Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda:
|
|
- Sabina Lynch
- 6 years ago
- Views:
Transcription
1 EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie SOI Micromachining Agenda: SOI Micromachining SOI MUMPs Multi-level structures Lecture 5 Silicon-on-Insulator Microstructures Single-crystal silicon Flatness (optical MEMS) Robustness High-Q High-power capacity Good temperature stability High resolution, low noise (Inertial sensors) Thickness control SOI CMOS compatibility A big trend for optical MEMS and inertial sensors EEL6935 Advanced MEMS 2005 H. Xie 1/19/ EEL6935 Advanced MEMS 2005 H. Xie 2 SOI MUMPs process Silicon as structural layer Silicon as structural and sacrificial material Two-level beam structures Multilevel beam structures Buckled beam structures Many others SOI Micromachining SOI MUMPs Features: Silicon-on-insulator (SOI) wafer as the starting substrate: Silicon thickness: 10 ± 1 µm or 25 ± 1 µm Oxide thickness: 1 ± 0.05 µm Handle wafer (Substrate) thickness: 400 ± 5 µm Silicon layer is doped and can be used for mechanical structures, resistor structures, and/or electrical routing. Backside Substrate etch allows for through-hole structures. Shadow-masked metal process for coarse Metal features such as bond pads, electrical routing, and optical mirror surfaces. A second pad-metal feature that allows finer metal features and precision alignment but limited to areas not etched in the silicon device layer. EEL6935 Advanced MEMS 2005 H. Xie 1/12/ EEL6935 Advanced MEMS 2005 H. Xie 4
2 SOI MUMPs Process Flow (1) SOI MUMPs Process Flow (2) Silicon layer: 10um Oxide layer: 1um Substrate: 400um Bottom oxide present Starting Substrate SOI Wafer First mask (PAD METAL) 20nm Cr/500nm gold (E-beam evaporation) Metal Liftoff PSG deposition Annealing: 1050 C, 1 hour Remove PSG Silicon Doping Photoresist as mask DRIE Silicon Patterning EEL6935 Advanced MEMS 2005 H. Xie 5 EEL6935 Advanced MEMS 2005 H. Xie 6 SOI MUMPs Process Flow (3) SOI MUMPs Process Flow (4) Protection material applied to front side Pattern backside oxide DRIE silicon from back side, stopping on the middle oxide Remove photoresist Wet etch oxide (both middle layer and backside layer) Substrate Patterning Release Separate silicon wafer DRIE silicon Shadow Mask Shadow Mask Bonding and Metal Deposition Dry etch protection material Vapor HF etch oxide Expose silicon layer and substrate for electrical contacts Temporarily bond the shadow mask Metal deposition: 50nm Cr /600nm Au EEL6935 Advanced MEMS 2005 H. Xie 7 EEL6935 Advanced MEMS 2005 H. Xie 8
3 SOI MUMPs Process Flow (5) SOI MUMPs Example Remove the shadow mask Shadow Mask Removal In-Plane Vibrating Diffraction Grating Scanning an optical angle of 15.9 at a resonant frequency of 8.34 khz for a 635-nm wavelength incident laser beam, electrostatically driven by 15-V dc bias and 15-Vac voltages EEL6935 Advanced MEMS 2005 H. Xie 9 G. Zhou et al, IEEE Photonics Technology Letters, Vol.16, no. 10, (2004) EEL6935 Advanced MEMS 2005 H. Xie 10 SOI MEMS Processes -2 SOI MEMS Processes -3 Backside Etch Angular Comb Drive Actuator Frontside HF Release SOI wafer DRIE Si etch LPCVD Si3N4 Light-weight SOI MEMS Mirror LPCVD poly-si Oxidize poly-si CMP LPCVD poly-si Si DRIE RTA 750~900 C to form tensile stress HF release Supercritical drying Patterson et al, OFC 2002 EEL6935 Advanced MEMS 2005 H. Xie 11 J.T. Nee et al, MEMS 2000 EEL6935 Advanced MEMS 2005 H. Xie 12
4 Multilevel Beam Microstructures Multilevel Beam Fabrication Process (1) Torsional Mirror Concept SOI wafer DRIE Si etch LPCVD Si3N4 Vertical Comb- Drive Mirror V. Milanovic, JMEMS, vol.13 (2004) EEL6935 Advanced MEMS 2005 H. Xie 13 EEL6935 Advanced MEMS 2005 H. Xie 14 (e) (f) (g) Multilevel Beam Fabrication Process (2) SOI wafer DRIE Si etch LPCVD Si3N4 SOI substrate Two-side alignment DRIE silicon on both sides Timed DRIE Si Thickness variations of Upper beams and Lower beams EEL6935 Advanced MEMS 2005 H. Xie 15 Torsional Micromirrors Multilevel Beam Fabrication Process (3) Flat Lightweight High speed Low power Electrostatic actuation V. Milanovic, JMEMS, vol.13 (2004) EEL6935 Advanced MEMS 2005 H. Xie 16
5 SOI MEMS Processes -5 SOI MEMS Processes -6 Vertical Comb Drive SOI Epitaxial MEMS Micromirror Vertically buckled bridge Wet etch SiO2 Poly-Si as HF etching mask Sasaki et al, JMEMS, vol.13 (2004) EEL6935 Advanced MEMS 2005 H. Xie 17 Epitaxial Si/SiGe/Si multilayer structures Vertical symmetry for flat surface Vertical asymmetry for bending Size: 0.1mm by 0.27mm Maximum rotation (static): 10 Tokuda et al, Electronics Letters, vol.40 (2004), no.21 EEL6935 Advanced MEMS 2005 H. Xie 18
Lecture 7 CMOS MEMS. CMOS MEMS Processes. CMOS MEMS Processes. Why CMOS-MEMS? Agenda: CMOS MEMS: Fabrication. MEMS structures can be made
EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie CMOS MEMS Agenda: Lecture 7 CMOS MEMS: Fabrication Pre-CMOS Intra-CMOS Post-CMOS Deposition Etching Why CMOS-MEMS? Smart on-chip CMOS circuitry
More informationMEMS II: January 23. Lab 1: Pop-up mirror - PolyMUMPS - Thermal actuators - Mirror CoventorWare
MEMS II: January 23 Lab 1: Pop-up mirror - PolyMUMPS - Thermal actuators - Mirror CoventorWare Microelectromechanical Systems (MEMS) Multi-User MEMS Processes (MUMPS) Example Design Anchor hole 2.0 0.5
More informationLecture 10: MultiUser MEMS Process (MUMPS)
MEMS: Fabrication Lecture 10: MultiUser MEMS Process (MUMPS) Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, 1 Recap Various VLSI based
More informationFabrication Technology, Part II
EEL5225: Principles of MEMS Transducers (Fall 2003) Fabrication Technology, Part II Agenda: Process Examples TI Micromirror fabrication process SCREAM CMOS-MEMS processes Wafer Bonding LIGA Reading: Senturia,
More informationSOIMUMPs Design Handbook
SOIMUMPs Design Handbook a MUMPs process C. J. Han, Allen Cowen, Greg Hames and Busbee Hardy MEMScAP Revision 3.0 Copyright 2002 by MEMScAP. All rights reserved. Permission to use and copy for internal,
More informationSurface Micromachining
Surface Micromachining Outline Introduction Material often used in surface micromachining Material selection criteria in surface micromachining Case study: Fabrication of electrostatic motor Major issues
More informationSurface Micromachining
Surface Micromachining Micro Actuators, Sensors, Systems Group University of Illinois at Urbana-Champaign Outline Definition of surface micromachining Most common surface micromachining materials - polysilicon
More informationWelcome MNT Conference 1 Albuquerque, NM - May 2010
Welcome MNT Conference 1 Albuquerque, NM - May 2010 Introduction to Design Outline What is MEMs Design General Considerations Application Packaging Process Flow What s available Sandia SUMMiT Overview
More informationSurface micromachining and Process flow part 1
Surface micromachining and Process flow part 1 Identify the basic steps of a generic surface micromachining process Identify the critical requirements needed to create a MEMS using surface micromachining
More informationDesign and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes
TB, KR, JMM/184987, 3/12/2004 INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng. 15 (2005) 1 8 doi:10.1088/0960-1317/15/0/000 Design and fabrication
More information6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term Solution to Problem Set 2 (16 pts)
6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term 2007 By Brian Taff (Adapted from work by Feras Eid) Solution to Problem Set 2 (16 pts) Issued: Lecture 4 Due: Lecture
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2011
Lecture Outline EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720
More informationFABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES. Jack W. Judy and Richard S. Muller
FABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES Jack W. Judy and Richard S. Muller Berkeley Sensor & Actuator Center (BSAC) Department of EECS, University of California, Berkeley,
More informationEE C245 ME C218 Introduction to MEMS Design
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 10: Surface
More informationMICRO-ELECTRO-MECHANICAL VARIABLE BLAZE GRATINGS
MICRO-ELECTRO-MECHANICAL VARIABLE BLAZE GRATINGS D. M. Burns and V. M. Bright Air Force Institute of Technology Department of Electrical and Computer Engineering Wright-Patterson Air Force Base, OH 45433-7765
More informationLecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2
Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 6 Through-wafer Interconnect EEL6935 Advanced MEMS 2005 H. Xie 1/21/2005 1 Motivations: Wafer-level packaging CMOS 3D Integration
More informationProceedings Post Fabrication Processing of Foundry MEMS Structures Exhibiting Large, Out-of-Plane Deflections
Proceedings Post Fabrication Processing of Foundry MEMS Structures Exhibiting Large, Out-of-Plane Deflections LaVern Starman 1, *, John Walton 1, Harris Hall 1 and Robert Lake 2 1 Sensors Directorate,
More information4/10/2012. Introduction to Microfabrication. Fabrication
Introduction to Microfabrication Fabrication 1 MEMS Fabrication Flow Basic Process Flow in Micromachining Nadim Maluf, An introduction to Microelectromechanical Systems Engineering 2 Thin Film Deposition
More informationRegents of the University of California 1
Electroplating: Metal MEMS Nickel Surface-Micromachining Process Flow Photoresist Wafer Release Etchant Use electroplating to obtain metal μstructures When thick: call it LIGA Pros: fast low temp deposition,
More informationLecture 3: Integrated Processes
Lecture 3: Integrated Processes Single-Crystal Silicon Process Integration Polysilicon Micromachining Process Integrated CMOS Micromachining Process ENE 5400, Spring 2004 1 Single Crystal Silicon ENE 5400,
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 10: Bulk
More informationCambridge University Press A Guide to Hands-on MEMS Design and Prototyping Joel A. Kubby Excerpt More information.
1 Introduction 1.1 Overview of MEMS fabrication Microelectromechanical systems (MEMS) fabrication developed out of the thin-film processes first used for semiconductor fabrication. To understand the unique
More informationDr. Lynn Fuller Webpage:
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Microelectromechanical Systems (MEMs) Process Integration Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester,
More informationRegents of the University of California
Topography Issues Degradation of lithographic resolution PR step coverage, streaking Thickness differences pose problems for reduction steppers Direction of Spin PR PR PR Stringers Problematic when using
More informationToday s Class. Materials for MEMS
Lecture 2: VLSI-based Fabrication for MEMS: Fundamentals Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class What is
More informationSurface Micromachining II
Surface Micromachining II Dr. Thara Srinivasan Lecture 4 Picture credit: Sandia National Lab Lecture Outline Reading From reader: Bustillo, J. et al., Surface Micromachining of Microelectromechanical Systems,
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationRegents of the University of California
Surface-Micromachining Process Flow Photoresist Sacrificial Oxide Structural Polysilcon Deposit sacrificial PSG: Target = 2 m 1 hr. 40 min. LPCVD @450 o C Densify the PSG Anneal @950 o C for 30 min. Lithography
More informationMicro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee
Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu September 2, 2008 1 Three
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationPHYS 534 (Fall 2008) Process Integration OUTLINE. Examples of PROCESS FLOW SEQUENCES. >Surface-Micromachined Beam
PHYS 534 (Fall 2008) Process Integration Srikar Vengallatore, McGill University 1 OUTLINE Examples of PROCESS FLOW SEQUENCES >Semiconductor diode >Surface-Micromachined Beam Critical Issues in Process
More informationChapter 3 CMOS processing technology
Chapter 3 CMOS processing technology (How to make a CMOS?) Si + impurity acceptors(p-type) donors (n-type) p-type + n-type => pn junction (I-V) 3.1.1 (Wafer) Wafer = A disk of silicon (0.25 mm - 1 mm thick),
More informationEE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects
EE 330 Lecture 9 IC Fabrication Technology Part II -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects Review from Last Time IC Fabrication Technology Crystal Preparation
More informationInvited Paper. Berkeley, CA, USA Davis, CA, USA ABSTRACT 1. INTRODUCTION
Invited Paper Optical Phased Array Using Single Crystalline Silicon High-Contrast- Gratings for Beamsteering Byung-Wook Yoo* a, Trevor Chan b, Mischa Megens a, Tianbo Sun a, Weijian Yang a, Yi Rao a, David
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationEECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 9/13/2007 Fabrication Technology Lecture 1 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world)
More information5.8 Diaphragm Uniaxial Optical Accelerometer
5.8 Diaphragm Uniaxial Optical Accelerometer Optical accelerometers are based on the BESOI (Bond and Etch back Silicon On Insulator) wafers, supplied by Shin-Etsu with (100) orientation, 4 diameter and
More informationThomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer
Thomas M. Adams Richard A. Layton Introductory MEMS Fabrication and Applications Springer Contents Preface xiü Part I Fabrication Chapter 1: Introduction 3 1.1 What are MEMS? 3 1.2 Why MEMS? 4 1.2.1. Low
More informationProcess Integration. NMOS Generic NMOS Process Flow. CMOS - The MOSIS Process Flow
Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques
More informationVLSI Digital Systems Design
VLSI Digital Systems Design CMOS Processing cmpe222_03process_ppt.ppt 1 Si Purification Chemical purification of Si Zone refined Induction furnace Si ingot melted in localized zone Molten zone moved from
More informationSensors and Actuators Designed and Fabricated in a. Micro-Electro-Mechanical-Systems (MEMS) Course. Using Standard MEMS Processes
Sensors and Actuators Designed and Fabricated in a Micro-Electro-Mechanical-Systems (MEMS) Course Using Standard MEMS Processes M.G. Guvench University of Southern Maine guvench@maine.edu Abstract Use
More informationCompact hybrid plasmonic-si waveguide structures utilizing Albanova E-beam lithography system
Compact hybrid plasmonic-si waveguide structures utilizing Albanova E-beam lithography system Introduction Xu Sun Laboratory of Photonics and Microwave Engineering, Royal Institute of Technology (KTH),
More informationPreface Preface to First Edition
Contents Foreword Preface Preface to First Edition xiii xv xix CHAPTER 1 MEMS: A Technology from Lilliput 1 The Promise of Technology 1 What Are MEMS or MST? 2 What Is Micromachining? 3 Applications and
More informationInterconnect Issues for Integrated MEMS Technology
Interconnect Issues for Integrated MEMS Technology Tsu-Jae King, Roger T. Howe *, Marie-Ange Eyoum and Sunil A. Bhave * Dept. of Electrical Engineering and Computer Sciences, * Berkeley Sensor and Actuator
More informationIntegrated Processes. Lecture Outline
Integrated Processes Thara Srinivasan Lecture 14 Picture credit: Lemkin et al. Lecture Outline From reader Bustillo, J. et al., Surface micromachining of MEMS, pp. 1556-9. A.E. Franke et al., Polycrystalline
More informationLect. 2: Basics of Si Technology
Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from fractions of nanometer to several micro-meters
More informationGAS TURBINE ENGINE PROGNOSTICS AND EQUIPMENT HEALTH MANAGEMENT
Project Project director Research unit E-20-F75 JACOBS CEE LAURENCE Title GAS TURBINE ENGINE PROGNOSTICS AND EQUIPMENT HEALTH MANAGEMENT Project date 8/31/2001 MEMS Sensors for the Non-Contact Ultrasonic
More informationLecture 8-1 MCNC/MUMPS Process
F. G. Tseng Fall/2016, 8-1, p1 Lecture 8-1 MCNC/MUMPS Process!! MCNC/MUMPS structure Layers provided: 7.0 µm Cr/Au=0.5 poly2=1.5 ox2=0.5 poly1=2.0 ox1=2.0 Poly0=0.5 Nitride=0.5 MUMPS Cross section with
More information4. Process Integration: Case Studies
Case Study #2: FCantilevered Microgripper Surface Machined MEMS Case Study #2: FCantilevered Microgripper Sandia Lucent Sandia Integrated Accelerometers Optomechanical Systems Integrated Sensors 1 Bulk
More informationSilicon Nitride Biaxial Pointing Mirrors with Stiffening Ribs
Silicon Nitride Biaxial Pointing Mirrors with Stiffening Ribs Todd J. Kaiser, B. Jeffrey Lutzenberger, Robert A. Friholm, Phillip A. Himmer, David L. Dickensheets Department of Electrical and Computer
More informationChapter 3 Silicon Device Fabrication Technology
Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale
More informationProcess Integration. MEMS Release Techniques Sacrificial Layer Removal Substrate Undercut
Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques
More informationEE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects
EE 330 Lecture 9 IC Fabrication Technology Part II -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects Review from Last Time Etching Dry etch (anisotropic) SiO
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 9: Surface
More informationMEMS Devices. Fraunhofer Institute for Silicon Technology ISIT. Itzehoe, Germa. any
Examples of CMP Processess for the Manufacturing of MEMS Devices Gerfried Zwicke er Fraunhofer Institute for Silicon Technology ISIT Itzehoe, Germa any gerfried.zwicker@isit.fraunhofer.de Contents MEMS
More informationPiezoMUMPs Design Handbook
PiezoMUMPs Design Handbook a MUMPs process Allen Cowen, Greg Hames, Konstantin Glukh, and Busbee Hardy MEMSCAP Inc. Revision 1.3 Copyright 2014 by MEMSCAP Inc.,. All rights reserved. Permission to use
More informationMEMS Surface Fabrication
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Surface Fabrication Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute
More information9/4/2008 GMU, ECE 680 Physical VLSI Design
ECE680: Physical VLSI Design Chapter II CMOS Manufacturing Process 1 Dual-Well Trench-Isolated CMOS Process gate-oxide TiSi 2 AlCu Tungsten SiO 2 p-well poly n-well SiO 2 n+ p-epi p+ p+ 2 Schematic Layout
More informationEE 143 FINAL EXAM NAME C. Nguyen May 10, Signature:
INSTRUCTIONS Read all of the instructions and all of the questions before beginning the exam. There are 5 problems on this Final Exam, totaling 143 points. The tentative credit for each part is given to
More informationFabrication Technology, Part I
EEL5225: Principles of MEMS Transducers (Fall 2003) Fabrication Technology, Part I Agenda: Oxidation, layer deposition (last lecture) Lithography Pattern Transfer (etching) Impurity Doping Reading: Senturia,
More informationEE 330 Lecture 9. IC Fabrication Technology Part 2
EE 330 Lecture 9 IC Fabrication Technology Part 2 Quiz 8 A 2m silicon crystal is cut into wafers using a wire saw. If the wire diameter is 220um and the wafer thickness is 350um, how many wafers will this
More informationWaferlevel Vacuum Packaged Microscanners: A High Yield Fabrication Process for Mobile Applications
05-Oldsen V4 N2-af 20.08.09 12:00 Page 73 Waferlevel Vacuum Packaged Microscanners: A High Yield Fabrication Process for Mobile Applications Marten Oldsen, Ulrich Hofmann, Joachim Janes, Hans-Joachim Quenzer,
More information3. Overview of Microfabrication Techniques
3. Overview of Microfabrication Techniques The Si revolution First Transistor Bell Labs (1947) Si integrated circuits Texas Instruments (~1960) Modern ICs More? Check out: http://www.pbs.org/transistor/background1/events/miraclemo.html
More informationLecture #18 Fabrication OUTLINE
Transistors on a Chip Lecture #18 Fabrication OUTLINE IC Fabrication Technology Introduction the task at hand Doping Oxidation Thin-film deposition Lithography Etch Lithography trends Plasma processing
More informationWe are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors
We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists 3,900 116,000 120M Open access books available International authors and editors Downloads Our
More information3.155J / 6.152J Micro/Nano Processing Technology TAKE-HOME QUIZ FALL TERM 2005
3.155J / 6.152J Micro/Nano Processing Technology TAKE-HOME QUIZ FALL TERM 2005 1) This is an open book, take-home quiz. You are not to consult with other class members or anyone else. You may discuss the
More informationVertical high voltage devices on thick SOI with back-end trench formation
Vertical high voltage devices on thick SOI with back-end trench formation U. Heinle, K. Pinardi *, and J. Olsson, Uppsala University, Sweden * Chalmers Technical University, Gothenburg, Sweden Outline
More informationLecture 5: Micromachining
MEMS: Fabrication Lecture 5: Micromachining Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class E-beam lithography X-ray
More informationEE 330 Lecture 8. IC Fabrication Technology Part II. - Masking - Photolithography - Deposition - Etching - Diffusion
EE 330 Lecture 8 IC Fabrication Technology Part II?? - Masking - Photolithography - Deposition - Etching - Diffusion Review from Last Time Technology Files Provide Information About Process Process Flow
More informationThis Appendix discusses the main IC fabrication processes.
IC Fabrication B B.1 Introduction This Appendix discusses the main IC fabrication processes. B.2 NMOS fabrication NMOS transistors are formed in a p-type substrate. The NMOS fabrication process requires
More informationIC/MEMS Fabrication - Outline. Fabrication
IC/MEMS Fabrication - Outline Fabrication overview Materials Wafer fabrication The Cycle: Deposition Lithography Etching Fabrication IC Fabrication Deposition Spin Casting PVD physical vapor deposition
More informationSurface Micromachining of Uncooled Infrared Imaging Array Using Anisotropic Conductive Film
Surface Micromachining of Uncooled Infrared Imaging Array Using Anisotropic Conductive Film Weiguo Liu, Lingling Sun, Weiguang Zhu, Ooi Kiang Tan Microelectronics Center, School of Electrical and Electronic
More informationIntroduction to Microeletromechanical Systems (MEMS) Lecture 5 Topics. JDS Uniphase MUMPs
Introduction to Microeletromechanical Systems (MEMS) Lecture 5 Topics JDS Uniphase MUMPS Foundry Process and Devices Foundry Process Sequence Design Rules and Process Interactions Examples CMOS for MEMS
More informationReview of CMOS Processing Technology
- Scaling and Integration Moore s Law Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from
More informationUltrasonic Micromachining in the fabrication of MEMS Micro-sensors
Ultrasonic Micromachining in the fabrication of MEMS Micro-sensors Jamil Akhtar Professor AcSIR New Delhi Chief Scientist & Head, CSIR-CEERI, Pilani, INDIA CEERI, Pilani A constituent laboratory of CSIR,
More informationCMOS Technology. Flow varies with process types & company. Start with substrate selection. N-Well CMOS Twin-Well CMOS STI
CMOS Technology Flow varies with process types & company N-Well CMOS Twin-Well CMOS STI Start with substrate selection Type: n or p Doping level, resistivity Orientation, 100, or 101, etc Other parameters
More informationEE 330 Lecture 8. IC Fabrication Technology Part II. - Oxidation - Epitaxy - Polysilicon - Interconnects
EE 330 Lecture 8 IC Fabrication Technology Part II - Oxidation - Epitaxy - Polysilicon - Interconnects Review from Last Time MOS Transistor Bulk Source Gate Drain p-channel MOSFET Lightly-doped n-type
More informationEE 434 Lecture 9. IC Fabrication Technology
EE 434 Lecture 9 IC Fabrication Technology Quiz 7 The layout of a film resistor with electrodes A and B is shown. If the sheet resistance of the film is 40 /, determine the resistance between nodes A and
More informationCS/ECE 5710/6710. N-type Transistor. N-type from the top. Diffusion Mask. Polysilicon Mask. CMOS Processing
CS/ECE 5710/6710 CMOS Processing Addison-Wesley N-type Transistor D G +Vgs + Vds S N-type from the top i electrons - Diffusion Mask Mask for just the diffused regions Top view shows patterns that make
More information2242 ieee transactions on ultrasonics, ferroelectrics, and frequency control, vol. 52, no. 12, december 2005
2242 ieee transactions on ultrasonics, ferroelectrics, and frequency control, vol. 52, no. 12, december 2005 Capacitive Micromachined Ultrasonic Transducers: Fabrication Technology Arif Sanlı Ergun, Member,
More informationFabrication of Nanoscale Silicon Membranes on SOI Wafers Using Photolithography and Selective Etching Techniques:
Fabrication of Nanoscale Silicon Membranes on SOI Wafers Using Photolithography and Selective Etching Techniques: Participant Names: Moriah Faint, Marcos Rodriguez Mentor: Frank Tsang Date: 1 Introduction
More informationDesign Handbook. amems Process Technology. A RSC MEMS Technology. Rockwell Scientific Company, LLC. Revision 1.0
Design Handbook amems Process Technology A RSC MEMS Technology Rockwell Scientific Company, LLC Revision 1.0 Copyright 2005 Rockwell Scientific Company, LLC. All rights reserved. Pyrex and Vycor are trademarks
More informationMicroelectronics. Integrated circuits. Introduction to the IC technology M.Rencz 11 September, Expected decrease in line width
Microelectronics Introduction to the IC technology M.Rencz 11 September, 2002 9/16/02 1/37 Integrated circuits Development is controlled by the roadmaps. Self-fulfilling predictions for the tendencies
More informationFabrication technique for microelectromechanical systems vertical comb-drive actuators on a monolithic silicon substrate
Fabrication technique for microelectromechanical systems vertical comb-drive actuators on a monolithic silicon substrate Q. X. Zhang Institute of Microelectronics, 11 Science Park Road, Singapore Science
More informationASIM-X MEMS-Specific Design Rules
ASIM-X MEMS-Specific Design Rules Version 2 Revised April 5, 2006. This is a beta version, subject to change. Revised by G. K. Fedder, Carnegie Mellon University. 1 Process Overview ASIM-X, an acronym
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2011
EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture EE C245:
More informationEE C247B ME C218 Introduction to MEMS Design Spring 2014
EE C247B ME C218 Introduction to MEMS Design Spring 2014 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture EE
More informationAn SOI Process for Fabrication. of Solar Cells, Transistors and Electrostatic Actuators. Berkeley Sensor and Actuator Center
An SOI Process for Fabrication of Solar Cells, Transistors and Electrostatic Actuators Colby L Bellew, Seth Hollar and K.S.J. Pister University of California at Berkeley Berkeley Sensor and Actuator Center
More informationMEMS Fabrication. Beyond Integrated Circuits. MEMS Basic Concepts
MEMS Fabrication Beyond Integrated Circuits MEMS Basic Concepts Uses integrated circuit fabrication techniques to make mechanical as well as electrical components on a single chip. Small size 1µm 1mm Typically
More informationMikrosensorer. Microfabrication 1
Mikrosensorer Microfabrication 1 Literature Introductory MEMS Fabrication and Applications Thomas M. Adams and Richard A. Layton Available as ebook on http://www.lub.lu.se/en/search/lubsearch.html This
More informationMostafa Soliman, Ph.D. May 5 th 2014
Mostafa Soliman, Ph.D. May 5 th 2014 Mostafa Soliman, Ph.D. 1 Basic MEMS Processes Front-End Processes Back-End Processes 2 Mostafa Soliman, Ph.D. Wafers Deposition Lithography Etch Chips 1- Si Substrate
More informationSurface Micromachining and Inertial Sensors
Surface Micromachining and Inertial Sensors Tutorial 2A Bob Sulouff Analog Devices Inc. Cambridge, MA. 02139 Bob.Sulouff@Analog.com 617-761- Presentation Outline Technology of MEMS Surface Micromachined
More informationINF5490 RF MEMS. LN02: MEMS Fabrication. Spring 2012, Oddvar Søråsen Department of Informatics, UoO
INF5490 RF MEMS LN02: MEMS Fabrication Spring 2012, Oddvar Søråsen Department of Informatics, UoO 1 Micromachining Today s lecture Important process steps General Summary: MEMS-specific steps Examples
More informationIsolation Technology. Dr. Lynn Fuller
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Isolation Technology Dr. Lynn Fuller Motorola Professor 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Fax (585) 475-5041
More informationMEMS Packaging Techniques for Silicon Optical Benches
MEMS Packaging Techniques for Silicon Optical Benches Hayden Taylor David Moore, Mohamed Boutchich, Billy Boyle, Johnny He, Graham McShane, Richard Breen, Rob Wylie CAMBRIDGE UNIVERSITY ENGINEERING DEPARTMENT
More informationPoly-SiGe MEMS actuators for adaptive optics
Poly-SiGe MEMS actuators for adaptive optics Blake C.-Y. Lin a,b, Tsu-Jae King a, and Richard S. Muller a,b a Department of Electrical Engineering and Computer Sciences, b Berkeley Sensor and Actuator
More informationCMOS Manufacturing process. Design rule set
CMOS Manufacturing process Circuit design Set of optical masks Fabrication process Circuit designer Design rule set Process engineer All material: Chap. 2 of J. Rabaey, A. Chandrakasan, B. Nikolic, Digital
More informationPROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS
Contents: VI Sem ECE 06EC63: Analog and Mixed Mode VLSI Design PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS 1. Introduction 2. CMOS Fabrication 3. Simplified View of Fabrication Process 3.1 Alternative
More informationEE C247B ME C218 Introduction to MEMS Design Spring 2015
EE C247B ME C218 Introduction to MEMS Design Spring 2015 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture EE
More informationChemical Vapor Deposition
Chemical Vapor Deposition ESS4810 Lecture Fall 2010 Introduction Chemical vapor deposition (CVD) forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gas compounds
More information