Materials Declaration Form

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1 Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics Response Date * Contact Name * Refer to " Supplier Comment" section Contact Title Contact Phone * Refer to " Supplier Comment" section Contact * Authorized Representative * Emilio Castelli Representative Title Representative Phone * Refer to " Supplier Comment" section Representative * Refer to " Supplier Comment" section Refer to " Supplier Comment" section APG MD CHAMPION Refer to " Supplier Comment" section Supplier Comment Online Technical Support - STMicroelectronics : Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date TDA75613LV S848*UK80AC6 A SH1A Amount UoM Unit type ST ECOPACK Grade Each ECOPACK 2 Manufacturing information J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles NAC NAC NAC bulk Solder Termination Terminal Plating Terminal Base Alloy Comment Not Applicable ; if coating is used o Tin (Sn), bright, reflowed Copper Alloy Package Designator Size Nbr of instances Shape SMO 15.7x29.23x NAC Comment

3 Material Composition Declaration Mfr Item Name S848*UK80AC Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) die (s) Other inorganic materials supplier die Silicon (Si) die (s) supplier metallization Aluminium (Al) die (s) supplier metallization Copper (Cu) die (s) supplier metallization Tantalum (Ta) die (s) supplier metallization Cobalt (Co) die (s) supplier metallization Titanium (Ti) die (s) supplier metallization Tungsten (W) die (s) supplier metallization Palladium (Pd) die (s) supplier metallization Nickel (Ni) die (s) supplier metallization Gold (Au) die (s) supplier metallization Platinum (Pt) die (s) supplier passivation Silver (Ag) die (s) supplier passivation Tin (Sn) die (s) supplier passivation Silicon Nitride (SiN) die (s) supplier passivation Silicon Oxide(SiO2) die (s) supplier passivation Indium Tin oxide ( In203:SnO2 ) die (s) R passivation Lead Oxide (PbO) die (s) supplier back side metallization Aluminium (Al) die (s) supplier back side metallization Copper (Cu) die (s) supplier back side metallization Titanium (Ti) die (s) supplier back side metallization Chromium (Cr) die (s) supplier back side metallization Gold (Au) die (s) supplier back side metallization Nickel (Ni) die (s) supplier back side metallization Vanadium (V) die (s) supplier back side metallization Silver (Ag) die (s) supplier glass coating Glass : Aluminium Oxide (Al2O3) die (s) supplier glass coating Glass : Boron Trioxide (B2O3) die (s) supplier glass coating Glass : Potassium Oxide (K2O) die (s) supplier glass coating Glass : Sodium Oxide (Na2O) die (s) supplier glass coating Glass: Silicon Dioxide (Si02) die (s) supplier polymer die coating Benzocyclobutene (BCB) die (s) supplier polymer die coating Polymer resist - ASAHI Proprietary 0 die (s) supplier polymer die coating Polymer resist (Black resist)) Proprietary 0 die (s) supplier polymer die coating Polymer resist (color, planar,µlens) Proprietary 0 die (s) supplier polymer die coating Polymer resist (Glue) Proprietary 0 UBM 0 supplier UBM Aluminium (Al) UBM supplier UBM Copper (Cu) UBM supplier UBM Titanium (Ti) UBM supplier UBM Chromium (Cr) UBM supplier UBM Gold (Au) UBM supplier UBM Nickel (Ni) UBM supplier UBM Vanadium (V) UBM supplier UBM Silver (Ag) BUMPS 0 supplier bump Tin (Sn) BUMPS supplier bump Silver (Ag) BUMPS supplier bump Copper (Cu) BUMPS supplier bump Nickel (Ni) BUMPS supplier bump Antimony (Sb) BUMPS R bump Lead (Pb) Lead in solders t 0 Leadframe Copper & its alloys supplier alloy Copper (Cu) Leadframe supplier alloy Iron (Fe) Leadframe supplier alloy Phosphorus (P) Leadframe supplier alloy Iron Phosphide (FeP) Leadframe supplier alloy Nickel (Ni) Leadframe supplier alloy Zinc (Zn) Leadframe supplier alloy Magnesium (Mg) Leadframe supplier alloy Silicon (Si) Leadframe supplier alloy CopperPosphorous (CuP) Leadframe supplier alloy Tin (Sn)

4 Leadframe supplier alloy Cobalt (Co) Leadframe supplier alloy Zirconium (Zr) Leadframe supplier alloy Chromium (Cr) Leadframe supplier alloy Silver (Ag) Leadframe supplier alloy Sulfur (S) Leadframe supplier alloy Manganese (Mn) Leadframe supplier alloy Carbon Leadframe supplier metallization Nickel (Ni) Leadframe supplier metallization Palladium (Pd) Leadframe supplier metallization Gold (Au) Leadframe supplier metallization Silver (Ag) Leadframe supplier metallization Phosphorus (P) xxx 0 supplier ZZZ 0 ZZZ ZZZ Die attach JIG Table A glue or tape Lead (Pb) Die attach supplier glue or tape Silver (Ag) Die attach supplier glue or tape Tin (Sn) Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach supplier glue or tape Die attach 0 glue or tape Die attach 2 0 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Die attach 2 supplier glue or tape Soft solder 0 supplier solder Soft solder supplier solder Soft solder supplier solder Soft solder supplier solder 0 0 0

5 Soft solder supplier solder Soft solder supplier solder Soft solder supplier solder Soft solder supplier solder Soft solder supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Soft solder -2 supplier solder Bonding wire supplier wire Gold (Au) Bonding wire supplier wire Copper (Cu) Bonding wire supplier wire Palladium (Pd) Bonding wire supplier wire Platinium (Pt) Bonding wire supplier wire Silver (Ag) Bonding wire supplier wire Aluminium (Al) Bonding wire supplier wire Magnesium (Mg) Bonding wire supplier wire Silicium (Si) Underfill 0 supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin Underfill supplier resin encapsulation supplier mold compound Amorphous Silica encapsulation supplier mold compound Epoxy Cresol Novolak encapsulation supplier mold compound epoxy resin na encapsulation supplier mold compound Phenol resin na encapsulation supplier mold compound Carbon black encapsulation JIG table B mold compound Bismuth (Bi) encapsulation supplier mold compound encapsulation supplier mold compound encapsulation supplier mold compound encapsulation supplier mold compound encapsulation supplier mold compound encapsulation supplier mold compound BBB 0 BBB BBB BBB solder paste Solder 0 solder solder paste solder paste solder paste solder paste solder paste solder paste solder paste solder paste connections coating Solder supplier solder alloy Tin (Sn) connections coating R solder alloy Lead (Pb) connections coating supplier solder alloy Copper (Cu) connections coating supplier solder alloy Silver (Ag) connections coating supplier solder alloy subelement

6 subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement subelement Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Sub element Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement Subelement