SMD RFI CLIP Data Sheet

Transcription

1 1/14 Attn : Data Sheet - CONDITION : We approved the product as above. WRITE REVIEW APPROVAL ICT NAME S.P. HONG J.E. KIM S.K,JUNG SIGNATURE Supplier : Innochips Technology CO., LTD By President : I.k Park ( 인 ) Address : 11B-16L, Banwol Industrial Complex, , Wonsi-Dong, Danwon-Gu, Ansan-Si, Kyungki-Do, Korea, Contacts : TEL (031) , FAX (031)

2 2/14 INDEX. 1. Generals. 2. Product specifications. 2.1 Product Summary. 2.2 Part Number Code. 2.3 Product Components. 2.4 Product Assembly Process. 3. Material Description. 4. Reliability Test Specification. 5. Test Result of Hazardous Material Test. 6. Reflow Condition. 6.1 Recommended Lead-Free Soldering Profile. 6.2 Recommended Lead-Free Solder Paste. 6.3 Recommended Hand Solder. 7. Recommended PCB Land & Stencil mask pattern. 8. Packing Specification. 8.1 Reel and Carrier tape. ( Loaded 10,000 pcs ) 8.2 Reel packing. 9. Caution & MSL.

3 3/14 1. Generals. This specification covers the Innochips Technology CO., LTD. RFI SMD CLIP. 2. Product specifications. 2.1 Product Summary The Innochips Technology EMI/RFI SMD CLIP are surface mount devices that offer an automated solution to EMI/RFI shield assembly. As a discrete receptacle component, the EMI/RFI SMD CLIP is a cost effective alternative to hand soldering. The EMI/RFI SMD CLIPs are packaged in EIA tape and reel. And are compatible with standard high speed placement equipment. The clip can be placed anywhere on the PCB, eliminating the need for excess holes and saving PCB real estate. 2.2 Part Number Code ICSRC 3910 S F R Series Name CODE PRODUCT NAME ICSRC InnoChips 4 Plating Code CODE F TYPE Ni-Sn (Pb free) 2 Dimension 5 Packing Type CODE 3908 MODEL (TYPE) SS DIMENSION LENGTH WIDTH HEIGHT CODE R B TYPE Tape & Reel pack Bulk pack 3910 SS S S M M Material CODE MATERIAL S STAINLESS ALLOY C COPPER ALLOY

4 4/ Product Components. [ ] [ Reel ] - Top View - Bottom View - Side View - Side View [ Carrier Tape ]

5 5/ Product Assembly Process. [1 Step] Feed [2 Step] Pick-Up & Mount Pick-Up Nozzle PCB Solder Paste [4 Step] SMD RFI Shield Can Assembly [3 STEP] Reflow Soldering 3. Material Description. 3.1 Raw Materials. Ⅰ. : SUS 301 Ⅱ. CARRIER : PS Ⅲ. COVER TAPE : PET 3.2 Plating. - s are plated with Tin over Nickel.

6 6/14 4. Reliability Test Specification. No ITEM REQUIREMENT TEST CONDITION 1 Reflow soldering No mechanical damage. Pre-heating temperature : 175 ±10 time : 110 ±10 sec Soldering temperature : max 250 time : max 10sec. 2 Adhesive strength Adhesion strength should be over 5kgf PCB Clip 3 High temp. resistance (Dry Heat) No mechanical damage. Temperature : 125 ±2 Time: 96hrs Then measured after exposure in the room condition for 24±2hrs 4 Humidity resistance (Damp Heat) No mechanical damage. Temperature : 40 ±2 Humidity : 90 ~ 95%RH Time: 96hrs Then measured after exposure in the room condition for 24±2hrs 5 Thermal shock No mechanical damage. Step 1: -40 ±2 30 ±3min. Step 2: 125 ±2 30 ±3min. Number of cycle : 5 times Then measured after exposure in the room condition for 24±2hrs 6 Drop test No mechanical damage. Drop height : 1.5 m Metal Plate The number of times : 10

7 7/14 5. Test Result of Hazardous Material Test.

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10 10/14 6. Reflow Condition. 6.1 Recommended Lead-Free Soldering Profile. ( ) Dwell: max sec Δ T 130 ΔT 130 Pre-heating 110 ±10 sec 30~50 sec Soldering 30~50 sec Soldering Gradual Cooling sec Time (sec) 6.2 Recommended Lead-Free Solder Paste. - Supplier : Tamura Donghwa - Main composition : Sn-Ag-Cu - Ratio of composition : 96.5%-3.0%-0.5% 6.3 Recommended Hand Solder. - Max Temperature: Max 380 (Max 5sec)

11 11/14 7. Recommended PCB Land & Stencil mask pattern. PCB Land. Stencil Mask. ( Unit : mm ) - ICSRC3910SFR - ICSRC6508SFR - ICSRC5212SFR Metal Mask Stencil Thickness : 0.12 T

12 A ITEM 12/14 8. Packing Specification. 8.1 Reel and Carrier tape. ( Loaded 10,000 pcs ) [ Reel Dimensions ] C B D ( Unit : mm ) Symbol A B Symbol C D 3908 Ø ± ± ± Ø ± ± ±0.2 Part no Ø 330 Ø ±0.5 13± ± ± ± ± Ø ± ± ± Ø ± ± ±0.2

13 13/14 [ Carrier Tape Dimensions ] B C D E F A ( Unit : mm ) Symbol A B C Symbol D E F ±0.03 Ø ±0.03 Ø Part no ±0.03 4±0.03 Ø1.5 Ø ±0.03 Ø ±0.03 Ø

14 14/ Reel packing. <SPQ Box> <PQ Box> - per reel : 10,000 pcs - Product box material : Card board - 2 Reels in each SPQ Box - PQ Box contains 10 SPQ Boxes (20 Reels) 9. CAUTION & MSL. - Please do not apply excess mechanical stress to the chip and terminals at soldering. - Avoid mechanical damage to the chip. ( Dropping etc..) - It is strongly recommended that all the products of ICT are to be installed within 12 months after the date of production. If it is to be installed after 12 months from the date of production, the soldering test should be applied before installation. MSL 2 Floor Life Time Condition 12 months 30 / 60% RH