HIGH QUALITY THERMALLY CONDUCTIVE MATERIALS

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1 14.february.2011 HIGH QUALITY THERMALLY CONDUCTIVE MATERIALS Table of contents Non-silicone compounds (Tim4xx series)... section 1 Silicone compounds (Tim5xx series)... section 1 Dielectric silicone grease (Tim9xx series)... section 1 High-Temperature Compounds (HTC, Tim6xx series).. section 2 Electrically conductive compounds (Tim7xx series)... section 3 Electrical Joint Compounds (EJC, Tim EJC series)... section 4 ly conductive resins (Tim8xx series)... section 5 Electrically conductive resins (Tim8xx series)... section 5 Liquid Gap Fillers (LGF, Tim200x series)... section 6 ly conductive putties... section 7

2 SECTION 1: NON-SILICONE COMPOUNDS Timtronics Non-Silicone Compounds (Blue Ice Series) are formulated with synthetic fluids and highly conductive ceramic fillers. These finely engineered greases provide low bleed and solve the problems of contamination and migration associated with silicone-based products. Compared to traditional Silicone compounds, Timtronics Non-Silicone Compounds offer a better stability for a longer life cycle, also with a very high thermal-conductivity (up to 3.7 [W/(m K)] ). Product Tim410 Tim411 Tim412 Tim4100 Tim414 Tim425 Viscosity - Thixotropic Paste Specific Gravity (@25 C), [g/cm 3 ] Color - Blue Blue/White Blue Grey Black Blue/White (@200 C, 24hrs), Evaporation [%/Wt] Conductivity Resistance Dielectric (ASTM D5470), [W/(m K)] [(K in 2 )/W] (ASTM D149), (@0.05 gap), [V/mil] Dielectric Constant (ASTM D150), (@25 C,1KHz) Volume Resistivity (ASTM D257), [Ω cm] Operating Temp. Range [ C]

3 SILICONE COMPOUNDS White Ice Series are Silicone based thermally-conductive greases specifically formulated with binding agents and highly conductive ceramic-fillers that stop bleeding and separation, and deliver a very high thermal vonductivity (up to 3.7 [W/(m K)] ). So, that a lower thermal resistance can be achieved than using films, pads, or thermoplastics. The excellent wetting and spread-ability properties of the Timtronics silicone compounds make them the best choice for thin bond film applications. Product Tim510 Tim510FG Tim512 Tim5100 Tim 514 Tim515 Viscosity - Thixotropic Paste Specific Gravity (@25 C), [g/cm 3 ] Color - White White Grey Grey Black White (@200 C, 24hrs), Evaporation [%/Wt] Conductivity Resistance Dielectric Dielectric Constant (ASTM D5470), [W/(m K)] [(K in 2 )/W] (ASTM D149), (@0.05 gap), [V/mil] (ASTM D150), (@25 C,1KHz) Volume Resistivity (ASTM D257), [Ω cm] Operating Temp. Range [ C]

4 Dielectric (Silicone) Compounds are extremely stable greases that are useful over a wide temperature range and in a variety of adverse operating conditions. They are highly resistant to oxidation and totally impervious to water. Because of their operating and compatibility properties, Dielectric (Silicone) Compounds can be highly effective in a variety of applications, such as automotive and aircraft ignitions, valve seats, "O" rings, lip seals, transformer connections, speed and brake cables, etc. They are suitable for being used with metal, rubber, plastic and vinyl materials and are a desirable moisture barrier. TIM-910 is non-melting, odorless and tasteless. It is resistant to hot and cold water, steam and most disinfectant solutions. TIM-910 has been laboratory tested to comply with appropriate electrical ratings as listed below. DIELECTRIC (SILICONE) COMPOUNDS Product Tim 910 Binder - Silicone Viscosity - Thixotropic Paste Penetration Worked Specific Gravity [g/cm 3 ] Color - Translucent Evaporation (@200 C, 24hrs), [% MAX /Wt] 2 Bleed (24hrs) 1 Drop Point - None Conductivity [W/(m K)] 0.16 Water Resistance - High Dielectric Strength (@0.254mm gap), [KV/mm] 19.7 Arc Resistance [seconds] 120 Volume Resistivity Operating Temp. Range (@23 C), [Ω cm] [ C]

5 SECTION 2: HIGH TEMPERATURE COMPOUNDS Red Ice Series High Temperature Compounds (HTC) are specifically formulated for applications with continuous operating temperatures over 200 C. This series of thermal compounds has shown outstanding heat transfer and stability to high temperature electronics and industrial applications. They are available in Non-Silicone and Silicone formula. Product Tim 610 Tim 611 Tim 612 Tim 613 Tim 614 Binder - Non-silicone Non-silicone Non-silicone Silicone Silicone Max operating Temperature [ C] Viscosity - Thixotropic Paste Specific Gravity (@25 C), [g/cm 3 ] Color - White White White White Gray Evaporation (@200 C, 24hrs), [%/Wt] Evaporation (@300 C, 24hrs), [%/Wt] Conductivity Resistance Dielectric Volume Resistivity (ASTM D5470), [W/(m K)] [(K in 2 )/W] (ASTM D150), [V/mil] (ASTM D257), [Ω cm]

6 SECTION 3: ELECTRICALLY (AND THERMALLY) CONDUCTIVE COMPOUNDS Black Ice (Tim711 and Tim712) and Silver Ice (Tim710) Series are formulated with highly conductive fillers for ly and Electrically Conductive applications. Ideal for low power electronics application includes static drains, grounding, "soft" electronics connections, heat dissipation, and assembly protections. Product Tim 710 Tim 711 Tim 712 Binder - Non-silicone Non-silicone Silicone Viscosity - Thixotropic Paste Specific Gravity (@25 C), [g/cm 3 ] Color - Silver/Gray Black Black Evaporation Conductivity Resistance Volume Resistivity (@200 C, 24hrs), [%/Wt] (ASTM D5470), [W/(m K)] [(K in 2 )/W] (ASTM D257), [Ω cm] < 0.01 < 25 < 25 Operating Temp. Range [ C]

7 SECTION 4: ELECTRICAL JOINT COMPOUNDS (EJC) Electrical Joint Compounds (EJC) are specially formulated with latest technology to prevent oxide film formation on metal surfaces and prevents corrosion. They offer superior weathering characteristics over wide temperature ranges, and provide highly conductive tight joints. Proprietary filler particles help in penetrating oxide films and act as electrical bridges between conductor strands, help in gripping conductor, improve electrical conductivity and enhance integrity of the connection. Key Features: Prevent oxide films Improved service life for both Cu and Al connections. Provide gas-tight with high conductivity. Excellent lubricant, reduce galling & seizing Application instructions: Scratch the conductor surfaces with brush until bright and clean. Immediately apply EJC compound to the conductive surfaces. Remove all excess compounds after installation is complete. Product Ejc 741 Ejc 742 Ejc 743 Ejc 744 Ejc 745SL Ejc 745NS Binder Non-silicone Silicone Non-silicone Filler Gritted Non-Gritted Non-Gritted Application Recomandation - Bare Al/Al & Cu/Cu connections Insulated Al/Al & Cu/Cu connections All Copper connections Insulated Al/Al & Cu/Cu connections Rigid bus, bolted flat-pad Al/Al & Cu/Cu connections No-drip application for Al and Cu connectors Color - Gray Gray Copper Gray Gray Gray Penetration Drop Point - None None None None - - Conductivity (ASTM D5470), [W/(m K)] Operating Temp. Range [ C]

8 SECTION 5: THERMALLY CONDUCTIVE ADHESIVES ly conductive adhesives are designed for demanding needs for die-attach, heat sink bonding and surface mount applications. They rapidly transfer heat, eliminate hot spot, and increase the operating efficiency of most devices. Its low shrinkage minimizes risk of damage to fragile components. Typical applications include mechanical connection between heat sinks, semiconductor bonding, transistors to heat-sink bonding for wireless communications, satellite transmission and circuit board manufacturing. Product Tim-811 Tim-812 Tim-813 Tim-814 Tim-815 Tim-816 Hardener - PART-B PART-B N/A N/A EH-9 PART-B Mix Ratio by wt. (TIM/Hardener) - 100/ /100 ONE PART ONE PART 100/ /100 Viscosity (@25 C), [cps] Paste Paste Paste 35,000 Paste Paste Storage Temp. [ C] 25 C or below 25 C or below 25 C or below 25 C or below 25 C 25 C Pot Life (100 grams) 5 C 5 C (20 grams) (20 grams) ½ C <10 C ½ C 2 C Shelf Life - 1 C 1 C 4 C 4 C 2 C 2 C Recomm. Cure - 24 C 24 C 1 C + 1 C 1 C 2 C C Alternate Cure C 4-8 C 30 C 30 C 24 C 1 C Color - Silver Beige Black Red Black Black Specific Gravity Hardness Shore D Th. Conductivity [W/(m K)] Lap Shear Str. [psi] 1,400 1,400 2,620 3,400 2,400 2,800 Water Absorption C),[%] ND ND T glass [ C] CTE [10-6 / C] ND ND Operating Temp. Range [ C] -40 C C -40 C C -55 C C -55 C C -55 C C -55 C C (3 mm thickness), Diel. Strength N/A [Volts/mil] Diel. Constant (@ 1 Khz) N/A Dissipation Factor (@ 1 Khz) N/A Vol. Resistivity [Ω cm]

9 ELECTRICALLY (& THERMALLY) CONDUCTIVE ADHESIVES Electrically (& thermally) conductive adhesives are typically used for die-attach, chip bonding, cold-soldering, and other microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure for 1000 hours at 150 C. Product Tim-821 Tim-823 Tim-830M -1 Tim-838 Tim-881 Tim-884 Tim-897M 2 Feature - General purpose, RT or slightly elevated heat cure Low viscosity, RT or slightly elevated heat cure Flexible, RT cure or slightly at elevated heat cure Low viscosity, Long w ork life, RT storable Die easy to dispense attach adhesive Screen printable hybrid chip adhesive Easy to dispense, minimal tailing Die attach applications Number of components months 3 months Shelf Life - 1 C 1 C 1 C 1 C 1 C Viscosity (CP-51 spindle), [cps] rpm rpm Smooth Past rpm rpm rpm 5 min Cure Schedule - 1 C 1 C 1 C 1 C 1 C 1 C Specific Gravity rpm Lap Shear Strength T glass (AL-AL), [psi] 1,100 1,100 1,700 1,700 2,100 2,000 1,300 [ C] CTE (Below T glass ) [10-6 / C] Volume Resistivity [Ω cm] Storage Temp. [ C] < 25 < 25 < 25 9

10 SECTION 6: LIQUID GAP FILLERS Liquid Gap Fillers (LGF) are thermally-conductive liquid gap-filling materials formulated to provide a balance of cured material properties, high lighted by gel-like modules and good compression set. These thermally conductive materials are available either in electrically insulating or conductive version, one part or two part, room or elevated curing temperature. They are ideal for applying any thickness with little or no stress. Key Features: Stress absorbing flexibility (low modulus). Vibration dampening. Eliminate pad thickness/die-cut shapes. Excellent mechanical and chemical stability. Electrically insulating and/or conductive. Clean release from device/re-workable. No Bleed, no cure by-product, 100% solids. Relieves CTE stresses during thermal cycling. Applications: Filling various gaps between heat generating devices to heat sinks and housings. Automotive electronics, telecomunications, computers and peripherals. LED bonding/heat transfer. Product (Specs), [Units] Viscosity [cps] 150, , , ,000 Mix Ratio - One Part Heat Cure One Part RTV One Part RTV Two Part 1:1 Pot Life (@25 C) 24 hrs 8 min 15 min 1 hr Cure time (@25 C) N/A 72 hrs 24 hrs 2 hrs Cure time (@120 C) 30 min N/A N/A 5 min Shelf life (@25 C) 1 year 1 year 1 year 1 year Color - White Gray Gray Pink Density (@25 C), [g/cc] Hardness (@25 C), [shore 00/(A)] 70 40(A) 40(A) 70 Conductivity (@25 C), [W/(m K)] N/A 2 Dielectric Strength (@25 C), [V/mil] N/A 500 Volume Resistivity (@25 C), [Ω cm] Operating Temp. Range [ C]

11 SECTION 7: THERMALLY CONDUCTIVE PUTTIES ly conductive putties are extremely soft and highly conformable paste-type gap fillers. With such a soft consistency, these materials assure an efficient heat transfer between delicate parts where minimum pressure can be tolerated. ly conductive putties are ideal for applying any thickness with little or no stress. They are designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. ly conductive putties easily form and adhere to most surfaces, shapes and sizes of components with very low compression force. Key Features: No need for curing processes. Stress absorbing flexibility Vibration dampening. Electrically insulating. Form-in-place gap filling with form stability. Relieve CTE stresses during thermal cycling. Applications: Filling various gapes between heat generating devices to heat sinks and housings. Useful where systems need to be taken a part and reassembled during production or maintenance. To interface components with delicate leades. To fill gaps where surfaces are irregular or large. Product HTC 519 (Specs), [Units] Type - Non-silicone Silicone Consistency - Soft paste Soft paste Color - Gray White Density (@25 C ), [g/cc] Conductivity [W/(m K)] Operating Temp. Range [ C] Volume Resistivity (ASTM D257), [Ω cm] Dielectric Strength (ASTM D150), (@0,05 gap), [V/mil] Dielectric constant (ASTM D150), (@25 C,1KHz) TGA Weight Loss (150 C/24hrs), [%/Wt] Compressibility (@5 psi), [%] Flame Retardancy - V-O Equivalent 11

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