EVERLIGHT ELECTRONICS CO.,LTD.

Transcription

1 Technical Data Sheet Side View White LEDs (0.8mm) Features Side view white LED. White SMT package. Lead frame package with individual 2 pins. Wide viewing angle. Soldering methods: IR reflow soldering. Feature of the device: more light due to higher optical efficiency; extremely wide viewing angle; ideal for backlighting and coupling in light guide. ESD protection. Pb-free. The product itself will remain within RoHS compliant version. Descriptions Due to the package design, has wide viewing angle, low power consumption and white LEDs are devices which are materialized by combing Blue LEDs and special phosphors. This feature makes the LED ideal for light guide application. Applications LCD Back Light. Mobile phones. Indicators. Illuminations. Switch Lights. Device Selection Guide Material Chip Emitted Color Lens Color InGaN White Water Clear Everlight Electronics Co., Ltd. Rev. 1 Page: 1 of 13

2 Package Outline Dimensions Notes: Tolerances Unless Dimension ±0.1mm,Unit = mm Everlight Electronics Co., Ltd. Rev. 1 Page: 2 of 13

3 Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 ma Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +90 Electrostatic Discharge* 1 ESD 2000 V Power Dissipation Pd 110 mw Peak Forward Current (Duty IFP 100 ma Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. Note:1. The products are sensitive to static electricity and care must be fully taken when handling products. Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Rank Min. Typ. Max. Unit Condition Viewing Angle 2θ1/ deg I F =20mA Everlight Electronics Co., Ltd. Rev. 1 Page: 3 of 13

4 Bin Range Of Luminous Intensity Group Bin Code Min. Max. Unit Conduction Notes: 1.Tolerance of Luminous Intensity ±10% mcd I F =20mA Everlight Electronics Co., Ltd. Rev. 1 Page: 4 of 13

5 Bin Range Of Forward Voltage Group Bin Code Min. Max. Unit Conduction Notes: 1.Tolerance of Forward Voltage ±0.05V V I F =20mA Everlight Electronics Co., Ltd. Rev. 1 Page: 5 of 13

6 Chromaticity Coordinates Specifications for Bin Grading Bin Bin Group CIE_x CIE_y CIE_x Code Code 2 Group 3 Notes: 1 Bin Code A0-1 A0-3 B5-1 B5-2 A0-2 A0-4 I F =20mA CIE_y B B B B CIE_x CIE_y Group Bin Code CIE_x CIE_y B B The C.I.E chromaticity diagram ( Tolerance ±0.01). Everlight Electronics Co., Ltd. Rev. 1 Page: 6 of 13

7 Chromaticity Coordinates Specifications for Bin Grading I F =20mA B7-3 B B7-4 B Notes: 1.The C.I.E chromaticity diagram ( Tolerance ±0.01). y B B6-1 B B5-2 B B5-1 B5-4 B B5-3 B8-3 A B7-4 A A B A x Everlight Electronics Co., Ltd. Rev. 1 Page: 7 of 13

8 Typical Electro-Optical Characteristics Curves Everlight Electronics Co., Ltd. Rev. 1 Page: 8 of 13

9 Label explanation CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm Everlight Electronics Co., Ltd. Rev. 1 Page: 9 of 13

10 Carrier Tape Dimensions; Loaded quantity per reel 3500 PCS/reel Note: Tolerances Unless Dimension ±0.1mm Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Rev. 1 Page: 10 of 13

11 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% No. Items Test Condition 1 Reflow Soldering 2 Temperature Cycle 3 Thermal Shock 4 5 High Temperature Storage Low Temperature Storage Temp. : 260 ±5 Min. 5 sec. H : min 5 min L : min H : min 10 sec L : -10 5min Test Hours/Cycles Sample Size Ac/Re 6 Min. 22 PCS 0/1 300 Cycles 22 PCS. 0/1 300 Cycles 22 PCS. 0/1 Temp. : Hrs. 22 PCS. 0/1 Temp. : Hrs. 22 PCS. 0/1 6 DC Operating Life IF = 20 ma / Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85 /85%RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. Rev. 1 Page: 11 of 13

12 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5 for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. Everlight Electronics Co., Ltd. Rev. 1 Page: 12 of 13

13 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 6. Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound EVERLIGHT ELECTRONICS CO., LTD. Tel: , Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: , , Tucheng, Taipei 236, Taiwan, R.O.C Everlight Electronics Co., Ltd. Rev. 1 Page: 13 of 13