Surface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA. Nano-Bio Electronic Materials and Processing Lab.
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1 Surface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA
2 Issues on contaminants on EUV mask Particle removal on EUV mask surface Carbon contamination removal on EUV mask surface
3 Scaling Scenario : Lithography G. Chung, Partnership to build a better future, and leading edge collaboration, SPCC (2012) 3
4 Issues of EUV mask contamination Pattern defect on wafer by particle on EUV mask EUV mask contamination EUV light Reflectivity loss TaBO/TaBN A-L (80nm) Ru C-L (2.5nm) Mo-Si M-L (280nm) Y. Hyun, et al., Proc of SPIE 9422, 94221U1 (2015) CD change by carbon contamination on EUV mask Substrate (Quartz) Cond. Film (CrN, 70nm) Particles: pattern defects on Si wafer Carbon contaminant: pattern CD change H.S. Lee, et.al, Proc. of SPIE Vol.7748, (2010) 4
5 Particle contamination on EUV mask Schematic of particle contamination on EUV mask Particles: organic, inorganic, metallic Critical particle size w/ various materials on 16 nm HP node 40 Simulation condition - Fast Litho tool - Pseudo-Spectral Time Domain (PSTD) method - Parameters: n, k, thickness Absorber Capping Multilayers Critical size (nm) Sn TaN W SiO2 C Various type of particle can be deposited on the capping or absorber layer All types of particles should be removed from EUV mask surface (Capping, Absorber) 5
6 Issue of carbon contaminant removal Contamination Cleaning H.S. Lee, et.al, Proc. of SPIE Vol.7748, (2010) Carbon contaminant was removed from ARC surface but not from Ru surface Why carbon contaminant not removed from Ru surface? - Carbon contaminants on Ru surface have higher density and thickness than on ARC surface? - Carbon contaminants have higher adhesion with Ru than ARC surface? H. Lee et al., ECS Transactions, 58 (6), 93 (2013) 6
7 Research objective Surface interactions between contaminants and EUV mask surfaces Contaminants EUV mask surface Particles (inorganic, organic) Ruthenium (Capping layer) Carbon contaminant Tantalum nitride (Absorber layer) 7
8 Experiments Particle removal test 2 kinds of particles - Silica, PSL standard particles (100 nm, Corpuscular, USA) 3 kinds of surfaces - Si wafer, TaN and Ru coated wafer (2 cm x 2 cm) Particle deposition (spin method, particles in DIW) Akrion 0.84 MHz megasonic cleaning with DIW, dnh 4 OH and dtmah Carbon contaminant removal test Hydrocarbon film deposition on TaN and Ru surface - Using PECVD, 40 nm thickness Hydrocarbon removal using solvent based cleaning solution - Dimethyl sulfoxide (DMSO) 80% with NH 4 OH or TMAH (0.1M), 65, 20min (dipping) Analysis Particle removal efficiency measurement - Optical microscope (dark field mode, LV-100D, Nikon, Japan) Chemical bonding analysis using FTIR (Nicolet is50, Thermo Scientific, USA) - Multiple internal reflection (MIR) and attenuated total reflection (ATR) method Contact angle analyzer (Phoenix, SEO, KOREA) 8
9 Silica particle removal with various surfaces Particle removal efficiency (%) Si 6 hr 1 day TaN Substrate Silica 100 nm particles Akrion MS 0.84 MHz 10 W 30 sec Ru PRE of silica various surfaces Si TaN Ru Silica particle removal efficiency was very Si surface even 6hr aging time Silica particle was easily removed from Ru surface Why PRE is different with surface materials? 9
10 Surface interaction (hydrogen bonding) Hydrogen bonding between Si surface and oxide particle Hydrogen bonding with silica (F H-bond ) Van der Waals force with silica (F vdw ) 600 nn 30 nn Hydrogen bonding van der Waals force X. Wu, et al., J. of Appl. Phys. 86 (3) (1999) Si surface and inorganic oxide particles can interact to form hydrogen bonds Adhesion force of hydrogen bonding is much larger than van der Waals force 10
11 Hydrogen bonding analysis (MIR-FTIR) 3300 cm -1 OH hydrogen bond Silica on Si Silica on TaN Detector MIR-FTIR method Silica particles Absorbance (a.u.) Detector Si wafer Silica particles Si wafer IR in TaN layer IR in Wavenumbers (cm -1 ) Surface Si Hydrogen bonding with silica Strong Hydrogen bond peak (3300 cm -1 ) was measured using MIR-FTIR method OH peak is much Si than TaN surface PRE was much Si surface TaN Weak Ru None (only F vdw ) 11
12 PSL particle removal with various surfaces Particle removal efficiency (%) Si TaN Ru Akrion MS 0.84 MHz 10W 10s PSL 100 nm particles Particle Silica PSL Bonding with Ru surface F vdw Metal-carbon bond n Polystyrene π bonding between Ru and aromatic ring Aging time (day) Ru R. A. Zelonka, et al., Can. J. Chem. 50 (1972) In case of PSL particle, PRE was Ru surface than Si and TaN surface Ru (transition metal) can form chemical bonding with aromatic ring of PSL particle Increase adhesion force 12
13 Effect of TMAH on PSL particle removal PRE of silica on Ru surface Particle removal efficiency (%) Rinse 30s 10W 10s Cleaning conditions DIW NH 4 OH TMAH Akrion MS 0.84 MHz Silica 100 nm particles 3day aged on Ru surface ph 10 10W 30s PRE of PSL on Ru surface Particle removal efficiency (%) Rinse 30s 10W 10s Cleaning conditions 10W 30s DIW NH 4 OH TMAH Akrion MS 0.84 MHz PSL 100 nm particles 3 day aged on Ru ph 10 No effect of cleaning solution on silica particle Ru surface TMAH cleaning with megasonic showed higher PRE on PSL particle from Ru surface TMAH can break the metal-carbon bonding as solvent TMAH is very effective to remove organic particle from Ru surface 13
14 Hydrocarbon film deposition RF-PECVD (SRN-501, Sorona, Korea) Process condition Gas ratio (CH 4 : Ar) 1 : 1 Plasma power 240 W Temperature 30 Chamber pressure 0.6 torr Density of hydrocarbon film (1.3 g/cm 3 ) 2924 cm -1 CH 2 and CH Hydrocarbon film Absorbance 2870 cm -1 CH cm -1 CH Wavenumbers (cm -1 ) 14
15 Hydrocarbon removal from TaN and Ru surface Absorbance (a.u.) ATR-FTIR analysis Hydrocarbon film TaN #1 TaN #2 Ru #1 Ru #2 Hydrocarbon film Ru #1 Ru #2 TaN #1 TaN #2 Contact angle ( ) Cleaning solution #1 DMSO (80%) + NH 4 OH (0.1 M) #2 DMSO (80%) + TMAH (0.1 M) 100 TaN Ru Wavenumbers (cm -1 ) 0 Carbon film #1 #2 #1 #2 Cleaning solutions TMAH can help remove hydrocarbon with DMSO Carbon peaks of hydrocarbon film was removed at TMAH added DMSO cleaning solution from TaN surface Hydrocarbon film was not removed from Ru TMAH with DMSO cleaning solution 15
16 Hydrocarbon removal from TaN and Ru surface Surface images after cleaning process (OM) #1 (DMSO + NH 4 OH) #2 (DMSO + TMAH) Not removed CA: 76 Removed CA: 40 TaN surface Hydrocarbon film Carbon residue 200X 100μm 200X 100μm Not removed CA: 71 CA: 77 Partially removed Ru surface Hydrocarbon film Hydrocarbon film Ru surface 200X 100μm 200X 100μm Hydrocarbon film is still remained on Ru surface (partially removed) 16
17 Mechanism of hydrocarbon removal Hydrocarbon removal in DMSO with TMAH cleaning solution No interaction Strong adhesion by metal-carbon interaction Hydrocarbon activation with transition metal M. R. A. Blomberg, et al., J. Am. Chem. Soc., 113 (2), 424 (1991) More difficult to remove hydrocarbon film from Ru surface by transition metal carbon interaction than those from TaN surface 17
18 Summary Need to understand the surface interaction between contaminants and substrates in EUV masks Silica & PSL particle removal - Hydrogen bonding is dominant on oxide particle removal from surface PRE of silica : Si << TaN < Ru - PRE of PSL is Ru surface due to metal carbon interaction TMAH is effective to enhance organic particle removal from Ru surface Hydrocarbon film removal - DMSO with TMAH cleaning solution can remove hydrocarbon film from TaN surface - More difficult to remove carbon contaminant from Ru surface Transition metal hydrocarbon interaction between Ru and hydrocarbon film 18
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