Figure 2: SN100C. Figure 4: Fluidity compared
|
|
- Cuthbert Curtis
- 6 years ago
- Views:
Transcription
1 Negative Effects of Phosphorus in Nickel Doped Solders. Paolo Corviseri, Balver Zinn, Germany Introduction The large-scale changeover to lead-free solder has significantly increased the importance of micro-alloying elements. On the basis of its pioneering role with nickel doped solder SN100C, Balver Zinn has developed a wealth of experience based on many studies and large-scale technical tests. The Effect of Nickel and the Resulting Advantages: The fundamental importance of nickel was first identified by Tetsuro Nishimura at Nihon Superior. He discovered that a nickel content of 0.05 weight-% produced the best results regarding, for example, flow, reduction in copper dissolution and stabilisation of the intermetallic compound. +Ni Figures 1 and 2: Shiny and smooth appearance of SN100C alloy is similar to that of SnPb. Other benefits include process stability and reliability Figure 1: Figure 2: SN100C Benefit with the original SN100C formulation such as process stability, long-term reliability and reduced copper dissolution is due to nickel doping. This also confers improved fluidity and breakage behaviour (Figures 3-5). Figures 3-5: Fluidity of SN100C is similar to that of SnPb. Breakage behaviour is better than with other lead free alloys. Figure 3: Fluidity dependent on Ni content Figure 4: Fluidity compared Figure 5: Breakage behaviour Because nickel acts as a nucleation site, the structure of nickel doped solder becomes very fine-grained. This enables better accommodation of mechanical strain. Figure 10: SnAg3.0Cu0.5 Figure 6: primary tin dendrites with eutectic Figure 7: Ni uniform eutectic microstructure Figure 8: primary tin dendrites with eutectic Figure 9: Ni uniform eutectic microstructure Figure 11: SnAg3.0Cu0.5+Ni
2 The same nucleation mechanism also minimizes inter metallic compound (IMC) growth resulting in a reduction of interfacial stress. OSP substrate Figure 12: IMC after soldering Figure 13: Cu6Sn5 in IMC After 2 x reflow and 500 hours at 125 C Figures 14: IMC after reflow and ageing +NiGe +NiGe Figure 15: IMC after soldering Figure 16: (Cu,Ni)6Sn5 in IMC with ~3% Ni Figure 17: IMC after reflow and ageing In addition to modifying the structure of the IMC, nickel can be found in the Cu 6Sn 5 phase (Cu,Ni) 6Sn 5. This serves as a barrier and slows down further IMC development during ageing and especially in the event of thermal load. IMC Growth on OSP Finish Intermetallic Thickness (microns) SnPb SnAgCu SnCu SnCuNi Initial IMC Thickness Solder Alloy IMC Thickness After Thermal Cycling Figure 18: IMC development after ageing. (4000 cycles C) Figure 19: Establishment of the number and length of cracks after 2 x reflow and 500 hours at 125 C! Nickel doped solder exhibits the smallest cracks in this situation. Figure 20: Number of cracks and length of cracks A similar process also influences the dissolution behaviour of lead-free soldering systems. This simplifies solder bath management. THT Figure 21: indicates less copper dissolution with SN100C, due to the nickel content. SnAg3.8Cu0.7 SnAg3.0Cu0.5 SN100C SMD SnAg3.8Cu0.7 Figure 21: Copper Dissolution SnAg3.0Cu0.5 SN100C
3 Inter Metallic Compound (IMC) There is a good reason why SN100C is one of the most successful, best known and most copied lead-free solders! Balver Zinn has turned the brilliant idea into a unique solder by, for example, only using raw materials of the highest quality. This affects solder properties and a direct impact on both production and end use, for example negating the need for complex cleaning procedures during manufacture. Phosphorus as a Possible Antioxidant All the advantages referred to above are the results of years of research and studies by the inventor, Tetsuro Nishimura of Nihon Superior. He then focussed on anti-oxidizing additives for SN100C. In light of its success with SnPb alloys, phosphorus was the first element selected. However, this exerted a deleterious effect as it counteracted the positive effect of nickel. Below are a number of research results, which indicate why phosphorus was rejected as an antioxidant. Shiny solder Joints due to nickel: Phosphorous counteracts this!! Figure 22: shows that the formerly smooth and shiny solder joints made from SN100C again exhibit a dull appearance due to the addition of phosphorous. Figure 22: Optical appearance of solders made from the SnCu - alloys Figure 23 shows how SN100C smooth solder joints tend to exhibit nucleation holes with Phosphorus! Figure 23: Optical appearance of lead-free solders Improved fluidity due to nickel: Phosphorous counteracts this!! Figure 25 shows the drastic reduction in fluidity due to the addition of phosphorous. The Ragone Test can be used to establish the fluidity column length of molten solder. SN100C has a length of approx. 650 mm in the same test conditions. Figure 24: Improved fluidity behaviour due to nickel Figure 25: Fluidity depending on phosphorus content
4 Figure 26 exhibits worsening breakage behaviour due to the addition of phosphorus and increased risk of bridging! Figure 26: Breakage behaviour Finer structure due to nickel: Phosphorus counteracts this!! SN100C P P P SnCuNi SnCuNi+0.007P SnCuNi+0.02P SnCuNi+0.06P Reversal of the nickel- effect Figure 27: Reversal of the beneficial effect of nickel due to phosphorus Reduced de-alloying behaviour due to nickel: Phosphorus counteracts this!! Figure 28: Even copper dissolution behaviour changes negatively due to the addition of phosphorus! Figure 28: Copper Dissolution Intermediate Compound 2 Many of the positive properties realised by the nickel are changed in a negative sense by the addition of phosphorus. This renders the SN100C solder bath unsuitable for long time usage. The Nihon Superior patent entitled Regulation of the Nickel Content in Lead-Free Solder Baths was based on this research because it was established that, in certain conditions, phosphorus binds nickel and removes it from the solder bath!
5 Germanium as a Reliable Solution for Oxidation Minimisation During the introduction of SN100C, germanium was not mentioned as a fourth alloy component and as an anti-oxidising solder additive. At a level of 55 ppm it is still part of the basic analysis. Stable and very high raw material prices and the constant pressure on prices experienced by customers inspired Balver Zinn to initiate a further study into process optimisation and cost savings. As a result the solder variant SN100CS with 100 ppm of germanium was examined. The germanium content was further optimised, this time to 250 ppm. As with phosphorus in SnPb alloy, germanium was also consumed (albeit much more slowly than phosphorus / SnPb), necessitating periodic measurement and adjustment. Empirical values show that contents of 130 ppm and more reduce the tendency to oxidize and that the content levels off at around 60% of the initial content. Therefore, 250 ppm basic germanium represents a good compromise. SN100CS SN100C Figures 29-31: Machine configuration: Setup three-row turbulent wave: 65% Setup laminar wave: 70% Solder bath temperature: 290 C Both waves in continuous operation: 8 hours Test atmosphere: Air Figure 29: Residual germanium after time Figure 30: Germanium consumption Figure 31: Dross reduction approx. 20% The germanium consumption established during the test and the dross formation may differ depending on the machine configuration, the material throughput and operation conditions. Figures 32-33: Germanium concentrates at the surface within the IMC Figure 32: No germanium in the IMC Figure 33: Germanium concentrates at the surface Summary The addition of nickel as a micro alloying element causes positive effects with regards to the technological properties of alloys. Phosphorus contamination of just mass % (20 ppm) negates these alloying advantages. Since phosphorus is toxic to lead-free, nickel micro-alloyed Ni0.05 alloys, the use of phosphorus tablets as an anti-oxidant is not recommended. For nickel micro-alloyed Ni0.05alloys, germanium is the only, currently known, stable and effective method to minimize dross formation. It also exerts a positive influence on the fluidity of the alloy. Germanium even continues to work after the solder has solidified and prevents the tarnishing of solder joints at high temperatures (e.g. yellowing of HAL surfaces on printed circuit boards). References: 1. Effects of Phosphorus on Microstructure and Fluidity of Ni0.05 Lead-Free Solder. K. Nogita, C.M. Gourlay, J. Read, T. Nishimura, S. Suenaga and A.K. Dahle. 2. Nihon Superior Presentation on SN100C, 5 th November 2009, Keith Sweatman Senior Technical Advisor. 3. EP A1 Patent, Method of regulating nickel concentration in lead-free solder containing nickel, T. Nishimura.
Balver Zinn Josef Jost GmbH & Co. KG SN100C : Micro alloyed lead free solder The Nickel effects
Paolo Corviseri / Balver Zinn Techn. Department Certified IPC-A-610 Trainer (CIT) Paolo.corviseri@balverzinn.com Phone: +49 2375 1 915150 Mobil: +49 170 6379549 Balver Zinn Josef Jost GmbH & Co. KG SN100C
More informationTHE EFFECTS OF PHOSPHORUS IN LEAD-FREE SOLDERS
As originally published in the SMTA Proceedings. THE EFFECTS OF PHOSPHORUS IN LEAD-FREE SOLDERS Keith Sweatman, Takatoshi Nishimura and Takuro Fukami Nihon Superior Co., Ltd Osaka, Japan k.sweatman@nihonsuperior.co.jp
More informationSN100C Technical Guide
SN100C Technical Guide INTRODUCTION SN100C is a lead-free tin/copper//germanium alloy. It has been in use since about the year 2000. Since then SN100C has become a world leading alloy in wave and selective
More informationSnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control Peter Biocca Senior Engineer, Technical Manager Kester ITW, Itasca, Illinois, U.S.A. Material Concepts for Alternative Alloys
More informationWelcome to the Real World of Lead Free Soldering
Welcome to the Real World of Lead Free Soldering Metallic Resources, Inc. Howard Stevens Nimal Liyanage,, Ph.D Objective: to Provide Education Regarding the Effects of Various Lead Free Soldering Alloys
More informationLEAD FREE ALLOY DEVELOPMENT
LEAD FREE ALLOY DEVELOPMENT Karl F. Seelig, VP of Technology AIM Cranston, RI. USA. kseelig@aimsolder.com Abstract. When lead-free solders were first introduced to the electronics industry in the early
More informationReflow Profiling: Time a bove Liquidus
Reflow Profiling: Time a bove Liquidus AIM/David Suraski Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear
More informationLead-free soldering materials, some considerations. Presented at FHI conference, Gorinchem November 2005
Lead-free soldering materials, some considerations Presented at FHI conference, Gorinchem November 2005 Outline Present situation in Europe towards RoHS Industry status Lead-free soldering materials Getting
More informationLead Free Surface Mount Technology. Ian Wilding BSc Senior Applications Engineer Henkel Technologies
Lead Free Surface Mount Technology Ian Wilding BSc Senior Applications Engineer Henkel Technologies Overview of the Presentation First contact: Impact on the production operator Packaging Labelling Impact
More informationEFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS. Mulugeta Abtew
EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS Mulugeta Abtew Typical PCB Assembly Process PCB Loading Solder Paste Application Solder Paste Inspection
More informationThe Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid Sn-Cu Based Solders with Cu Substrate
WDS'08 Proceedings of Contributed Papers, Part III, 220 224, 2008. ISBN 978-80-7378-067-8 MATFYZPRESS The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid
More information2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers)
2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) Dr. Stephan Meschter BAE Systems LEAP WG Technical Guidelines Handbook Leader Johnson City, NY Phone: 607-770-2332, Email:
More informationStudy of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation.
Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation. B. Salam +, N. N. Ekere, D. Rajkumar Electronics Manufacturing Engineering
More informationThe hand soldering process can therefore be defined by the following steps ;
Hand Soldering with Lead Free Alloys Introduction As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing
More informationBecoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant
Automotive Electronics Becoming Lead Free Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant 1 Agenda 1. Leadfree Electronics Drivers 2. Requirements 3. Areas of Impact 4.
More informationEffects of SAC Alloy Copper Dissolution Rates on PTH Processes: Cost and performance justify use of certain alternatives to SAC305/405
Effects of SAC Alloy Copper Dissolution Rates on PTH Processes: Cost and performance justify use of certain alternatives to SAC305/405 1 Craig Hamilton, Polina Snugovsky (Celestica) & Matthew Kelly (IBM)
More informationComposition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi
More informationTHIN IMMERSION TIN USING ORGANIC METALS
THIN IMMERSION TIN USING ORGANIC METALS Jim Kenny, Nils Arendt, Bernhard Wessling, and Karl Wengenroth Enthone Inc., A Business of Cookson Electronics West Haven, CT, USA ABSTRACT With the international
More informationGrain Refinement for Improved Lead-Free Solder Joint Reliability
Grain Refinement for Improved Lead-Free Solder Joint Reliability K. Sweatman 1, S. D. McDonald 2, M. Whitewick 2, T. Nishimura 1, and K. Nogita 2 1. Nihon Superior Co., Ltd, Osaka, Japan 2. University
More informationHead-in-Pillow BGA Defects Karl Seelig AIM Cranston, Rhode Island, USA
Head-in-Pillow BGA Defects Karl Seelig AIM Cranston, Rhode Island, USA Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does
More informationHot nitrogen for wave soldering A new innovation for increasing quality & productivity of wave soldering machines
Hot nitrogen for wave soldering A new innovation for increasing quality & productivity of wave soldering machines Laurent Coudurier* Fernand Heine* Didier Orlhac** *Air Liquide technology center / Krefeld
More informationOMIKRON IMMERSION WHITE TIN. Florida CirTech, Inc. Greeley, Colorado USA. Revised 2/19/98
OMIKRON TM IMMERSION WHITE TIN Revised 2/19/98 Florida CirTech, Inc. C T Florida CirTech, Inc. 1309 North 17th Avenue Greeley, CO 80631 Telephone: 1-800-686-6504 Fax: (970) 346-8331 Table of Contents Pages
More informationRoHS Compliance Document
D2-Pak RoHS Compliance Document Contents: 1. 2. Solder Reflow 3. Tin Whisker Report D2-pak (3 or 5 Lead) BOM 1 90598-46-2 0.05808 11% 3.8% Lead Frame Copper 0.94840 Die Attach Soft Solder 0.01200 Cu 7440-50-8
More informationA STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS
A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS G.Milad, D.Gudeczauskas, G.Obrien, A.Gruenwald Uyemura International Corporation Southington, CT ABSTRACT: The solder joint formed on an ENEPIG surface
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
As originally published in the IPC APEX EXPO Conference Proceedings. Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy
More informationLead-Free Solder Bump Technologies for Flip-Chip Packaging Applications
Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim 1 and Jim Martin 2 1 Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong
More informationLead-Free Connectors - An Overview
Lead-Free Connectors - An Overview Pete Elmgren Molex Inc. 15 August 2003 Introduction For more than 50 years, lead-bearing solders have been used almost exclusively throughout the electronics industry
More informationDEVELOPMENT OF LEAD-FREE ALLOYS WITH ULTRA-HIGH THERMO- MECHANICAL RELIABILITY
As originally published in the SMTA Proceedings. DEVELOPMENT OF LEAD-FREE ALLOYS WITH ULTRA-HIGH THERMO- MECHANICAL RELIABILITY Pritha Choudhury, Ph.D., Morgana Ribas, Ph.D., Ranjit Pandher, Ph.D., Anil
More informationEffects of Lead on Tin Whisker Elimination
Effects of Lead on Tin Whisker Elimination Wan Zhang and Felix Schwager Rohm and Haas Electronic Materials Lucerne, Switzerland inemi Tin Whisker Workshop at ECTC 0 May 30, 2006, in San Diego, CA Efforts
More informationAPPLICATIONS OF Fe-C PHASE DIAGRAM
APPLICATIONS OF Fe-C PHASE DIAGRAM KEY POINTS OF Fe-C Diagram Phases: Liquid Fe-Tmin=1148C @ 4.3%C 1394 C
More informationA STUDY OF CASTING CHARACTERISTICS FOR DIE-CAST ALUMINUM ALLOY
ME8109: Casting And Solidification of Material A STUDY OF CASTING CHARACTERISTICS FOR DIE-CAST ALUMINUM ALLOY Department of Mechanical & Industrial Engineering Graduate Program in Mechanical Engineering
More informationOptimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted
More informationUnique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY
Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Frank Toth, and Gary F. Shade; Intel Corporation, Hillsboro, OR, USA {francis.toth.jr@intel.com, (503)-696-1546}
More informationCominco's Direct Alloying Process for Ni-Zn Galvanizing
Background Custom galvanizers must adapt their processes to provide quality zinc coatings on a variety of products, while at the same time achieving competitive processing costs. Usually, the galvanizer
More informationRe tinning Components for Hi Rel Assembly
Hi rel Soldering Re tinning Components for Hi Rel Assembly Alan Cable, President, ACE Production Technologies Lead tinning has experienced a surge in popularity recently for a number of reasons, even though
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy O Neill, Technical Marketing Manager AIM Solder Cranston, RI Abstract
More informationA Supplier s Perspective on the Development of Lead-free Soldering Materials
A Supplier s Perspective on the Development of Lead-free Soldering Materials Keith Howell Nihon Superior Silicon Valley Chapter 13 November 2012 Agenda Solder Paste Flux Development Voiding Head-in-pillow
More informationSolidification and Crystallisation 5. Formation of and control of granular structure
MME 345 Lecture 08 Solidification and Crystallisation 5. Formation of and control of granular structure Ref: [1] A. Ohno, The Solidification of Metals, Chijin Shokan Co. Ltd., 1976 [2] P. Beeley, Foundry
More informationIPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA
IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions
More informationA COMPARISON OF TIN-SILVER-COPPER LEAD-FREE SOLDER ALLOYS Karl Seelig and David Suraski AIM, Incorporated
A COMPARISON OF TIN-SILVER-COPPER LEAD-FREE SOLDER ALLOYS Karl Seelig and David Suraski AIM, Incorporated info@aimsolder.com ABSTRACT As the electronics industry begins to focus upon the tin-silver-copper
More informationLS720V Series. Comparison of crack progression between Sn-Cu-Ni-Ge and M773. Development of Ag-free/M773 alloy
LS72V Series Low-Ag/Ag-free solder pastes with lower void Reduces voids by improving fluidity of flux during solder melting Reduces voids even in bottom surface electrode type components by improving solder
More informationSoldering Immersion Tin
Soldering Immersion Tin Rick Nichols and Sandra Heinemann Atotech Deutschland GmbH Berlin, Germany Abstract The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-sn)
More informationEVALUATION OF NEW SILVER-FREE BRAZING FILLER METALS PART 2: BRAZING OF COPPER AND BRASS
EVALUATION OF NEW SILVER-FREE BRAZING FILLER METALS PART 2: BRAZING OF COPPER AND BRASS The results of wetting and shear strength testing, and metallurgical characterization, of Cu-4Sn- 6P and Cu-40Zn-1Sn-0.3Si
More informationNational Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW
NPL REPORT MAT 1 Susceptibility of Lead-Free Systems to Electrochemical Migration Ling Zou and Chris Hunt NOT RESTRICTED May 200 National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom
More informationinemi PB-FREE ALLOY CHARACTERIZATION PROJECT REPORT: PART III - THERMAL FATIGUE RESULTS FOR LOW-AG ALLOYS
inemi PB-FREE ALLOY CHARACTERIZATION PROJECT REPORT: PART III - THERMAL FATIGUE RESULTS FOR LOW-AG ALLOYS Keith Sweatman 1, Keith Howell 1, Richard Coyle 2, Richard Parker 3, Gregory Henshall 4, Joseph
More informationAMETAL AMETAL AMETAL APPLICATIONS GENERAL
AMETAL - TA S DEZINCIFICATION RESISTANT COPPER ALLOY AMETAL is a patented special copper alloy, combining excellent corrosion resistance with high mechanical strength. 1 AMETAL TA s dezincification-resistant
More informationAnalysis of Cast Iron Using Shimadzu PDA-7000
Analysis of Cast Iron Using Shimadzu PDA-7000 C112-0510M The analysis of low and high alloy cast iron by optical emission spectrometry is presented. Cast iron alloys are classified by their mechanical
More informationInterfacial Reactions between the Sn-9Zn Solder and Au/Ni/SUS304 Multi-layer Substrate
, July 6-8, 2011, London, U.K. Interfacial Reactions between the Sn-9Zn Solder and Au/Ni/SUS304 Multi-layer Substrate *Yee-Wen Yen 1, Chien-Chung Jao 2, Kuo-Sing Chao 1, Shu-Mei Fu Abstract Sn-9Zn lead-free
More informationWF6317. A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering
WF637 A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability Easy
More informationSMT Quick-Tips: selecting a wave. Robert Voigt, DDM Novastar
SMT Quick-Tips: selecting a wave soldering system Robert Voigt, DDM Novastar Selecting A Wave Soldering System The various types of through-hole (or thru-hole) soldering techniques are: 1. Manual 4. Wave
More informationROHS Reliability Impact
ROHS Reliability Impact A Reality Check!!!! Presented by Larry Akre May 17, 2007 LAkre 2007 1 ROHS Reliability Impact RoHS Directive 2002/95/EC WEEE Directive 2002/96/EC Failure Mechanisms Tin Whiskers
More informationThe Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish Julie Silk 1, Jianbiao Pan 2, Mike Powers 1 1 Agilent Technologies, 1400 Fountaingrove Parkway, Santa Rosa,
More informationInfluence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization
68 J. Mater. Sci. Technol., Vol.23 No.1, 2007 Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization Hongtao CHEN 1,2),
More informationGreen Product. 2 nd level reliability of tin plated components. Dr. Marc Dittes CAT AIT PGP
Green Product 2 nd level reliability of tin plated components Infineon Outline Experimental parameters Testboard, paste, components, T-cycling, Shear test Reflow profile SnPbAg Reflow profile SnAgCu Reliability
More informationPulse White Paper Regarding RoHS Compliance
Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...
More informationMATERIALS TECHNOLOGY LABORATORY DESIGN PARAMETERS FOR LEAD-FREE COPPER-BASE ENGINEERING ALLOYS IN PERMANENT MOLDS
MATERIALS TECHNOLOGY LABORATORY DESIGN PARAMETERS FOR LEAD-FREE COPPER-BASE ENGINEERING ALLOYS IN PERMANENT MOLDS F.A. Fasoyinu, D. Cousineau, R. Bouchard, M. Elboujdaini and M. Sahoo EXECUTIVE SUMMARY
More informationLead Free Assembly: A Practical Tool For Laminate Materials Selection
Lead Free Assembly: A Practical Tool For Laminate Materials Selection Erik J. Bergum David Humby Isola Abstract: The impending European RoHS legislation, restricting the use of lead containing solders,
More informationMicroelectronics Reliability
Microelectronics Reliability 49 (2009) 269 287 Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/microrel Interfacial fracture toughness of
More informationComponent Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version
Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2.
More informationTin Whisker Mitigation User Perspective. Joe Smetana (and inemi Tin Whisker User Group) inemi Tin Whisker Workshop, ECTC 2007
Tin Whisker Mitigation User Perspective Joe Smetana (and inemi Tin Whisker User Group) inemi Tin Whisker Workshop, ECTC 2007 Overview Pure Tin (and High Tin Content Alloy Pb-Free) Finishes are a reliability
More informationNew Pb-Free Solder Alloy for Demanding Applications. Presented by Karl Seelig, VP Technology, AIM
New Pb-Free Solder Alloy for Demanding Applications Presented by Karl Seelig, VP Technology, AIM Why REL? The evolution and expansion of electronics into more harsh operating environments performing more
More informationIEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY PART B, VOL. 20, NO. 1, FEBRUARY
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY PART B, VOL. 20, NO. 1, FEBRUARY 1997 87 Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints
More informationThis paper was presented at the CARTS-Europe `97 symposium in Prague.
This paper was presented at the CARTS-Europe `97 symposium in Prague. ELECTROPLATING VERSUS HOT - DIPPED TINNING A COMPARISON OF APPLICATION - EXPERIENCES Gerhard Bürstner (Dipl.-Ing. Dipl. Wirtsch. Ing.
More informationMetal Casting. Manufacturing Processes for Engineering Materials, 5th ed. Kalpakjian Schmid 2008, Pearson Education ISBN No.
Metal Casting Important factors in casting Solidification of the metal from its molten state and accompanying shrinkage Flow of the molten metal into the mold cavity Heat transfer during solidification
More informationLead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware
Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware November 19, 2009 M.Kelly, P.Eng, MBA Senior Engineer, ECAT Interconnect Technology Lead-Free Server Development Core Team
More informationINTERFLUX ELECTRONICS NV
Reflow soldering temperature profiling Min : 30sec Max : 120sec Max : +4 C/sec Max : 250 C Min : 230 C Min: +0,5 C/sec Min : +1 C/sec Max : +3 C/sec Max : +1 C/sec Max : -6 C/sec Min : -2 C/sec Min : +1
More informationHOT-DIP TINNED COPPER AND COPPER ALLOY STRIP
HOT-DIP TINNED COPPER AND COPPER ALLOY STRIP HOT-DIP TINNED STRIP WHY HOT DIP TINNING? Characteristic for hot-dip tinned coatings is the formation of an intermetallic phase (IMP) between the base material
More informationThe role of minor modifying additives on soldering properties of Sn-Ag-Cu green solders
Southern Cross University epublications@scu 23rd Australasian Conference on the Mechanics of Structures and Materials 2014 The role of minor modifying additives on soldering properties of Sn-Ag-Cu green
More informationThermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications
Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications M. Gonzalez 1, B. Vandevelde 1, Jan Vanfleteren 2 and D. Manessis 3 1 IMEC, Kapeldreef 75, 3001, Leuven,
More informationcontaminated, or if the location of the assembly house is well above sea level.
VAPOR PHASE REFLOW S EFFECT ON SOLDER PASTE RESIDUE SURFACE INSULATION RESISTANCE Karen Tellefsen. Mitch Holtzer, Corne Hoppenbrouwers Alpha Assembly Solutions South Plainfield, NJ, USA Roald Gontrum SmartTech
More informationDEVELOPMENT OF Ni BASE SUPERALLOY FOR INDUSTRIAL GAS TURBINE
Superalloys 2004 Edited by K.A. Green, T.M. Pollock, H. Harada, T.E. Howson, R.C. Reed, J.J. Schirra, and S, Walston TMS (The Minerals, Metals & Materials Society), 2004 DEVELOPMENT OF Ni BASE SUPERALLOY
More informationEvaluation of Cu Pillar Chemistries
Presented at 2016 IMAPS Device Packaging Evaluation of Cu Pillar Chemistries imaps Device Packaging Conference Spring 2016 Matthew Thorseth, Mark Scalisi, Inho Lee, Sang-Min Park, Yil-Hak Lee, Jonathan
More informationA deflashing media with high dimensional stability, which is also tough at low temperatures, is impact and abrasion resistant
A deflashing media with high dimensional stability, which is also tough at low temperatures, is impact and abrasion resistant Your Benefits at a Glance Emsodur, with its excellent properties such as high
More informationLow Temperature Lead-Free Production Versus SAC
Low Temperature Lead-Free Production Versus SAC Designing a product that has minimal environmental impact for its entire life cycle is very demanding and a real challenge for designers and manufacturers.
More informationJeong et al.: Effect of the Formation of the Intermetallic Compounds (1/7)
Jeong et al.: Effect of the Formation of the Intermetallic Compounds (1/7) Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical
More informationImpacts of the bulk Phosphorous content of electroless Nickel layers to Solder Joint Integrity
Impacts of the bulk Phosphorous content of electroless Nickel layers to Solder Joint Integrity Sven Lamprecht, Kuldip Johal, Dr. H.-J. Schreier, Hugh Roberts Atotech Deutschland GmbH Atotech USA, Berlin
More informationLead Free No Clean Solder Paste 4900P Technical Data Sheet 4900P
Description MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents
More informationGalfan - Low Cost, High Performance Metallic Coating
Galfan - Low Cost, High Performance Metallic Coating David Harrison, Bronx International, Australia. Introduction Bronx International provides Coil Coating Line solutions to steel and aluminium companies,
More informationWhisker free tin Jan Feb 2012-stripped:Metal Tech Speaking Template USE THIS.qxd 2/24/ :07 AM Page 1
Whisker free tin Jan Feb 2012-stripped:Metal Tech Speaking Template USE THIS.qxd 2/24/2012 11:07 AM Page 1 BY GEORGE MILAD, NATIONAL ACCOUNTS MANAGER FOR TECHNOLOGY, UYEMURA USA, SOUTHINGTON, CONN. The
More informationThis article appeared in a journal published by Elsevier. The attached copy is furnished to the author for internal non-commercial research and
This article appeared in a journal published by Elsevier. The attached copy is furnished to the author for internal non-commercial research and education use, including for instruction at the authors institution
More informationAcceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel 1, Aileen Allen 2, Elizabeth Elias Benedetto 3, Rahul Joshi 3 Hewlett-Packard Company 1 Boise, ID, USA 2 Palo Alto, CA, USA 3 Houston, TX,
More informationAtmosphere Effect on Soldering of Flip Chip Assemblies. C. C. Dong Air Products and Chemicals, Inc. U.S.A.
Atmosphere Effect on Soldering of Flip Chip Assemblies C. C. Dong Air Products and Chemicals, Inc. U.S.A. Atmosphere Effect on Soldering of Flip Chip Assemblies Abstract An experimental study was conducted
More informationPCB Technologies for LED Applications Application note
PCB Technologies for LED Applications Application note Abstract This application note provides a general survey of the various available Printed Circuit Board (PCB) technologies for use in LED applications.
More informationFaculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Johor, Malaysia
', Advanced Materials Research Vol. 845 (2014) pp 76-80 Online available since 2013/Dec/04 at www.scient$c net O (2014) Trans Tech Publications, Switzerland doi: l0.4028/www.scient~~$c. net/amr. 845.76
More informationEliminating Wave Soldering with Low Melting Point Solder Paste ABSTRACT Process Cost Reduction INTRODUCTION
Eliminating Wave Soldering with Low Melting Point Solder Paste Mitch Holtzer and Tuck Weng Mok Alpha, an Alent plc Company 109 Corporate Blvd., South Plainfield, NJ 07080 USA Email: mholtzer@alent.com;
More informationAdvanced Analytical Techniques for Semiconductor Assembly Materials and Processes. Jason Chou and Sze Pei Lim Indium Corporation
Advanced Analytical Techniques for Semiconductor Assembly Materials and Processes Jason Chou and Sze Pei Lim Indium Corporation Agenda Company introduction Semiconductor assembly roadmap challenges Fine
More informationGreen Environmentally Friendly Technology For Tantalum And Niobium Oxide Capacitors
CARTS Europe 2004: 18 th Annual Passive Components Conference, October 18-21, 2004 Green Environmentally Friendly Technology For Tantalum And Niobium Oxide Capacitors F.Priban, T.Zednicek, S.Zednicek,
More informationUTILIZATION OF ATMOSPHERIC PLASMA SURFACE PREPARATION TO IMPROVE COPPER PLATING PROCESSES.
SESSION 14 MATERIALS AND PROCESSES FOR ADVANCED PACKAGING UTILIZATION OF ATMOSPHERIC PLASMA SURFACE PREPARATION TO IMPROVE COPPER PLATING PROCESSES. Eric Schulte 1, Gilbert Lecarpentier 2 SETNA Corporation
More informationInvestigation of the oxidation process at the coppersolder interface with atomic force microscopy
Investigation of the oxidation process at the coppersolder interface with atomic force microscopy Attila Bonyár, Tamás Hurtony Department of Electronics Technology Budapest University of Technology and
More informationEffect of Magnesium Addition on Microstructure and Mechanical Properties of Lead-Free Zinc-Silver Solder Alloys
Effect of Magnesium Addition on Microstructure and Mechanical Properties of Lead-Free Zinc-Silver Solder Alloys Md. Anisul Islam * and Ahmed Sharif Department of Materials and Metallurgical Engineering,
More informationImages of Failures in Microelectronics Packaging and Assembly
Images of Failures in Microelectronics Packaging and Assembly Ed Hare, Ph.D./SEM Lab, Inc. IMAPS NW - Feb. 11th 2004 Redmond, WA http://www.semlab.com 1 What is this? http://www.semlab.com 2 Inner Layer
More informationBasic PCB Level Assembly Process Methodology for 3D Package-on-Package
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package Vern Solberg STC-Madison Madison, Wisconsin USA Abstract The motivation for developing higher density IC packaging continues to be
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationInfluence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
Materials Transactions, Vol. 46, No. 12 (2005) pp. 2725 to 2729 Special Issue on Growth of Ecomaterials as a Key to Eco-Society II #2005 The Japan Institute of Metals Influence of an Immersion Gold Plating
More informationTin Whiskers Remain A Concern
Tin Whiskers Remain A Concern Michael Osterman, Research Scientist, Center for Advanced Life Cycle Engineering, University of Maryland The elimination of lead in electronic equipment due to governmental
More informationComplete Solder Solutions
Complete Solder Solutions A NORDSON COMPANY 1 Our Vision EFD Solder Paste Group is the service leader in the solder dispensing market, delivering integrated process solutions through best-in-class performance
More informationbut T m (Sn0.62Pb0.38) = 183 C, so this is a common soldering alloy.
T m (Sn) = 232 C, T m (Pb) = 327 C but T m (Sn0.62Pb0.38) = 183 C, so this is a common soldering alloy. T m (Au) = 1064 C, T m (Si) = 2550 C but T m (Au0.97Si0.03) = 363 C, so thin layer of gold is used
More informationThe Failure Mechanism of Recrystallization Assisted Cracking of Solder Interconnections
The Failure Mechanism of Recrystallization Assisted Cracking of Solder Interconnections 8 Toni T. Mattila and Jorma K. Kivilahti Aalto University Finland 1. Introduction The typical user environment load
More informationMaterial Specification
Semi-finished products Material Specification for strips of SPECIAL ALLOYS and COPPER Quality is our standard since 1864 Rolled products Special alloys - mechanical properties Alloy Temper Tensile strength
More informationLEAD-FREE SOLDERING IMPLEMENTATION IN THE SEMI-AUTOMATIC IMMERSION TINNING PROCESS FOR THE TO-92 PACKAGE INTEGRATED CIRCUITS.
Seventeenth Annual Conference of POMS. April 28 - May 1, 2006, Boston, MA. OM in the New World Uncertainties" Abstract code: 004-0423 LEAD-FREE SOLDERING IMPLEMENTATION IN THE SEMI-AUTOMATIC IMMERSION
More information