Redux Film Adhesives, Foaming Films, Pastes and Primers Redux - the Ultimate Bond

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1 Redux Film Adhesives, Foaming Films, Pastes and Primers Redux the Ultimate Bond

2 For Aerospace, Space, Defence, Automotive, Rail, Marine, Recreation, Motorsports......any industry where metals or composites are joined together Redux the Ultimate Bond Redux Film Adhesives, Foaming Films, Pastes and Primers Hexcel Composites formulates and manufactures a comprehensive range of structural film adhesives, foaming adhesive films, pastes and primers for aerospace and industrial markets. These Redux branded products have provided our customers with practical and economical solutions to joining materials for over 50 years. The Redux range is manufactured in Duxford, UK, Livermore, CA and Salt Lake City, UT and is supported by a global sales and technical support network. Redux Redux Film Adhesives Epoxy, phenolic, bismaleimide (BMI) and cyanate ester adhesives, supplied in film form on a roll and requiring heat and pressure to cure. These high performance structural adhesives are ideal for metal to metal and composite bonding and for the manufacture of honeycomb sandwich structures. For long term storage, refrigeration at 18 C/0 F is required. Redux Redux Adhesive Film Foaming Adhesive Films When cured at elevated temperature these films expand, making them ideal for gap filling, honeycomb core edge bonding and core splicing. Redux foaming adhesive films, which are supplied in sheet form, are designed to be used in conjunction with Redux Film Adhesives. Please consult the data sheet to identify the most appropriate product combination. Redux Redux Adhesives Paste Adhesives A new range of one and twopart epoxy adhesives which cure at room temperature and can also be cured at elevated temperature to achieve higher levels of mechanical performance. Redux pastes are available in either tins or cartridges. Redux Redux Primers Each Redux primer has been formulated to ensure the maximum possible performance is achieved from the corresponding Redux Film Adhesive. Redux primers protect pretreated surfaces prior to bonding and ensure maximum bond durability. Hexcel Composites is continuously developing new Redux products to ensure that our customers always achieve the ultimate bond.

3 Redux Film Adhesives Film Adhesives Applications Product Performance Key Features and Applications Product Composite surfacing Composite bonding Metal to metal bonding Honeycomb bonding Maximum service temperature ( C/ F) Typical cure temperature ( C/ F) Lap shear at R.T. *1 (MPa/psi) Honeycomb climbing drum peel at R.T. *1 (N/76mm) Flatwise tensile at R.T. *1 (MPa/psi) Tg Dry ( C/ F) *2 Epoxy Film Adhesive Redux / / / 23 7/ / 220 Preferred for industrial bonding: building panels, rail carriage doors, flooring, partitions. Flexible cure cycle from 100 C/ F to 150 C/ F. Redux / / / / 230 Flame retarded. Cocures with 120 C prepregs. Panel bonding for rail interiors, marine, building applications. Redux / / 84 8/ 80/ 175 Outstanding peel performance, ideal for motorsport. Redux / 73 9/ 1 105/ 220 Short cure cycle: 30 minutes at 120 C for a wide range of applications. Redux / / , 195/ 255, 365 Ideal for composite to composite bonding, surface finishing and lightning strike applications. Redux / / 68 9/ 1 135, 200/ 275, 390 High peel performance for a wide range of applications, particularly automotive and aerospace (engine nacelles, flaps, aileron bonding). Redux / / , 195/, 385 High performance adhesive for industrial markets. Exceptional honeycomb bonding. Redux / / 200/ 390 Very high temperature performance. For military, engine nacelles, missile bonding, aerospace, motorsport and high temperature industrial applications. Redux 340SP BMI Film Adhesive 42/ / , 200/ 295, 390 Low weight film adhesives for space applications. Redux HP / post cure/ 375+post cure 26/ / 23 5/ / 430 Very high temperature performance. Good cocure with BMI prepregs. Phenolic Film Adhesive Redux / / 5 75/ 165 Outstanding long term corrosion resistance. Wing skins and fuselage bonding for aircraft. Rubber to metal bonding. Cyanate Ester Film Adhesive Redux A54 160/ / 3 4/ / 310 Low outgassing and moisture absorption *1 Room Temperature = 25 C/77 F *2 Tg are for standard cure cycle by DMTA, log É

4 Redux Foaming Adhesive Foaming Films Adhesive Films Maximum Service Temperature Typical Cure Cycle (heat up rate 5 C (41 F)/minute) Expansion Ratio Aluminium double lap shear MPa/psi (1.6mm/0.06in gap) Description Product C/ F 60 mins at 120 C/ F 60 mins at 175 C/ F 1: 1.9 1: 2.0 1: 2.2 1: 2.4 1: 4.0 at 22 C/70 F Foaming Adhesive Film Redux 206NA 90/ / 500 High foaming ratio Redux 212NA 8.5/ Low foaming ratio, suitable for vacuum and non vacuum cure Redux 208/4NA 11/ 1600 For vacuum cure Redux 208/5NA 10/ 1450 Higher foaming ratio, not suitable with vacuum cure Redux 219/2NA 9/ 1 Higher service temperature foam, not suitable for thick parts Redux 219/3NA 10/ 1450 Low exotherm for manufacture of thicker components Redux 260 8*/ Dual cure temperature foaming film *Single lap shear value

5 Redux Paste Adhesives Paste Adhesives Redux / , 160, 5800 / 67 55/ / 160 No >1hour Thixotropic Cartridge/ Tin 2 component, high strength, high peel, multipurpose, corrosioninhibiting Redux / / 3625 No >1hour Thixotropic Tin 2 component high temperature celledge coating adhesive Redux / / 7 60/ / 205 Yes >1hour Syntactic Tin 2 component, low density syntactic filler Redux / ,, 110/ 230 No Low density thixotropic Tin single component, foaming paste for honeycomb splicing Redux / / 4 31/ 7 No Low viscosity/ low slump Tin 2 component composite bonding and liquid shim Honeycomb bonding Metal to Metal bonding Composite bonding Potting Honeycomb splicing Structural repair Liquid shim Maximum service temperature R.T. *1 cure ( C/ F) Maximum service temperature elevated temperature cure ( C/ F) Typical elevated cure temperature ( C/ F) Lap shear at R.T. *1 (MPa, psi) Compressive strength at R.T. *1 (MPa, psi) Bell peel at R.T. *1 (N/25mm, lbf/inch) Tg Dry R.T. *1 cure ( C/ F) Tg Dry elevated temperature cure *2 ( C/ F) Self extinguishing Consistency Packaging Product Performance Product Form Key Features and Applications Product Epoxy Paste Adhesive *1 Room Temperature = 25 C/77 F *2 Tg are for standard cure cycle by DMTA, log É Syntactic Pot life (100g) Applications

6 For further information please contact your nearest sales office from the list below or visit our website at where data sheets are available from the download section. Suite 2, 86 Grimshaw Street Greensborough, Victoria 3088 Australia. Tel: Fax: Industriestrasse 1, A4061 Pasching, Austria. Tel: 43 (0) Fax: 43 (0) Rue Trois Bourdons, 54, B4840 Welkenraedt, Belgium. Tel: Fax: Room B707, Yin Hai Bldg. Cao Xi Rd. Shanghai , China. Tel: /2 Fax: ZI La Plaine, B.P.27 Dagneux, Montluel, France. Tel: 33 (0) Fax: 33 (0) Am Westpark 1, D81373 München, Germany. Tel: Fax: Via San Cristoforo, Saronno (VA), Italy. Tel: Fax: Bruselas, 1016 Polig, Ind. Ciudad de Parla Parla, Madrid, Spain. Tel: Fax: Duxford, Cambridge CB2 4QD, United Kingdom. Tel: 44 (0) Fax: 44 (0) Dublin Blvd, Dublin CA , USA. Tel: Fax: East Ridge Drive, Suite 102 Danbury, CT 06810, USA. Tel: Fax: Grand River Suite 201 Novi, MI 48375, USA. Tel: Fax: Airport Freeway, Suite 550 Bedford, TX , USA. Tel: Fax: NE 80th Street, Suite 102 Redmond, WA 98052, USA. Tel: Fax: Important All information is believed to be accurate but is given without acceptance of liability. Users should make their own assessment of the suitability of any product for the purposes required. all sales are made subject to our standard terms of sale which include limitations on liability and other important terms. Hexcel Registered Trademark Copyright Hexcel Composites Publication RTU128 (April 2002)