side provides for a high mechanic stability and strengh. Very soft and compliable conductivity: 2.4 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 200 x 400 mm Tacky on both sides (TGF-MSSXXXX-SI) Tacky on one side by fibreglass reinforcement (TGF-MSSXXXX-SI-GF) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-MSS1000-SI TGF-MSS2000-SI TGF-MSS3000-SI TGF-MSS5000-SI TGF-MSS7000-SI Colour Light Grey Light Grey Light Grey Light Grey Light Grey Optional Reinforcement (-GF) Fibreglass laminate Fibreglass laminate Fibreglass laminate Fibreglass laminate Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Ja Ja Fibreglass laminate Thickness C-inch²/W (mm) 0.41 (0.62) 0.70 (1.10) 1.02 (1.60) 1.60 (2.42) 2.25 (3.40) Resistance@ Thickness C-inch²/W (mm) 0.50 (0.77) 0.85 (1.30) 1.20 (1.85) 1.86 (2.82) 2.60 (3.95) Resistance@ Thickness C-inch²/W (mm) 0.57 (0.87) 1.00 (1.55) 1.45 (2.20) 2.32 (3.50) 3.25 (4.90) Conductivity W/mK Operating Temperature Range C - 40 to to to to to Electrically Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm / 4.0 mm / 5.0 mm / 6.0 mm / 7.0 mm / 10.0 mm. Other thicknesses on request mm vs. () / Rth vs. () mm 7,0 6,0 5,0 4,0 3,0 2, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 7,0 mm Rth [ C-inch²/W] 4,0 3,0 2,0 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 7,0 mm 1,

24 PAGE 24 / GAP FILLER SILICONE Gap Filler TGF-MXS-SI very soft, with or without fibreglass reinforcement TGF-MXS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a high thermal conductivity. Through its extreme softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable preassembly. The optional conductive fibreglass reinforced laminate on one side provides for a high mechanic stability and strengh. Extremely soft and compliable conductivity: 2.4 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 200 x 400 mm Tacky on both sides (TGF-MXSXXXX-SI) Tacky on one side by fibreglass reinforced laminate (TGF-MXSXXXX-SI-GF) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-MXS0500-SI TGF-MXS1000-SI TGF-MXS2000-SI TGF-MXS3000-SI Colour Grey / Red Grey / Red Grey / Red Grey / Red Optional Reinforcement (-GF) Fibreglass laminate Fibreglass laminate Fibreglass laminate Fibreglass laminate Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.20 (0.17) 0.25 (0.28) 0.35 (0.45) 0.45 (0.60) Thickness C-inch²/W (mm) 0.25 (0.26) 0.30 (0.43) 0.50 (0.70) 0.57 (0.83) Thickness C-inch²/W (mm) 0.30 (0.34) 0.42 (0.57) 0.68 (0.95) 1.02 (1.50) Conductivity W/mK Operating Temperature Range C - 40 to to to to Electrical Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.7 x x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm / 4.0 mm / 5.0 mm mm vs. () / Rth vs. () mm 5,0 4,0 3,0 2, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm Rth [ C-inch²/W] 3,0 2,0 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 1,

25 SILICONE Gap Filler TGF-MUS-SI very soft, flexible GAP FILLER / PAGE 25 TGF-MUS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its very high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Very soft and compliable conductivity: 2.5 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 480 x 460 mm (1.0 mm) Sheet 460 x 460 mm (2.0 mm) Sheet 450 x 460 mm (3.0 mm) Tacky on both sides (TGF-MUSXXXX-SI) Tacky on one side (TGF-MUSXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-MUS1000-SI TGF-MUS2000-SI TGF-MUS3000-SI Colour Light blue Light blue Light blue Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Thickness C-inch²/W (mm) 0.37 (0.52) 0.58 (0.85) 0.74 (1.06) Thickness C-inch²/W (mm) 0.42 (0.59) 0.70 (1.02) 0.89 (1.32) Thickness C-inch²/W (mm) 0.49 (0.70) 0.89 (1.29) 1.20 (1.70) Conductivity W/mK Operating Temperature Range C - 60 to to to Electrical Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x Dielectric 1 khz Thicknesses: 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm mm vs. () / Rth vs. () mm 3,0 2,0 1, ,0 mm 1,5 mm 2,0 mm 2,5 mm 3,0 mm Rth [ C-inch²/W] ,0 1,0 mm 1,5 mm 1,5 2,0 mm 2,5 mm 3,0 mm 1,0 0,

26 PAGE 26 / GAP FILLER SILICONE Gap Filler TGF-NXS-SI very soft, flexible TGF-NXS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where a thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its extreme softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Through optional lamination with a thermally conductive film the material is one-side non-tacky. Extremely soft and compliable conductivity: 2.5 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 210 x 420 mm ( mm) Sheet 210 x 350 mm ( mm) Tacky on both sides (TGF-NXSXXXX-SI) Tacky on one side by film laminate (TGF-NXSXXXX-SI-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-NXS0500-SI TGF-NXS1000-SI TGF-NXS2000-SI TGF-NXS3000-SI TGF-NXS5000-SI Colour Black Black Black Black Black Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.24 (0.28) 0.30 (0.49) 0.34 (0.85) 0.55 (1.20) 1.15 (2.10) Thickness C-inch²/W (mm) 0.27 (0.37) 0.34 (0.65) 0.39 (1.06) 0.68 (1.54) 1.38 (2.65) Thickness C-inch²/W (mm) 0.32 (0.47) 0.48 (0.80) 0.69 (1.40) 0.88 (2.02) 1.80 (3.40) Conductivity W/mK Operating Temperature Range C - 40 to to to to to Electricalv Dielectric Strength kv / mm >10 >10 >10 >10 >10 Volume Resistivity Ohm - cm 1.0 x x x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm / 4.0 mm / 5.0 mm / 6.0 mm mm vs. () / Rth vs. () mm ,0 0,5 mm 1,0 mm 4,0 2,0 mm 3,0 mm 5,0 mm 3,0 2,0 Rth [ C-inch²/W] ,0 0,5 mm 1,0 mm 2,0 mm 1,5 3,0 mm 5,0 mm 1,0 1,0 0,

27 SILICONE Gap Filler TGF-SSS-SI very soft, flexible GAP FILLER / PAGE 27 TGF-SSS-SI is an electrically insulating thermally conductive high performance gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a very high thermal conductivity. Through its extraordinary softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at lowest pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Through lamination with a thermally conductive film the material is one-side tacky. Extremely soft and compliable conductivity: 3.0 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One-side self-tacky Sheet 210 x 420 mm ( mm) Sheet 200 x 400 mm (3.0 mm) Tacky on one side by film laminate (TGF-SSSXXXX-SI) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-SSS0500-SI TGF-SSS1000-SI TGF-SSS2000-SI Colour Beige / Pink Beige / Pink Beige / Pink Thickness mm Hardness Shore UL Flammability UL 94 V1 V1 V1 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Thickness C-inch²/W (mm) 0.25 (0.38) 0.33 (0.66) 0.42 (1.20) Thickness C-inch²/W (mm) 0.27 (0.42) 0.39 (0.74) 0.52 (1.42) Thickness C-inch²/W (mm) 0.31 (0.45) 0.44 (0.85) 0.64 (1.67) Conductivity W/mK Operating Temperature Range C - 40 to to to Electrical Dielectric Strength kv / mm >10 >10 >10 Volume Resistivity Ohm - cm 1.0 x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm mm vs. () / Rth vs. () ,0 0,5 mm 1,0 mm 2,0 mm 1,5 0,8 0, ,5 mm 1,0 mm 2,0 mm mm 1,0 Rth [ C-inch²/W] 0,4 0,5 0,

28 PAGE 28 / GAP FILLER SILICONE Gap Filler TGF-SXS-SI very soft, flexible TGF-SXS-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a high thermal conductivity. Through its extreme softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Through lamination with a thermally conductive film the material is one-side non-tacky. Extremely soft and compliable conductivity: 3.0 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One-side self-tacky Sheet 210 x 420 mm ( mm) Sheet 200 x 200 mm (3.0 mm) Tacky on one side by film laminate (TGF-SSSXXXX-SI) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-SXS0500-SI TGF-SXS1000-SI TGF-SXS2000-SI TGF-SXS3000-SI Colour Beige / Pink Beige / Pink Beige / Pink Beige / Pink Thickness mm Hardness Shore UL Flammability UL 94 V1 V1 V1 V1 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.16 (0.24) 0.21 (0.45) 0.27 (0.75) 0.36 (1.10) Thickness C-inch²/W (mm) 0.21 (0.32) 0.27 (0.59) 0.34 (0.97) 0.44 (1.38) Thickness C-inch²/W (mm) 0.28 (0.40) 0.34 (0.72) 0.43 (1.25) 0.56 (1.87) Conductivity W/mK Operating Temperature Range C - 40 to to to to Electrical Breakdown Voltage kv / mm >10 >10 >10 >10 Volume Resistivity Ohm - cm 1.0 x x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm mm vs. () / Rth vs. () ,5 0,5 mm 1,0 mm 2,0 2,0 mm 3,0 mm 0,8 0, ,5 mm 1,0 mm 2,0 mm 3,0 mm mm 1,5 1,0 Rth [ C-inch²/W] 0,4 0,5 0,

29 SILICONE Gap Filler TGF-WSS-SI very soft, flexible GAP FILLER / PAGE 29 TGF-WSS-SI is an electrically insulating thermally conductive high performance gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an extremely high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at lowest pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Very soft and compliable conductivity: 5.5 W/mK Operates at very low pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One-side self-tacky Sheet 460 x 100 mm (TGF-WSSXXXX-SI) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-WSS0500-SI TGF-WSS1000-SI TGF-WSS2000-SI Colour Grey Grey Grey Thickness mm Hardness Shore UL Flammability (Equivalent) UL 94 V0 V0 V0 RoHS Conformity 2002 / 95 / EC Yes Yes Yes Thickness C-inch²/W (mm) 0.16 (0.41) 0.30 (0.75) 0.41 (1.32) Thickness C-inch²/W (mm) 0.18 (0.46) 0.32 (0.85) 0.49 (1.59) Thickness C-inch²/W (mm) 0.19 (0.48) 0.36 (0.93) 0.56 (1.80) Conductivity W/mK Operating Temperature Range C - 60 to to to Electrical Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm mm vs. () / Rth vs. () mm 2,0 1,5 1,0 0, ,5 mm 1,0 mm 2,0 mm Rth [ C-inch²/W] 0,6 0,4 0, ,5 mm 1,0 mm 2,0 mm

30 PAGE 30 / GAP FILLER SILICONE Gap Filler TGF-CXS-SI-GF very soft, elastic / fibreglass reinforced TGF-CXS-SI-GF is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has a good thermal conductivity. Through its extreme softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at minimum pressure. By its use the total thermal resistance is minimised. The thermally conductive fibreglass reinforced laminate on one side provides for a high mechanic stability and strength. Extremely soft and compliable conductivity: 1.3 W/mK Operates at lowest pressures Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Easy mounting through self tackiness One-side self-tacky Sheet 305 x 305 mm ( mm) Sheet 245 x 245 mm (>4.0 mm) Tacky on one side by fibreglass reinforced laminate (TGF-CXSXXXX-SI-GF) Kiss cut parts on sheet link of: SMD packages Through-hole vias Capacitors Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-CXS1000-SI-GF TGF-CXS2000-SI-GF TGF-CXS3000-SI-GF TGF-CXS5000-SI-GF Colour Pink / Yellow Pink / Yellow Pink / Yellow Pink / Yellow Reinforcement Fibreglass laminate Fibreglass laminate Fibreglass laminate Fibreglass laminate Thickness mm Hardness Shore UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes Thickness C-inch²/W (mm) 0.27 (0.24) 0.42 (0.39) 0.58 (0.50) 1.20 (1.00) Thickness C-inch²/W (mm) 0.34 (0.40) 0.56 (0.67) 0.67 (0.80) 1.62 (1.35) Thickness C-inch²/W (mm) 0.56 (0.48) 1.00 (0.83) 1.50 (1.32) 3.25 (2.50) Conductivity W/mK Operating Temperature Range C - 60 to to to to +200 Electrical Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.6 x x x x Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm / 2.5 mm / 3.0 mm / 3.5 mm / 4.0 mm / 4.5 mm / 5.0 mm mm vs. () / Rth vs. () mm 5,0 4,0 3,0 2, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm Rth [ C-inch²/W] 4,0 3,0 2, ,5 mm 1,0 mm 2,0 mm 3,0 mm 4,0 mm 5,0 mm 1,0 1,

31 SILICONE Putty TGF-XP-SI plastic GAP FILLER / PAGE 31 TGF-XP-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an outstandingly high thermal conductivity. Through its extreme softness and plasticity the material perfectly mates to irregular surfaces thus filling gaps at almost zero pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Plastic putty Soft and compliable conductivity: 6 W/mK Operates at almost zero pressure For minimal gaps Extraordinary chemical resistance and longterm stability Residue-free removal after use Easy mounting through self tackiness Sheet 300 x 200 mm Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Capacitors For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-XP2000-SI Colour Grey brown Reinforcement None Thickness mm 2.0 Density g/cm³ 3.1 UL Flammability UL 94 V0 RoHS Conformity 2002 / 95 / EC Yes 1.4 mm C-inch²/W mm C-inch²/W mm C-inch²/W mm C-inch²/W 0.08 Conductivity W/mK 6 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv / mm 13 Dielectric 1 MHz 6.4 Volume Resistivity Ohm-cm 1.0 x Thicknesses: 1.5 mm / 2.0 mm

32 PAGE 32 / GAP FILLER SILICONE Putty TGF-ZP-SI plastic TGF-ZP-SI is an electrically insulating thermally conductive gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the elastomer has an extremely high thermal conductivity. Through its extreme softness and plasticity the material perfectly mates to irregular surfaces thus filling gaps at almost zero pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Plastic putty Extremely soft and compliable conductivity: 11 W/mK Operates at almost zero pressure For minimal gaps Extraordinary chemical resistance and longterm stability Residue-free removal after use Easy mounting through self tackiness Sheet 300 x 200 mm Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Capacitors For use in Automotive applications / Laptops / Medicine engineering / Embedded boards Property Unit TGF-ZP2000-SI Colour Light grey Reinforcement None Thickness mm 2.0 Density g/cm³ 3.3 UL Flammability UL 94 V0 RoHS Conformity 2002 / 95 / EC Yes 1.4 mm C-inch²/W mm C-inch²/W mm C-inch²/W mm C-inch²/W 0.06 Conductivity W/mK 11 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv / mm 11 Dielectric 1 MHz 7.5 Volume Resistivity Ohm-cm 7.0 x 10 7 Thicknesses: 1.5 mm / 2.0 mm

33 SILICONE Putty TGL-F-SI dispensable GAP FILLER / PAGE 33 TGL-F-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional curing process. Due to the specific formulation and filling with ceramic particles the material has a high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised. Dispensable Almost zero pressure at assembly due to viscoplasticity conductivity: 1.5 W/mK Ready-made, no additional curing required Syringes 30 ccm and 330 ccm link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGL-F-SI compound Colour White Density g/cm³ 2.8 Viscosity Pa-s Flow rate cm³ / min 8 Weight loss (after C) % 0.1 UL Flammability UL 94 V0 RoHS Conformity 2002/95/EC Yes 1.0 mm Thickness C-inch²/W 0.6 Conductivity W/mK 1.5 Operating Temperature Range C - 40 to Electrical Dielectric Strength kv / mm 10 Volume Resistivity Ohm - cm 1.0 x 10 6 Dielectric 1 MHz < 4

34 PAGE 34 / GAP FILLER SILICONE Putty TGL-W-SI dispensable TGL-W-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional curing process. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised. EN Dispensable Almost zero pressure at assembly due to viscoplasticity conductivity: 5.5 W/mK Ready-made, no additional curing required Syringes Others on request link of: SMD packages Through-hole vias RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGL-W-SI compound Colour Grey Density g/cm³ 3.1 Penetration mm/ RoHS Conformity 2002/95/EC Yes Conductivity W/mK 5.5 Operating Temperature Range C - 40 to Electrical Dielectric Strength kv / mm 10 Volume Resistance Ohm - cm 1.0 x 10 13

35 2-pART SILICONE Gap Filler TDG-J-SI-2C dispensable / 2 parts / Form-in-Place GAP FILLER / PAGE 35 TDG-J-SI-2C is a 2-part dispensable low volatile gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile s are critical. Dispensable 2-part Minimized low volatile siloxane content conductivity: 1.7 W/mK Remains elastic after polymerisation Zero stress on components Heat accelerated curing Cartridges 2 x 25 ml / 2 x 600 ml Others on request link of: FPBGA Capacitors Heat Pipes BGA For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs Property Unit A Part B Part Silicone Silicone Colour Grey Black 25 C g/cm³ Mixing Ratio Weight or 1 : 1 1 : 1 Volume Hardness Shore Viscosity Pas Pot 23 C and 65 % RH min Curing 23 / 100 C 5h / 2 min 5h / 2 min Shelf < 25 C not opened Months ca. 6 ca. 6 Flammability UL VO Technical Conductivity W/mK Operating Temperature C - 50 to to Dielectric Strength kv/mm > 20 > 20 Volume Resistivity Ohm-cm > 9.26 x > 9.26 x 10 12

36 PAGE 36 / GAP FILLER Silicone POTTING GEL TCR-I-SI-2C dispensable / 2 parts TCR-I-SI-2C is a 2-part casting resin which is filled with thermally conductive fillers. After curing the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for encapsulating electric and electronic parts such as transformators, capacitors, inductors, sensors, LEDs and can be moulded or dispensed at normal conditions at room temperature or in vacuum. Its rheologic behaviour allows for usage in geometries that are difficult to access. Silicone 2 parts conductivity: 1.55 W/mK Remains elastic after curing Almost zero stress on components Dispensable or mouldable Heat accelerated curing 2 kg / 10 kg / 40 kg Other containers on request link of: Inductors Capacitors Heat Pipes BGA For use in Automotive applications / Telecommunication / Controlling units / Industrial PCs Property Unit A Part B Part Silicone Silicone Colour Grey Grey 25 C g/cm³ Mixing Ratio Weight or Volume 1 : 1 1 : 1 Hardness Shore 00 ca. 20 ca. 20 Viscosity Pas Catalysed Viscosity Pas Pot 23 C and 65 % RH min Curing 25 / 100 C 8 h / 16 min 8 h / 16 min Shelf < 40 C Not Opened Months ca. 12 ca. 12 Technical Conductivity W/mK Operating Temperature C - 50 to to Dielectric Strength kv/mm > 18 > 18 Volume Resistivity Ohm-cm > 1 x > 1 x 10 14

37 Silicone POTTING GEL TCR-M-SI-2C dispensable / 2 parts GAP FILLER / PAGE 37 TCR-M-SI is a 2-part casting compound which is filled with highly thermally conductive fillers. After curing the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for encapsulating electric and electronic parts such as transformators, capacitors, inductors, sensors, LEDs and can be moulded or dispensed at normal conditions at room temperature or in vacuum. Its rheologic behaviour allows for usage in geometries that are difficult to access. Silicone 2 parts High thermal conductivity: 3.0 W/mK Remains elastic after curing Dispensable or mouldable Jars 1 kg / 10 kg Other containers on request link of: Inductors Capacitors Heat Pipes BGA For use in Automotive applications / Telecommunication / Controlling units / Industrial PCs Property Unit A Part B Part Silicone Silicone Colour White Blue 20 C g/cm³ Mixing Ratio Weight 1 : 1 1 : 1 Viscosity mpas Pot Life h up to ca. 3 up tp ca. 3 Curing RT 120 C h ca. 50 / ca. 0.5 ca. 50 / ca. 0.5 Shelf RT Months Min. 6 Min. 6 Dry in closed original Jars Technical Hardness Shore Conductivity W/mK Operating Temperature C - 40 to to Dielectric Strength kv/mm Standard: 1 kg / 10 kg

38 PAGE 38 / GAP FILLER Silicone-Free Gap Filler TGF-HSS-NS siloxane-free, elastic TGF-HSS-NS is an electrically insulating thermally conductive -free gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The olefin based elastomer does not contain any volatile siloxanes which are inevitably emitted by s. Due to the specific formulation and filling with ceramic particles the material has a high thermal conductivity. Through its very high softness the material perfectly mates to irregular surfaces thus filling gaps and operates at very low pressures. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable preassembly. The material is double-side tacky or alternatively one-side tacky through lamination with a thermally conductive film. Silicone-free No siloxanes through -freeness Very soft conductivity: 2.0 W/mK Operates at very low pressure Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 200 x 200 mm Sheet 420 x 210 mm Tacky on both sides (TGF-HSSXXXX-NS) Tacky on one side by film laminate (TGF-HSSXXXX-NS-A1) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Property Unit TGF-HSS0500-NS TGF-HSS1000-NS TGF-HSS2000-NS TGF-HSS3000-NS -free elastomer -free elastomer -free elastomer Colour Brick-red Brick-red Brick-red Brick-red Thickness mm Specific Gravity g/cm³ Hardness Shore UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes -free elastomer Thickness C-inch²/W (mm) 0.16 (0.24) 0.30 (0.45) 0.49 (0.88) 0.75 (1.46) Thickness C-inch²/W (mm) 0.21 (0.36) 0.42 (0.70) ) 1.00 (2.0) Thickness C-inch²/W (mm) 0.40 (0.48) 0.80 (0.85) 1.25 (1.72) 1.80 (2.55) Conductivity W/mK Operating Temperature Range C - 40 to to to to Electrical Dielectric Strength kv / mm > 10 > 10 > 10 > 10 Volume Resistivity Ohm - cm 1.0 x x > 1.0 x > 1.0 x Thicknesses: 0.5 mm / 1.0 mm / 2.0 mm / 3.0 mm mm vs. () / Rth vs. () mm 3,0 2,5 2,0 1,5 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm Rth [ C-inch²/W] 2,5 2,0 1,5 1, ,5 mm 1,0 mm 2,0 mm 3,0 mm 0,5 0,

39 Silicone-Free Gap Filler TGF-Z-NS siloxane-free, elastic GAP FILLER / PAGE 39 TGF-Z-NS is an electrically insulating extremely thermally conductive -free gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The olefin based elastomer does not contain any volatile siloxanes which are inevitably emitted by s. Due to the specific formulation and filling with ceramic particles the material has an extremely high thermal conductivity. Through its softness the material perfectly mates to irregular surfaces thus filling gaps and operates at low pressures. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly. Silicone-free No emission of siloxanes through -freeness Soft conductivity: 15 W/mK Operates at low pressure Shock absorbing Easy mounting through self tackiness One or two-side self-tacky Sheet 150 x 150 mm Double-side tacky (TGF-HSSXXXX-NS) Kiss cut parts on sheet link of: SMD packages Through-hole vias RDRAMs memory modules Electronic parts to heat pipes For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs Unit TGF-Z0500-NS TGF-Z1000-NS TGF-Z2000-NS -free elastomer -free elastomer -free elastomer Colour Dark Brown Dark Brown Dark Brown Thickness mm Hardness Shore Flammability (Equivalent) UL 94 VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Thickness C-inch²/W (mm) 0.13 (0.39) 0.18 (0.78) 0.26 (1.38) Thickness C-inch²/W (mm) 0.14 (0.43) 0.21 (0.81) 0.30 (1.54) Thickness C-inch²/W (mm) 0.16 (0.46) 0.24 (0.89) 0.36 (1.84) Conductivity W/mK Operating Temperature Range C - 50 to to to Electrical Dielectric Strength kv / mm Volume Resistivity Ohm - cm 1.0 x x x 10 5 Thicknesses: 0.5 mm / 1.0 mm / 1.5 mm / 2.0 mm mm vs. () / Rth vs. () 3, ,5 mm 1,0 mm 2,0 mm 0,5 0, ,5 mm 1,0 mm 2,0 mm mm 2,0 1,0 Rth [ C-inch²/W] 0,3 0,2 0,

40 PAGE 40

41 SILICONE FOILS / CAPS / PAGE 41 SILICONE FOILS/CAPS THERMALLY CONDUCTIVE / WITH OR WITHOUT FIBREGLASS REINFORCEMENT /

42 PAGE 42 / SILICONE FOILS / CAPS Silicone Foil TFO-A-SI fibreglass reinforced TFO-A-SI is an electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a good thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side. conductivity: 1.0 W/mK High thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 300 x 1000 mm / Roll Non tacky (TFO-AXXX-SI) Tacky on one side (TFO-AXXX-SI-A1) Kiss cut parts on sheet link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Unit TFO-A230-SI TFO-A300-SI TFO-A450-SI Colour Grey Grey Grey Reinforcement Fibreglass Fibreglass Fibreglass Thickness mm UL Flammability UL 94 VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes 150 C-inch²/W C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 bis bis bis Electrical Breakdown Voltage kv AC Volume Resistivity Ohm - cm > 1.0 x > 1.0 x > 1.0 x Dielectric 1 MHz Thicknesses: 0.23 mm / 0.30 mm / 0.45 mm Rth vs. () 2,0 1, ,23 mm 0,30 mm 0,45 mm Rth [ C-inch²/W] 1,0 0,

43 Silicone Foil TFO-C-SI fibreglass reinforced SILICONE FOILS / CAPS / PAGE 43 TFO-C-SI is an electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side. conductivity: 1.4 W/mK High thermal contact Outstanding mechanic stability through fibreglass Very high dielectric breakdown voltage Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet Roll 475 mm x 100 m With fibreglass reinforcement Non tacky (TFO-CXXX-SI) Tacky on one side (TFO-CXXX-SI-A1) Kiss cut parts on sheet or roll link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / High voltage hybrid automotive applications / PS units / Solar systems Property Unit TFO-C150-SI TFO-C200-SI TFO-C300-SI Colour Grey brown Grey brown Grey brown Reinforcement Fibreglass Fibreglass Fibreglass Thickness mm UL Flammability UL 94 VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes 150 C-inch²/W C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 to to to Electrical Breakdown Voltage kv AC Withstand Voltage kv/minute Volume Resistivity Ohm - cm 1.0 x x x Dielectric 1 MHz Thicknesses: 0.15 mm / 0.20 mm / 0.30 mm Rth vs. () 1,0 0, ,15 mm 0,20 mm 0,30 mm Rth [ C-inch²/W] 0,6 0,4 0,

44 PAGE 44 / SILICONE FOILS / CAPS Silicone Foil TFO-D-SI fibreglass reinforced TFO-D-SI is an electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with self tackiness on one side with no need for an additional adhesive coating or with a one side adhesive coating. conductivity: 1.2 W/mK Very good thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 300 x 1000 mm Roll 300 mm x 50 m Non tacky (TFO-DXXX-SI) Self tacky on one side without adhesive coating (TFO-DXXX-SI-AO) One side adhesive (TFO-DXXX-SI-A1) Kiss cut parts on roll Kiss cut parts on sheet link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Unit TFO-D230-SI TFO-D300-SI TFO-D450-SI Colour Grey Grey Grey Reinforcement Fibreglass Fibreglass Fibreglass Thickness mm UL Flammability UL 94 VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes 150 C-inch²/W (mm) C-inch²/W (mm) Conductivity W/mK Operating Temperature Range C - 50 to to to Electrical Breakdown Voltage kv AC Volume Resistivity Ohm - cm > 1.0 x > 1.0 x > 1.0 x Dielectric 1 MHz Thicknesses: 0.23 mm / 0.30 mm / 0.45 mm Rth vs. () 2,0 1, ,23 mm 0,30 mm 0,45 mm Rth [ C-inch²/W] 1,0 0,

45 Silicone Foil TFO-H-SI fibreglass reinforced SILICONE FOILS / CAPS / PAGE 45 TFO-H-SI is a high performance electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with highly thermally conductive ceramic particles a high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with self tackiness on one side with no need for an additional adhesive coating or with a one side adhesive coating. conductivity: 1.8 W/mK High surface compliance Excellent thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Optional one side self tacky without adhesive coating Sheet 300 x 300 mm Roll 300 mm x 50 m Non tacky (TFO-HXXX-SI) Self tacky on one side without adhesive coating (TFO-HXXX-SI-AO) One side adhesive (TFO-HXXX-SI-A1) Kiss cut parts on roll or sheet link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-H150-SI TFO-H230-SI TFO-H300-SI TFO-H450-SI Colour Green Green Green Green Reinforcement Fibreglass Fibreglass Fibreglass Fibreglass Thickness mm Tensile Strength > > 4.2 > 4.2 Hardness Shore A UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes 150 C-inch²/W C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 to to to to Electrical Breakdown Voltage kv AC Volume Resistivity Ohm - cm > > > > Dielectric Constant Thicknesses: 0.15 mm / 0.23 mm / 0.30 mm / 0.45 mm 2,0 1,5 Rth vs. () ,15 mm 0,23 mm 0,30 mm 0,45 mm Rth [ C-inch²/W] 1,0 0,

46 PAGE 46 / SILICONE FOILS / CAPS Silicone Foil TFO-K-SI fibreglass reinforced TFO-K-SI is an electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side. conductivity: 2.5 W/mK Very good thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 320 x 1000 mm Roll 320 mm x 50 m Non tacky (TFO-K200-SI) Tacky on one side (TFO-K200-SI-A1) Kiss cut parts on roll Kiss cut parts on sheet link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Unit TFO-K200-SI Colour Reinforcement Thickness mm 0.23 UL Flammability UL 94 V O RoHS Conformity 2002 / 95 / EC Yes 150 C-inch²/W (mm) C-inch²/W (mm) 0.47 Conductivity W/mK 2.5 Grey Fibreglass Operating Temperature Range C - 50 to Electrical Breakdown Voltage kv AC 2.0 Volume Resistivity Ohm - cm 2.0 x Dielectric 1 MHz 4.0 Thickness: 0.2 mm Rth vs. () 0, ,5 Rth [ C-inch²/W] 0,4 0,3 0,2 0,

47 Silicone Foil TFO-T-SI fibreglass reinforced SILICONE FOILS / CAPS / PAGE 47 TFO-T-SI is a high performance electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with highly thermally conductive ceramic particles a very high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. For an easy and reliable preassembly the interface material is available with low tack pressure sensitive adhesive on one side. conductivity: 4.1 W/mK High surface compliance Excellent thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 440 x 510 mm Non tacky (TFO-TXXX-SI) Tacky on one side (TFO-TXXX-SI-A1) Kiss cut parts on sheet link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-T200-SI TFO-T300-SI TFO-T450-SI TFO-T800-SI Colour Light green White White White Reinforcement Fibreglass Fibreglass Fibreglass Fibreglass Thickness mm UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes 150 C-inch²/W C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 to to to to Electrical Breakdown Voltage kv AC > 10 Volume Resistivity Ohm - cm 1.9 x x x x Dielectric 1 MHz Thicknesses: 0.20 mm / 0.30 mm / 0.45 mm / 0.80 mm Rth vs. () Rth [ C-inch²/W] 0,6 0,5 0,4 0,3 0, ,20 mm 0,30 mm 0,45 mm 0,80 mm 0,

48 PAGE 48 / SILICONE FOILS / CAPS Silicone Foil TFO-X-SI fibreglass reinforced TFO-X-SI is a high performance electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with highly thermally conductive ceramic particles an excellent thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. conductivity: 5.0 W/mK High surface compliance Excellent thermal contact Outstanding mechanic stability through fibreglass Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 440 x 510 mm Non tacky link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-X200-SI TFO-X300-SI TFO-X450-SI TFO-X800-SI Colour White White White White Reinforcement Fibreglass Fibreglass Fibreglass Fibreglass Thickness mm UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes 150 C-inch²/W C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 to to to to Electrical Breakdown Voltage kv AC > 10 Volume Resistivity Ohm - cm 1.7 x x x x Dielectric 1 MHz Thicknesses: 0.08 mm / 0.20 mm / 0.30 mm / 0.45 mm / 0.80 mm Rth vs. () Rth [ C-inch²/W] 0,6 0,5 0,4 0,3 0, mm 0,20 mm 0,30 mm 0,45 mm 0,80 mm 0,

49 Silicone Foil TFO-L-SI not reinforced SILICONE FOILS / CAPS / PAGE 49 TFO-L-SI is an electrically insulating thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces even at low pressure. Thus the total thermal resistance is minimised. The material can be applied in a broad field of applications. conductivity: 2.1 W/mK Very good surface compliance Very low thermal resistance High dielectric strength Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 440 x 480 mm link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-L200-SI TFO-L300-SI TFO-L450-SI TFO-L800-SI Colour Grey Grey Grey Grey Reinforcement None None None None Thickness mm UL Flammability UL 94 VO VO VO VO RoHS Conformity 2002 / 95 / EC Yes Yes Yes Yes 1 MPa C-inch²/W kpa C-inch²/W Conductivity W/mK Operating Temperature Range C - 50 to to to to Electrical Breakdown Voltage kv AC Volume Resistivity Ohm - cm 1.5 x x x x Dielectric 1 MHz Thicknesses: 0.20 mm / 0.30 mm / 0.45 mm / 0.80 mm Rth vs. () Rth [ C-inch²/W] 1,2 1,0 0,8 0,6 0, ,20 mm 0,30 mm 0,45 mm 0,80 mm 0,

50 PAGE 50 / SILICONE FOILS / CAPS Silicone CAP TCP-C-SI all around dielectric TCP-C-SI is a thermally conductive cap for an optimised thermal coupling between electronic packages and heat sinks which provides for a reliable electrical all-around insulation. Through the specific formulation and filling with thermally conductive ceramic particles a good thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. Very good surface compliance High thermal contact Extraordinary chemical resistance and longterm stability Residue-free removal after use Thicknesses: 0.5 mm and 0.8 mm Different sizes available link of: MOSFETs or IGBTs Power diodes or AC/DC converters For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TCP-C250-SI TCP-C280-SI Colour Grey Grey Thickness mm Tensile Strength Tear Strength kn/m UL Flammability UL 94 V0 V0 RoHS Conformity 2002/95/EC Yes Yes 30 C-inch²/W Conductivity W/mK Operating Temperature Range C - 40 to to Electrical Breakdown Voltage kv AC 4 10 Volume Resistivity Ohm - cm 2.6 x x Dielectric 1 MHz Sizes in mm A B C D TCP-C150-SI 16.0 ± ± ± ±0.1 TCP-C250-SI 21.5 ± ± ± ±0.1 TCP-C280-SI 21.8 ± ± ± ±0.1 TCP-C450-SI 28.5 ± ± ± ±0.1 TCP-C480-SI 28.8 ± ± ± ±0.1

51 INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE / PAGE 51 INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE / INSULATING FILM / KAPTON FILM / PSA INSULATING TAPE / ACRYLAT ADHESIVE /

52 PAGE 52 / INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE INSulating film TFO-B-SI coated TFO-B-SI is an elctrically insulating thermally conductive foil made of a high voltage resistant film with thermally conductive coating on both sides for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a good thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The substrate film provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. Good thermal contact Very high dielectric strength Outstanding mechanic stability through substrate film Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 228 x 228 mm Sheet 457 x 304 mm Roll 457 mm x 50 m Non tacky (TFO-B130-SI) Tacky on one side (TFO-B130-SI-A1) link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-B130-SI Insulating film coated with ceramic filled Colour Dark pink Reinforcement High Voltage resistant insulating film Thickness mm 0.13 UL Flammability UL 94 V0 RoHS Conformity 2002 / 95 / EC Yes 150 C-inch²/W (mm) C-inch²/W (mm) 0.49 Operating Temperature Range C - 50 to Electrical Breakdown Voltage kv AC > 6 Volume Resistivity Ohm - cm 1.0 x Dielectric 1 MHz 3.3 Thicknesses: 0.13 mm Rth vs. () 0, ,5 Rth [ C-inch²/W] 0,4 0,3 0,2 0,

53 INSulating film TFO-F-SI coated INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE / PAGE 53 TFO-F-SI is an elctrically insulating thermally conductive foil made of a high voltage resistant film with thermally conductive coating on both sides for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a good thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The substrate film provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. Good thermal contact Very high dielectric strength Outstanding mechanic stability through substrate film Extraordinary chemical resistance and longterm stability Residue-free removal after use Sheet 228 x 228 mm Sheet 457 x 304 mm Roll 457 mm x 50 m Non tacky (TFO-F130-SI) Tacky on one side (TFO-F130-SI-A1) link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TFO-F130-SI Insulating film coated with ceramic filled Colour Beige Reinforcement High voltage resistant insulating film Thickness mm 0.13 UL Flammability UL 94 V0 RoHS Conformity 2002 / 95 / EC Yes 150 C-inch²/W C-inch²/W 0.42 Operating Temperature Range C - 50 to Electrical Breakdown Voltage kv AC > 6 Volume Resistivity Ohm - cm >1.0 x Dielectric 1 MHz 3.4 Thicknesses: 0.13 mm Rth vs. () 0, ,5 Rth [ C-inch²/W] 0,4 0,3 0,2 0,

54 PAGE 54 / INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE Kapton Film WITH PHASE CHANGE TPC-S-KA phase change coating TPC-S-KA is a thermally conductive film with an electrically insulator made of Kapton MT which is coated with a thermally conductive phase changing compound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change coating starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at low pressure. The wettening of the contact areas is further on improved by volumetric material expansion of approximately 10 to 15% at increasing temperature. Thus the total thermal resistance is minimised. Optimal thermal contact High dielectric strength Silicone-free No dry up, pump-out migration No run-out through thixotropic Process reliable coating thickness Ideal replacement of messy thermal grease Sheet 304 x 304 mm Roll Non tacky (TPC-SXXX-KA) Tacky on one side (TPC-SXXX-KA-A1) Kiss cut parts on roll Kiss cut parts on sheet link of: MOSFETs or IGBTs Diodes A.C. converter Uninsulated power modules For use in Automotive motor control units / Power supplies / Traction drives / Telecom appliances Property Unit TPC-S050-KA TPC-S075-KA TPC-S100-KA Kapton MT with phase change coating on both sides Kapton MT with phase change coating on both sides Colour Light pink Light pink Light pink Thickness Kapton MT µm Thickness Phase Change (per side) µm Total Thickness µm UL Flammability UL 94 V0 V0 V0 RoHS Conformity 2002/95/EC Yes Yes Yes 150 C-inch²/W (mm) C-inch²/W (mm) C-inch²/W (mm) Conductivity Kapton MT W/mK Phase Change Temperatur C ca. 52 ca. 52 ca. 52 Electrical Breakdown Voltage kv AC Volume Resistivity Ohm - cm 4.0 x x x Dielectric 1 MHz Kapton MT with phase change coating on both sides 0 0,4 0,3 Thicknesses: Kapton MT 25 µm / 50 µm / 75 µm. Total Thicknessess: 50 µm / 75 µm / 100 µm Rth vs. () mm 75 mm 0,10 mm Rth [ C-inch²/W] 0,2 0,

55 PSA Insulating tape TAT-H-CO with insulating film INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE / PAGE 55 TAT-H-CO is a thermally conductive PSA transfer tape with an electrically insulating copolymer filmreinforcement. Through the thermally conductive adhesive coated on both sides of the copolymer the thermal contact is highly improved even at low pressures. Convex and concave surface structures and stack up tolerances are effectively compensated. s with different expansion coefficients can easily be bonded. Thus the total thermal resistance is minimised. The tape works well for realizing an effective and cost efficient thermal coupling in a broad field of applications. Above all it is used in applications having little space only and where the permitted weight is limited. Using screws, springs, clips as mechanic fasteners thus becomes superfluous. Low thermal resistance High dielectric strength Reliable strong adherence on uneven or hardly machineable surfaces Silicone-free Neither mixing of components nor curing processes High mechanical stability and an easy handling through copolymer film Replacement of fasteners e.g. screws, clips, etc. Sheet 360 x 300 mm Roll 360 mm x 50 m Both side tacky link of: CPUs RDRAM memory modules Flip Chips, DSPs, BGAs, PPGAs MOSFETs to heat sinks For use in Power supplies / PCs / Telecom engineering / Automotive applications Property Unit TAT-H190-CO Colour Tape Thickness mm Liner Thickness mm Adhesion on Aluminium N / cm 6 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 0.9 Operating Temperature Range C - 40 to Electrical Breakdown Voltage kv AC 10.3 Dielectric Strength kv / mm 55 Volume Resistivity Ohm - cm 2.5 x ly conductive PSA tape with copolymer film White

56 PAGE 56 / INSULATING INTERFACE MATERIALS THERMALLY CONDUCTIVE acrylate Adhesive TAD-M-AC-2CG thermally conductive TAD-M-AC-2CG is a thermally conductive two component acrylic adhesive with thermally conductive fillers in both components. It contains glass spacer beads to create a uniform bondline providing consistent thermal properties and a defined dielectric value to the interface. It cures once the two parts come into contact without requiring heat or primer. It has good wetting and high bonding adhesion to most surfaces. The material is formulated for separate dispense of each part on either interface surface or sandwiched dispense on only one surface. When applying at least 80% of the surfaces should be covered. No meter-mix dispense systems are required. No heat is needed in order to avoid partial polymerisation. It is characterised by high resistance to water, acids, bases and most organic solvents. conductivity: 1.75 W/mK High dielectric strength by glass beads Very high bonding properties Extraordinary chemical resistance and longterm stability No meter-mix dispense systems necessary Fast fixture 30 ml cartridges 1 / 5 kg pots With glass beads (TAD-M-AC-2C) Optional without glass beads (TAD-M-AC-2C) link of: LEDs Processor cooling Memory chip assembly CPU boards Property Unit TAD-M-AC-2CG Acrylate Glass Spacer Beads mm Colour Component A / B Yellow / Blue Viscosity Part 2.5 rpm / 20 rpm Pas 65 / 32 Viscosity Part 2.5 rpm / 20 rpm Pas 190 / 90 Specific Gravity Part A g/cm³ 1.7 Specific Gravity Part B g/cm³ 1.7 Tensile Shear Strength (Aluminium ) MPa 13 Elongation % 3.1 Pot RT min ca. 120 Ratio Part A : B 1 : 1 for optimum thermal performance (acceptable for adhesion : ) Fixture RT and 50 % RH min ca. 3 5 Curing RT and 50 % RH h ca for full RT Shelf 5 to 10 C Months 6 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 1.75 Glass Transition Temperature TG C 28 Coefficient of Expansion a1 ppm/k 54 Coefficient of Expansion a2 ppm/k 141 Electrical Dielectric Strength kv/mm 3.2

57 INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 57 INTERFACE MATERIALS THERMALLY CONDUCTIVE ELECTRICALLY NON-INSULATING / PHASE CHANGE FILMS / PHASE CHANGE COMPOUNDS / SILICONE GAP FILLER / GRAPHITE FILM / SILICONE ADHESIVE / SILICONE THERMAL GREASE /

58 PAGE 58 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Phase change TPC-Z-PC, TPC-Z-PC-AL as stand alone or with aluminium laminate TPC-Z-PC and TPC-Z-PC-AL are thermally conductive phase changing films optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. The particular formulation and the thixotropic nature prevents from run-out as well as migration. The material is available as TPC-Z200-PC as free standing film or as TPC-Z140-PC-AL with an aluminium film carrier thus reworkability is improved since no compound residues remain on one side. Optimal thermal contact conductivity: 3.4 W/mK Silicone-free No migrating, pump-out or run out due to thixotropic properties Ideal alternative and replacement of messy thermal grease TPC-Z-PC-AL with one-side aluminium film allows for oneside residue-freeness and improved reworkability TPC-Z200-PC: between 2 release liners TPC-Z140-PC-AL with mm 1-side aluminium film: single or on roll link of: MOSFETs or IGBTs Memory modules Power modules CPUs For use in Servo drive control units / Computers / Automation appliances / Microelectronics Property Unit TPC-Z200-PC TPC-Z140-PC-AL Phase Change Film Phase Change Film with mm Al Film Colour Grey Grey Total Thickness mm Aluminium Film Thickness mm Specific Density g/cm³ RoHS Conformity 2002/95/EC Yes Yes 150 C-inch²/W C-inch²/W C-inch²/W Conductivity W/mK Phase Change Temperature C ca. 45 ca. 45 Storage Months min. 6 min. 6 Recommended Storage Temperature C Rth vs. () Rth [ C-inch²/W]

59 INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 59 Aluminum film WITH Phase change TPC-S-AL phase change coating TPC-S-AL is an aluminium film which is coated with a thermally conductive phase changing compound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change coating starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at low pressure. The wettening of the contact areas is further on improved by volumetric material expansion at increasing temperature. Thus the total thermal resistance is minimised. The particular formulation and the thixotropic nature prevents from run-out, dry-up as well as migration. The aluminium carrier effects high mechanical stability and easy handling. Optimal thermal contact Silicone-free No migrating, run out or pump-out due to thixotropic properties Process reliable coating thickness Ideal alternative and replacement of messy thermal grease Sheet 304 x 304 mm Non tacky (TPC-S076-AL) Kiss cut parts on roll Kiss cut parts on sheet link of: MOSFETs or IGBTs Insulated diodes Power modules CPUs For use in Servo drive control units / Traction drives / Automation appliances / Microelectronics Property Unit TPC-S076-AL Colour Thickness Aluminium µm 51 Thickness Phase Change µm 12.5 (per side) Total Thickness µm 76 UL Flammability UL 94 V0 RoHS Conformity 2002/95/EC Yes 150 C-inch²/W C-inch²/W C-inch²/W Phase Change Temperature C ca. 52 Aluminium with phase change coating on both sides White Thicknesses: 76 µm Rth vs. () Rth [ C-inch²/W]

60 PAGE 60 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Aluminum film WITH Phase change TPC-T-AL-CB phase change coating TPC-T-AL-CB is an aluminium film which is coated with a thermally conductive phase changing compound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change coating starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at low pressure. The wettening of the contact areas is further on improved by volumetric material expansion at increasing temperature. Thus the total thermal resistance is minimised. The particular formulation and the thixotropic nature prevents from run-out, dry-up as well as migration. The aluminium carrier effects high mechanical stability and easy handling. Optimal thermal contact Silicone-free No migrating, run out, pump-out due to thixotropic properties Process reliable coating thickness Ideal alternative and replacement of messy thermal grease Sheet 304 x 596 mm Sheet 445 x 500 mm (only TPC-T076-AL-CB) Roll 304 mm x 152 m Optional adhesive stripes Kiss cut parts on roll Kiss cut parts on sheet link of: MOSFETs or IGBTs Insulated diodes Power modules CPUs For use in Servo drive control units / Traction drives / Automation appliances / Microelectronics Property Unit TPC-T064-AL-CB TPC-T076-AL-CB TPC-T083-AL-CB TPC-T102-AL-CB Aluminium with graphite filled phase change coating on both sides Aluminium with graphite filled phase change coating on both sides Aluminium with graphite filled phase change coating on both sides Colour Black Black Black Black Thickness Aluminium µm Thickness Phase Change µm (per side) Total Thickness µm RoHS Conformity 2002/95/EC Yes Yes Yes Yes 150 C-inch²/W C-inch²/W C-inch²/W Phase Change Temperature C ca. 52 ca. 52 ca. 52 ca. 52 Aluminium with graphite filled phase change coating on both sides Phase Change coatings per side: 6.5 µm / 12.5 µm / 16.0 µm / 25.5 µm Total Thicknessess: 64 µm / 76 µm / 83 µm / 102 µm Rth vs. () mm 76 mm 83 mm 0,102 mm Rth [ C-inch²/W]

61 Phase Change compound TPC-X-PC-NC dispensable / printable INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 61 TPC-X-PC-NC is a dielectric thermally conductive phase changing compound optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. Thus the total thermal resistance is minimised. The particular formulation and the thixotropic nature prevents from run-out as well as migration. It can be pre-applied by stencil or screen printing. After drying the compound is dry-to-the-touch and ready for use on the thermal contact area. Optimal thermal contact by thin bondline conductivity: 3.0 W/mK Silicone-free Thixotropic Ideal alternative and replacement of messy thermal grease Accurate automated application by dispense, screen, stencil printing for mass production Dielectric 0.5 kg in 360 ml SEMCO cartridges (transparent) link of: MOSFETs und IGBTs Memory modules Power modules CPUs For use in Servo drive control units / Computers / Automation appliances / Microelectronics Property Unit TPC-X-PC-NC Dryable Phase Change Compound Colour White Density g/cm³ 2.45 RoHS Conformity 2002/95/EC Ja Conductivity W/mK 3.0 Phase Change Temperature C ca. 45 Recommended Storage Temperature C 27 Shelf Life Months > 6 Semco cartridges à 0.5 kg

62 PAGE 62 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Phase Change COMPOUND TPC-Z-PC-D / P /LV dispensable / printable TPC-Z-PC is a thermally conductive phase changing compound optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. Both thin bondline and high thermal conductivity minimise the total thermal resistance. The particular formulation and the thixotropic nature prevents from run-out as well as migration. The material is available as dispensable type TPC-Z-PC-D with short drying time. TPC-Z-P7 and -P8 are printable compounds with alternatively long and extended dry times. TPC-Z-PC-P8 dries only at elevated temperature. TPC-Z-PC-D-LV is a low viscosity grade with short dry time. Optimal thermal contact by thin bondline conductivity: 3.4 W/mK Silicone-free Thixotropic Ideal alternative and replacement of messy thermal grease Accurate automated application by dispense, screen, stencil printing for mass production Dispensable and printable types: TPC-Z-PC-D(-LV) and -P TPC-Z-PC-D short dry RT and elevated temp. TPC-Z-PC-D-LV short dry RT and elevated temp. TPC-Z-PC-P7 med dry RT and elevated temp. TPC-Z-PC-P8 extended dry time: elevated temp. Rth [ C-inch²/W] TPC-Z-PC-D and TPC-Z-PC-D-LV: Dispensable type (-low viscosity), short dry TPC-Z-PC-P7 and TPC-Z-PC-P8: Printable type med dry -P7 and extended dry -P8 P8 dries at elevated temperature only 0.5 kg in 360 ml SEMCO cartridges (transparent) link of: MOSFETs und IGBTs Memory modules Power modules CPUs For use in Servo drive control units / Computers / Automation appliances / Microelectronics Rth vs. () Property Unit TPC-Z-PC-D-LV TPC-Z-PC-D TPC-Z-PC-P7 TPC-Z-PC-P8 Dryable Phase Change Compound Dryable Phase Change Compound Dryable Phase Change Compound Colour Grey Grey Grey Grey Assembly mm ~ Dispens ~ Dispens ~ Print ~ Print Specific Gravity g/cm³ dry undried dry undried dry undried Dryable Phase Change Compound dry undried 1 / 5 / 10 rpm cps -- / / / -- / / -- / / -- / Thickness Time 22 C: 2 h (0.025 mm) 5 h (0.05 mm) 11 h (0.1 mm) 24 h ( C: 2 h (0.025 mm) 5 h (0.05 mm) 9 h (0.1 mm) 24 h ( C: 30 h (0.05 mm) 50 h (0.15 mm) 65 h ( C: 22 min (0.05 mm) 50 min (0.15 mm) 65 min C: 3 min (0.05 mm) 4.5 min (0.15 mm) 8 min (0.25 mm) RoHS Conformity 2002/95/EC Yes Yes Yes Yes 150 C-inch²/W C-inch²/W C-inch²/W Conductivity W/mK Phase Change Temperature C ca. 45 ca. 45 ca. 45 ca. 45 Recommended Storage Temp. C C: 4 h (0.05 mm) 11.5 h (0.15 mm) 18.5 h C: 7 min (0.05 mm) 12 min (0.15 mm) 18 min (0.25mm)

63 Silicone gap filler TEL-R-SI highly thermally conductive elastomer INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 63 TEL-R-SI is a low dielectric, high performance thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances. Through the specific formulation and filling with highly thermally conductive particles an extremely high thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The elastomer shows a low dielectric strength. High surface compliance and ultra soft conductivity:15 W/mK Low dielectric strength Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Sheet 150 x 150 mm (Thickness mm) Sheet 140 x 140 mm (Thickness 2.0 mm) Double-side self tacky Kiss cut parts on sheet link of: MOSFETs und IGBTs Power diodes or AC/DC converters Power modules CPUs For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TEL-R0500-SI TEL-R1000-SI TEL-R2000-SI Silicone with highly thermally conductive fillers Silicone with highly thermally conductive fillers Colour Black Black Black Thickness mm Hardness Shore Flammability (Equivalent) UL 94 V0 V0 V0 RoHS Conformity 2002/95/EC Yes Yes Yes 150 Thickness C-inch²/W (mm) 0.09 (0.20) 0.12 (0.36) 0.18 (0.61) Thickness C-inch²/W (mm) 0.11 (0.34) 0.15 (0.70) 0.23 (1.10) Thickness C-inch²/W (mm) 0.15 (0.45) 0.18 (0.90) 0.26 (1.50) Conductivity W/mK Operating Temperature Range C - 50 to to to Electrical Volume Resistivity Ohm - cm > 1 x 10 7 > 1 x 10 7 > 1 x 10 7 Dielectric Strength kv/mm ~ 0.3 ~ 0.3 ~ 0.3 Silicone with highly thermally conductive fillers Thicknesses: 0.5 mm / 0.75 mm / 1.0 mm / 2.0 mm mm vs. () / Rth vs. () mm 2,0 1,5 1,0 0, ,5 mm 0,75 mm 1,0 mm 2,0 mm Rth [ C-inch²/W] 0,30 0,20 0, ,5 mm 0,75 mm 1,0 mm 2,0 mm

64 PAGE 64 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Silicone Gap filler TEL-X-SI highly thermally conductive elastomer TEL-X-SI is a non dielectric, thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances.through the specific formulation and filling with highly thermally and electrically conductive particles an extremely high thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. High surface compliance and softness Non dielectric conductivity: 20 W/mK Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Sheet 150 x 150 mm Double-side tacky Kiss cut parts on sheet link of: MOSFETs und IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TEL-X250-SI TEL-X500-SI TEL-X750-SI Electrically conductive Electrically conductive Colour Dark Grey Dark Grey Dark Grey Thickness mm Hardness Shore UL Flammability UL 94 V0 V0 V0 RoHS Conformity 2002/95/EC Yes Yes Yes Thickness C-inch²/W (mm) 0.03 (0.12) 0.05 (0.22) 0.07 (0.25) Thickness C-inch²/W (mm) 0.04 (0.21) 0.06 (0.40) 0.09 (0.57) Thickness C-inch²/W (mm) 0.05 (0.23) 0.07 (0.44) 0.11 (0.68) Conductivity W/mK Electrically conductive Operating Temperature Range C - 50 to to to Electrical Volume Resistivity Ohm - cm < 100 < 100 < 100 Thicknesses: 0.25 mm / 0.5 mm / 0.75 mm mm vs. () / Rth vs. () mm 0,8 0,6 0,4 0, ,25 mm 0,50 mm 0,75 mm Rth [ C-inch²/W] 0,15 0, ,25 mm 0,50 mm 0,75 mm

65 Silicone gap filler TEL-Z-SI highly thermally conductive elastomer INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 65 TEL-Z-SI is a non dielectric high performance thermally conductive foil for an optimised thermal coupling between electronic packages and heat sinks even over larger tolerances.through the specific formulation and filling an extremely high thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. High surface compliance and softness Non dielectric conductivity: 50 W/mK Extraordinary chemical resistance and longterm stability Residue-free removal after use Shock absorbing Sheet 140 x 140 mm Optional with adhesive stripes (TEL-Z-SI-A1) link of: MOSFETs or IGBTs Power diodes or AC/DC converters Power modules For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems Property Unit TEL-Z200-SI TEL-Z400-SI TEL-Z500-SI Graphite filled elastomere Graphite filled elastomere Colour Black Black Black Thickness mm Hardness Shore Flammability UL 94 V0 V0 V0 RoHS Conformity 2002/95/EC Yes Yes Yes Graphite filled elastomere Thickness C-inch²/W (mm) (0.12) (0.29) (0.36) Thickness C-inch²/W (mm) (0.14) (0.35) (0.44) Thickness C-inch²/W (mm) (0.16) (0.37) (0.46) Conductivity W/mK Operating Temperature Range C - 50 to to to Electrical Volume Resistivity Ohm - cm < 100 < 100 < 100 Thicknesses: 0.2 mm / 0.4 mm / 0.5 mm / 1.0 mm mm vs. () / Rth vs. () mm 0,60 0,50 0,40 0,30 0,20 0, ,2 mm 0,4 mm 0,5 mm Rth [ C-inch²/W] ,2 mm 0,4 mm 0,5 mm

66 PAGE 66 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING graphite Foil TFO-S-CB anisotropic TFO-S-CB and TFO-S-CB-UL with UL VO consist of more than 98% pure graphite. Due to the flakelike shape they show anisotropic thermal conductivities in-plane (x-y-plane) and in through direction (z-direction). Their softness allows for a good compliance to the contact surfaces. Thus the total thermal resistance is minimised. Their low densities compared to copper (15%) or aluminium (50%) make them ideal for applications where low weight is required. The very high temperature resistance allows for the use in extreme hot environments. Maximum contact through good surface compliance Very low weight Silicone-free Very high temperature resistance EMI-shielding through high electrical conductivity Optional with/without UL VO TFO-SXXX-CB Sheet 300 x 500 mm Roll 300 mm x 50 m Non tacky (TFO-SXXX-CB) TFO-SXXX-CB-UL Sheet 457 x 609 mm Roll 609 mm x 50 m Non tacky (TFO-SXXX-CB-UL) Tack on one side (TFO-SXXX-CB-UL-A1) Kiss cut parts on roll or sheet link of: CPUs to heat sinks Power modules Semiconductors IGBTs For use in Power inverters / Laptops / Automotive power supplies / Industrial PCs Property Unit TFO-S130-CB /-UL TFO-S250-CB /-UL TFO-S510-CB /-UL Graphite 98% Graphite 98% Graphite 98% Colour Grey Grey Grey Thickness mm Hardness Shore A UL Flammability (TFO-S-CB-UL) UL 94 V0 V0 V0 RoHS Conformity 2002/95/EC Yes Yes Yes 150 C-inch²/W C-inch²/W C-inch²/W Conductivity W/mK (Z Direction) Conductivity W/mK (X-Y Direction) Operating Temperature Range C to to to Electrical Volume Resistivity Ohm - cm 11.0 x x x 10-4 Dielectric 1 MHz < < < Thicknesses: 0.13 mm / 0.25 mm / 0.5 mm Rth vs. ()

67 Adhesive TAD-G-SI-1C thermally conductive 1 part / addition cure INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 67 TAD-G-SI-1C is a liquid addition cure corrosion-free highly thermally conductive 1 part adhesive. It cures at elevated temperature over 100 C to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features good thermal conductivity. It allows for being operated at temperatures up to 260 C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential. conductivity: 1.38 W/mK High bonding properties Heat addition cure Non corrosive High operating temperatures up to 260 C Extraordinary chemical resistance and longterm stability 1 kg jars Bulk packaging options on request LED systems Processor cooling Memory chip assembly CPU board Property Unit TAD-G-SI-1C Silicone Colour Grey Specific Gravity g/cm³ 2.06 Linear Shrinkage % 2.0 Viscosity Pas 43 Hardness Shore A 67 Tensile Strength MPa 3.1 Elongation at Break % 70 Curing Time (@ 100 C)) min 30 Shelf Life (Stored Unopened and < 15 C) Months 6 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 1.38 Coefficient of Expansion Volumetric x 10-6 /K 562 Coefficient of Expansion linear x 10-6 /K 187 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv/mm 22.5 Volume Resistivity Ohm - cm 7.7 x Surface Resistivity Ohm - cm 1.3 x 10 15

68 PAGE 68 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Adhesive TAD-I-SI-1C thermally conductive1 part / RTV condensation cure TAD-I-SI-1C is a condensation curing, non-corrosive thermally conductive 1 part adhesive. It vulcanises at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. Due to rapid acetone curing while being in contact with atmospheric moisture it is solvent free. The adhesive features good thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 220 C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where good thermal conductivity, adhesion, fast curing and controlled, precision application are essential. conductivity: 1.55 W/mK High bonding properties Cures at room temperature (RTV condensation cure) Fast skinning Low linear shrinkage Non corrosive Thixotropic rheology preventing flow during the process High operating temperatures up to 220 C Extraordinary chemical resistance and longterm stability 310 ml cartridge Bulk packaging options on request LED systems Processor cooling Memory chip assembly CPU boards Property Unit TAD-I-SI-1C Silicone Colour White Specific Gravity g/cm³ 2.24 Linear Shrinkage % 0.5 Viscosity Pas 350 Hardness Shore A 65 Tensile Strength MPa 2.8 Elongation at Break % 94 Tack Free Time (@ 23 C and 65% RH)) min 4 Curing Time (3 23 C and 65% RH) h < 8 Full Cure d 7 Overlap Shear Strength (Al / Cu / St 304) kg/cm² 6.0 / 3.0 / 2.6 Shelf Life (Stored Unopened in Cartridges) Months 12 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 1.55 Coefficient of Expansion Volumetric x 10-6 /K 475 Coefficient of Expansion Linear x 10-6 /K 198 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv/mm 20 Volume Resistivity Ohm - cm 1 x Dielectric 1 MHz 4.9

69 Adhesive TAD-O-SI-1C thermally conductive 1 part / addition cure INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 69 TAD-O-SI-1C is an addition cure corrosion-free highly thermally conductive 1 part adhesive. It cures at elevated temperature to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 210 C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential. conductivity: 2.1 W/mK High bonding properties Heat cure Non corrosive Thixotropic rheology preventing flow during the process High operating temperatures up to 210 C Extraordinary chemical resistance and longterm stability 310 ml cartridges Bulk packaging options on reques LED systems Processor cooling Memory chip assembly CPU boards Property Unit TAD-O-SI-1C Silicone Colour Grey Specific Gravity g/cm³ 2.18 Viscosity Pas 140 Hardness Shore A 56 Tensile Strength MPa 2.20 Elongation at Break % 105 Curing Time (3 125 C 100 C) h 10 / 16 Shelf Life 5 30 C < 5 C) Months 2 / 12 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 2.10 Coefficient of Expansion Volumetric x 10-6 /K 586 Coefficient of Expansion Linear x 10-6 /K 195 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv/mm < 18 Volume Resistivity Ohm - cm > 3.5 x 10 13

70 PAGE 70 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Adhesive TAD-P-SI-1C thermally conductive 1 part / RTV condensation cure TAD-P-SI-1C is a condensation curing, non-corrosive highly thermally conductive 1 part adhesive. It vulcanises at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. Due to rapid acetone curing while being in contact with atmospheric moisture it is solvent free. The adhesive features good thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 220 C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential. conductivity: 2.3 W/mK High bonding properties Cures at room temperature (RTV condensation cure) Fast skinning Low linear shrinkage Non corrosive Thixotropic rheology preventing flow during the process High operating temperatures up to 220 C Extraordinary chemical resistance and longterm stability 310 ml cartridges Bulk packaging options on request LED systems Processor cooling Memory chip assembly CPU boards Property Unit TAD-P-SI-1C Silicone Colour Grey Linear Shrinkage g/cm³ 2.11 Linear Shrinkage % 0.5 Viscosity Pas 350 Hardness Shore A 67 Tensile Strength MPa 3.9 Elongation at Break % 103 Tack Free Time (@ 23 C and 65% RH) min 4 Curing Time (3 23 C and 65% RH) h < 8 Full Cure d 7 Overlap Shear Strength (Al / Cu / St 304, PC) kg/cm² 7.15 / 3.6 / 2.98 / 4.62 Shelf Life (Stored Unopened in Cartridges) Months 12 RoHS Conformity 2002/95/EC Yes Conductivity W/mK 2.3 Coefficient of Expansion Volumetric x 10-6 /K 493 Coefficient of Expansion Linear x 10-6 /K 164 Operating Temperature Range C - 50 to Electrical Dielectric Strength kv/mm > 20 Volume Resistivity Ohm - cm > 1 x Dielectric 1 MHz 4.9

71 Adhesive TAD-I-SI-2C thermally conductive 2 part / RTV condensation cure INTERFACE MATERIALS ELECTRICALLY NON-INSULATING / PAGE 71 TAD-I-SI-2C is a condensation curing, non-corrosive thermally conductive 2 part adhesive. It vulcanises very rapidly at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features good thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 200 C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where good thermal conductivity, adhesion, fast curing and controlled, precision application are essential. conductivity: 1.55 W/mK High bonding properties Very rapid condensation cure at room temperature (RTV) 10:1 (A:B Part) volumetric mixing ratio 264 ml cartridges Bulk packaging options on request LED systems Processor cooling Memory chip assembly CPU boards Property Unit TAD-I-SI-2C, Part A. TAD-I-SI-2C, Part B Silicone Condensation Fluid Colour Grey Black Specific Gravity g/cm³ Viscosity Pas Hardness Shore A Tensile Strength MPa Elongation at Break % Young Modulus MPa Tack Free Time (@ 23 C and 65% RH) min Mechanical Bond min Chemical Bond h Maximum Adhesion d 5 5 Shelf Life (Stored Unopened and < 30 C) Months RoHS Conformity 2002/95/EC Yes Yes Conductivity W/mK Coefficient of Expansion Volumetric x 10-6 /K Coefficient of Expansion Linear x 10-6 /K Operating Temperature Range C - 50 to to Electrical Dielectric Strength kv/mm > 10 > 10 Volume Resistivity Ohm - cm 2.0 x x 10 13

72 PAGE 72 / INTERFACE MATERIALS ELECTRICALLY NON-INSULATING Silicone Grease TGR-W-SI highly thermally conductive TGR-W-SI is high performing grease. It is ideal for use in applications where a very good thermal transfer must be achieved. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. By its use the thermal contact is maximised, hence the total thermal resistance is minimised. conductivity: 3.8 W/mK Dispensable Almost zero pressure at assembly High dielectric strength Operating temperature range: -55 to 230 C Syringes 1 ml / 3 ml / 5 ml / 30 ml Tins 0.5 kg / 5 kg Containers 40 kg link of: LED Boards Power modules RDRAMs memory modules Flip Chips, DSPs, BGAs, PPGAs For use in Automotive applications / Power electronics / Light technology / Industrial PCs Property Unit TGR-W-SI Metal oxide filled grease Colour Grey Density g / ccm C cps 68 Thixotropic Index 1 / 10 mm Oil separation (@ C) % < 0.05 Volatile Content (@ C) % < RoHS Conformity 2002/95/EC Yes Conductivity W/mK 3.8 Operating Temperature Range C - 55 to Storage Temperature C 0 to 40 Storage and Shelf Life RT 18 Electric Dielectric Strength kv / mm > 5.2 Dielectric 100 Hz 7.0 Dissipation 100 Hz

73 HALA CLIPS / PAGE 73 HALA CLIPS / SINGLE SCREWING CLIPS / DOUBLE SCREWING CLIP /

74 PAGE 74 / HALA CLIPS Hala Clip TO The single screwing clip HALA Clip TO allows for a strong springy fixing of a semiconductor in a TO 220 or comparable package and exerts a reliable pressure onto heatsinks. It can be easily fastened by use of M4 screws. Due to its particular shape an optimum mechanic stress behaviour within a wide operating range is achieved thus avoiding any overstrains of the material at the load limits. Even in case of maximum TO 220 tolerances the forces still suffice to generate adequate pressures. Through the special clip geometry the forces operate concentrated on the semiconductor package plates thus maximizing the contact zone and minimizing the thermal resistance. Due to the special surface treatment the clip is protected against corrosion. Fixing by M4-screw FE-simulation optimised stress behaviour Mounting friendly design Sufficient pressure even at minimum package height (ca. 3.5 mm for TO 220) Anticorrosive by Delta Seal surface treament Easy chip identification by apertures OPERATING RANGE Force range: ca N Pressure range: ca ( ) for different types of TO 220 packages (Surface area TO 220 ca. 1.6 cm²) Fixing of semiconductors in TO 220 or comparable packages onto heatsinks: MOSFETs and IGBTs Diodes and rectifiers Electronic modules For use in switch mode power supplies / UPS units / Motor control units / Automotive applications / Solar technology Dimensions Force vs. Deflection 100 Min. Max. N mm 0 Max mm Min. 0.6 mm

75 Hala Clip TO HALA CLIPS / PAGE 75 The single screwing clip HALA Clip TO allows for a strong springy fixing of a semiconductor in a TO 247 or comparable package and exerts a reliable pressure onto heatsinks. It can be easily fastened by use of M4-screws. Due to its particular shape an optimum mechanic stress behaviour within a wide operating range is achieved thus avoiding any overstrains of the material at the load limits. Even in case of maximum TO 247 tolerances the forces still suffice to generate adequate pressures. Through the special clip geometry the forces operate concentrated on the semiconductor package plates thus maximizing the contact zone and minimizing the thermal resistance. Due to the special surface treatment the clip is protected against corrosion. Fixing by M4-screw FE-simulation optimised stress behaviour Mounting friendly design Sufficient pressure even at minimum package height (ca. 4.7 mm for TO 247) Anticorrosive by Delta Seal surface treament Easy chip identification by apertures OPERATING RANGE Force range: ca N Pressure range: ca ( ) for different types of TO 247 packages (Surface area TO 247 ca. 3.4 cm²) Fixing of semiconductors in TO 247 or comparable packages onto heatsinks: MOSFETs IGBTs Diodes For use in switch mode power supplies / UPS units / Motor control units / Automotive applications Dimensions Force vs. Deflection N Min. Max mm 0 Max mm Min. 0.3 mm

76 PAGE 76 / HALA CLIPS Hala Clip TO The double screwing clip HALA Clip TO allows for a strong springy fixing of a couple of semiconductors in TO 264 or comparable packages and exerts a reliable pressure onto heatsinks. It can easily be fastened by use of 2 M4 screws. Fixing by 2 M4 screws Sufficient pressure even at minimum package height Stainless steel OPERATING RANGE Force range: ca N Pressure range: ca (30 38 ). Surface area TO 264 ca. 5 cm² Fixing of semiconductors in TO 264 or comparable packages onto heatsinks: MOSFETs IGBTs Diodes For use in Switch mode power supplies / UPS units / Motor control units / Automotive applications Dimensions Force vs. Deflection Min. Max. N mm 0 max mm min. 0.5 mm

77 LEGAL INFORMATION CONTACT HALA Contec GmbH & Co. KG / Blumenstraße 12 / D Deizisau / Germany Fon / Fax / info@hala-tec.de / PICTURE CREDITS dreamstime: Page 1, 4, 5, 76; fotolia: Page 2, 3, 10; zoodesign: Page 6 9, 11, 35, 49, 55, DESIGN zoodesign artgerechte gestaltung / D schwäbisch gmünd / PRINT C. Maurer Druck- und Verlag GmbH & Co. KG / D Geislingen /

78 HALA Contec GmbH & Co. KG Blumenstraße 12 / D Deizisau / Germany Fon / Fax / info@hala-tec.de /