Product Specification

Transcription

1 Product Name : AEM Part Number : Customer : Customer Revision: 2 Date: AEM Components (Suzhou) Co., Ltd 458 Shenhu Road, Suzhou Industrial Park Jiangsu, P.R China, TEL: FAX: *.The specification are the property of AEM Components Co.Ltd and shall not be copied or used as commercial purposes without permission. Prepared by Checked by Approved by Accepted by customer Lingling Li Yan Ma Yan Ma Customer Signature Page:1/8

2 1 Operating Temperature Range -55 ~ Electrical Characteristics Characteristic Value ESD Capability IEC Direct Discharge IEC Air Discharge Trigger Voltage Clamping Voltage Response Time Capacitance (1.0 GHz) Leakage Current Rated Voltage ESD Pulse Withstand Level 4-8 kv Level 4-15 kv 300 V (typical) (measured per IEC , Level 4, 8 kv) 30 V (typical) (measured per IEC , Level 4, 8 kv) Less than 1 ns 0.25 pf (typical),0.5pf (Max) 0.1 na (typical),10na (Max) (measured at 14 VDC) 14 VDC (max.) 1000 Pulses (typical) 3 Shape and Dimensions: Inch (mm) Size L W T BW 0603 (1608) ± ± ± ± (1.60 ± 0.15) (0.80 ± 0.15) (0.80 ± 0.15) (0.36 ± 0.15) Page:2/8

3 4 Representative test waveform per IEC Level 4, 8 kv Page:3/8

4 Product Specification 5 Product Identification ES 0603 V014 C T (1) (2) (3) (4) (5) (1) Category code (2) Dimension code: L x W (inch) The first two digits - L (length) The last two digits - W (width) (3) Rated voltage code: V VDC (4) Series code (5) Package code: T - Tape & Reel B - Bulk 6 Features 6.1 Excellent protection against ESD damage 6.2 Ultra low capacitance for high speed data lines 6.3 Very low leakage current 6.4 Instant response time (<1 ns) 6.5 Bi-directional flip-chip design 6.6 Glass ceramic monolithic structure with special Ag/Pd composite ESD materials 6.7 Silver termination with nickel and lead-free solder plating offering excellent solderability and leach resistance 6.8 Outstanding durability (able to withstand 1000 strikes typical) % lead-free 6.10 RoHS compliant 7 Typical Applications 7.1 USB 7.2 IEEE HDMI 7.4 DisplayPort 7.5 DVI 7.6 Antennas 7.7 UDI 7.8 E-SATA 7.9 LCD TV 7.10 Set Top Box 7.11 DVD 7.12 LCD Monitor 7.13 Notebook 7.14 Mobile Phone 7.15 Netbook 7.16 MID Page:4/8

5 CUSTOMER: Customer Product Specification 8 Recommended PCB oard Land Pattern L G H Chip Size Inch (mm) Inch (mm) Inch (mm) 0603 (1608) (2.20) (0.80) (1.00) 9 Recommended Temperature Profile for Reflow Soldering Page:5/8

6 Page 5/7 10 Special Measuring Equipment 10 Capacitance Capacitance is measured with an Agilent LCR meter. 11 Reliability Tests Test item Test Conditions&Reference Flexure Strength 2 mm Bend; Per IEC Solderability 255, 5 seconds; Per MIL-STD-202 Method 208 Soldering Heat Resistance One dip at 260 for 60 seconds. Per MIL-STD-202 Method 210 Thermal Shock 100 cycles between -65 and +125 ; Per MIL-STD-202 Method 107 Mechanical Vibration 0.4 D.A. or 30 G between Hz; Per MIL-STD-202 Method 204 Mechanical Shock 1500 G, 0.5 ms, half-sine shocks Salt Spray 48 hour exposure; Per MIL-STD-202 Method 101 Moisture Resistance 10 cycles, Per Mil-STD-202 Method 106 Endurance 85 ± 2, /-0 hr, rated voltage Endurance 85+/-2, /-0 hr, rated voltage Leakage current less than 100nA Page:6/8

7 12 Packaging 12.1 Surface mount ESD suppressors are provided on tape-and-reel for use in pick-and-place machines or in bulk for special applications. Both tape-and-reel and bulk products are sealed in plastic bags with desiccant. The reel size is 7 inches Tape Dimensions: Inch (mm) Size A 0 B 0 K 0 Type 0603 (1608) ± ± ± (1.00 ± 0.10) (1.80 ± 0.10) (0.60 ± 0.08) Paper E 1 F W P 1 P 0 P 2 D 0 D ± ± ± ± ± ± N/A (1.75 ± 0.10) (3.50 ± 0.05) (8.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (2.00 ± 0.05) ( ) Page:7/8

8 12.3 Quantity Per Reel Chip Size Parts on 7 inch (178 mm) Reel 0603 (1608) 4,000 Other sizes and chip quantities can be provided upon customer's request. 13 Storage 13.1 The maximum ambient temperature shall not exceed 35. Storage temperature higher than 35 could result in the deformation of packaging materials The maximum relative humidity recommended for storage is 75 %. High humidity with high temperature could accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components.the insulation resistance of the ESD suppressors could be reduced if the products are stored in a high humidity environment Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present. Page:8/8