Lighting the way in LED Applications

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1 Lighting the way in LED Applications

2 The global market for packaged LED is expected to reach US$18.54 billion by 2021 Source: Yole Développement

3 The future of lighting Rapid growth of the LED market In recent years, the industry is witnessing rapid growth in Light-Emitting Diode (LED) products for many lighting applications. From retail spaces to residential homes, from automobiles to industrial warehouses and roadways for all lighting needs, there are intelligent LED solutions. Recognized as one of the most promising technologies in the lighting industry, LED offers a range of benefits in many environments due to its exceptional controllability, advanced dimming and scheduling capabilities, and unparalleled lifespan. Manufacturers in the LED lighting industry are constantly seeking innovative ways to engineer reliable LED products with enhanced performance to cater to the increasingly competitive market. At Heraeus Electronics, we recognize the need to help manufacturers stay ahead of the game. For more than 160 years, we have been a key global player in the everevolving technology landscape. Moving ahead, we endeavor to partner our customers in achieving their business objectives and bringing out the best of LED technology. 1

4 The major growth drivers for the LED lighting market are the increasing demand of LED TVs, growing automobile industry, increasing phasing out of incandescent bulbs in many countries, and supportive government policies that focus on energy efficiency. Source: Research & Markets

5 Heraeus Electronics The leading LED materials solutions provider We offer high-quality products for LED applications that includes bonding wires, assembly materials, thick film pastes and substrates. We combine our technical know-how to integrate materials perfectly into high-functioning systems. Our products are a result of extensive market knowledge, cutting-edge research, and manufacturing precision by our team of experts. In addition, our state-of-the-art application and innovation center in Hanau offers comprehensive engineering services for the development of LEDs and LED modules. The center s optimal test environment makes it possible for manufacturers to simulate their prototypes in a wide variety of scenarios and then analyze the results. Diagram illustrates the range of engineering services offered by Heraeus Electronics Assembly process development Application Knowledge Sample design and prototyping Analyses competence Simulation Competence Testing and qualification 3

6 Unique LED materials portfolio High-quality solutions for our customers Our range of products for LED applications include bonding wires, solder and sinter pastes, adhesives, substrates, celcion system and thick film materials. By combining technological know-how and our expert knowledge in LED assembly materials, we create high-quality solutions for our customers. CLOSE-UP OF AN LED Molding Silicone Coated Phosphor Chip Ceramic/Metal Substrate LED ASSEMBLY SYSTEM 4

7 BONDING AND JOINING Bonding Wires Solder Pastes Conductive Adhesives SMT Adhesives Sinter Pastes LEVEL 2 SMT joining Fine Pitch Solder Pastes LEVEL 1 Top die connection and the die attach SUBSTRATES Lead Frames COB Substrates Thick Print Copper Pastes LEVEL 1 LED die carrier substrates Celcion Pastes Polymer Thick Film Pastes Thick Print Copper Pastes LEVEL 2 Circuit boards for HP-LEDs 5

8 BONDING AND JOINING Bonding Wires Broad range of wire types for different applications and requirements. Properties Au Au Alloy Ag Cu CuPd Wire hardness HV HV HV HV HV Gas fi xtures No No Yes Yes Yes Floor life 365 days 365 days 10 days 7 days 30 days Key features Best workability and reliability Compromise between cost and reliability Alternative low cost Lowest cost Alternative low cost Conductive Adhesives Excellent conductivity at high reliability and cost efficiency. Properties PC300X PC3201 PC3601 PC400X Silver content > 80% > 80% > 80% ~40% Application Printing/ dispensing Dispensing Dispensing Printing/ dispensing Curing conditions 10 min/150 C 20 min/120 C 1 min/180 C 3 min/130 C 3 min/90 C 5 min/80 C 10 min/150 C 20 min/120 C Thermal conductivity < 5 W/(mK) < 5 W/(mK) < 3 W/(mK) < 3.9 W/(mK) Key features Standard curing Highly fl exible, fast curing Low temperature curing Low silver 6

9 Solder Pastes Exceptional electrical and thermal performance, suitable for high-power density modules. Properties F64X SOP91123 FC720 Low Temperature Alloy Standard powder type SAC, InnoRel Innolot, HT1 SAC, InnoRel Innolot SAC SnBi, SnBiAg Type 3 Type 4 Type 4 & 5 Type 3 & 4 Application Printing/ dispensing Printing Printing/ dispensing Printing Key features Superior wetting on a wide range of surfaces Halogen zero, anti-capillary Low silver versions, low voiding Low temperature refl ow, high reliability Fine Pitch Solder Pastes Available in IPC compliance ultra fine, lead-free Welco powder. Properties WS5112 (Water soluble) Alloy SAC305 SAC305 SOP9213/SOP92132 (No clean) Standard powder type Type 6 & 7 Type 6 Application Printing Printing/dispensing Key features Higher yield, no splashing Long stencil life Sinter Pastes Improve thermal, electrical and reliability performance with magic non-pressure sinter paste for longer lifetime. Properties Application Metallization Thermal conductivity Electrical resistivity magic non-pressure sinter paste Stamping, pin transfer Au, Ag > 100 W/(mK) < mω.cm Processing temperature > 200 C Key features Superior thermal conductivity, high adhesion force for small die size 7

10 SUBSTRATES CHIP-ON-BOARD (COB) Substrates* High-performance COB substrate at lowest cost due to reel to reel process and optimized material selection. Properties Thermal conductivity COB substrates W/(mK) Refl ectivity ~98% Key features Improved resistance against corrosion, superior refl ectivity at lowest cost * Product under development Celcion Pastes Enables assembly of LEDs directly on heat sink. Properties Dielectric layer Conductive layer Product name IP6080A C9929D C7847 Material Glass Silver Copper Thickness µm µm µm Thermal conductivity 1-2 W/(mK) > 100 W/(mK) > 100 W/(mK) Key features Celcion is compatible with lead-free solders and fine Au wire bonding, lower thermal resistance, longer lifetime or higher 1m/$ 8

11 Polymer Thick Film Pastes A comprehensive range of conductive, resistive & dielectric polymer thick film inks for LED circuits applications. Properties LTR46xx CL Sheet resistance 10 Ω/sq-1 kω/sq 50 mω/sq Substrates Key features Polyimide, Glass, Al 2 O 3 Fast curing, integrated resistor into circuit Polyimide, Glass, Al 2 O 3 Fast curing, solderable Thick Print Copper Pastes Lead-free material system developed for applying thick layers of copper onto AIN, Al 2 O 3 or ZTA substrates, suitable for use when high thermal and electrical properties are required. Properties C7403A (Bonding layer) C7403C (Bonding layer) C7404C (Build-up layer) Sheet resistance 0.7 mω/sq (FFT: 50 µm) 0.7 mω/sq (FFT: 50 µm) 0.7 mω/sq (FFT: 50 µm) Substrates AIN Al 2 O 3, ZTA AIN, Al 2 O 3, ZTA Key features Excellent reliability in shock/thermal cycling, design fl exibility, low warpage Lead Frames Multilayer substrates are highly innovative substrates solutions for LED applications. They permit the structuring and lamination of metal-plastic combinations in a highly efficient mass production system. The manufacturing process is able to treat all layers on separate reels and structure the miscellaneous materials according to specific requirements. 9

12 Optimal test environment For prototype testing and analysis Comprehensive testing and analysis is important in the production of high-quality LEDs and LED modules. Our stateof-the-art application center in Hanau, Germany, makes it possible for LED manufacturers to test their prototypes using extensive and advanced engineering services. We provide an optimal test environment that allows manufacturers to better understand material behaviors, combinations, and the reliability of their products in different scenarios. Our variety of processes include thermal analyses, metallography and surface analyses for the identification of possible design flaws; optimized simulation to determine the reliability of soldering compounds; and other time-consuming tests such as temperature cycle and temperature shock tests. 10

13 Our state-of-the-art application center in Hanau, Germany, makes it possible for LED manufacturers to test their prototypes using extensive and advanced engineering services.

14 We are Heraeus Electronics We are one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry. We develop sophisticated materials solutions for consumer electronics and computing, automotive, LED, power electronics and communications. Our core competencies include bonding wires, assembly materials, thick film pastes as well as roll clad strips and substrates, and their integration into perfectly matched systems. Headquartered in Hanau, Germany More than 50 years of experience in providing materials for electronics industry Product distribution to over 50 countries 10 production sites across 7 countries 12

15 Production sites and service labs Proximity to our clients around the world Hanau West Conshohocken Chisoda Zhaoyuan Changshu Incheon Shanghai Kulaijaya Singapore PRODUCTION SITES Hanau, Germany Chisoda, Romania West Conshohocken, USA Kulaijaya, Malaysia Changshu, China Shanghai, China Zhaoyuan, China Incheon, Korea Singapore SERVICE LABS Hanau, Germany West Conshohocken, USA Changshu, China Shanghai, China Singapore 1

16 Heraeus Group The Global Technology Company Heraeus Electronics is a business unit of the Heraeus Group. The technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in With expertise, a focus on innovations, operational excellence and an entrepreneurial leadership, we strive to continuously improve our business performance. We create high-quality solutions for our clients and strengthen their competitiveness in the long term by combining material expertise with technological know-how. Our ideas are focused on themes such as the environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries. In the 2016 financial year, Heraeus generated revenues without precious metals of 2.0 bn and a total revenue of 21.5 bn. With approximately 12,400 employees worldwide in more than 100 subsidiaries in 40 countries, Heraeus holds a leading position in its global markets / Layout: thinkingcouch_het The data given here is valid. We reserve the right to make technical alterations. The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.

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