ELEC 6740 Electronics Manufacturing: Chapter 13 Flux & Cleaning
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1 ELEC 6740 Electronics Manufacturing: Chapter 13 Flux & Cleaning R. Wayne Johnson Alumni Professor Auburn University
2 Outline 1. Introduction 2. Flux 3. Contaminants 4. Selection of cleaning methods 5. Cleaning processes & equipment 6. Cleanliness Test Methods & Requirements 7. Design for cleaning
3 Introduction! Flux residue " Cleaning dependent on flux type " Clean: # Water soluble organic acid fluxes # Rosin based fluxes with halides # Resin based fluxes with halides " Cleaning optional # Rosin based fluxes without halides # Resin based fluxes without halides
4 Cleaning Difficulty
5 Cleaning Difficulty
6 Function of flux! To chemically react with oxides and quickly produce a fresh, tarnish-free surface at soldering temperatures so that intermetallic bonding can take place! To prevent re-oxidation during the sodlering cycle
7 Flux Classification! L = low or no flux/flux residue activity! M = Moderate flux/flux residue activity! H = High flux/flux residue activity
8 Flux Classification
9 Inorganic fluxes! Hydrochloric acid! Hydrofluoric acid! Stannous chloride! Sodium fluoride! Potassium fluoride! Zinc chloride! Not used for electronics assembly!!!!
10 Organic Acids! Citric acid! Lactic acid! Oleic acid! Stronger than rosin fluxes! Require cleaning, aqueous or semi-aqueous! Can be used for military applications
11 Rosin Fluxes! Extracted from the stumps or bark of pine trees! C 19 H 29 COOH! Abietic acid (70-85%)! Pimaric Acids (10-15%)! Rosin fluxes are inactive at room temperature but become active when heated to soldering temperatures! The melting point of the rosin is o C
12 Rosin Fluxes RCO 2 H + MX $ RCO 2 M + HX RCO 2 H = is the rosin in the flux M = Sn, Pb or Cu X = oxide, hydroxide, or carbonate
13 Rosin Fluxes
14 Rosin Fluxes! Rosin fluxes (R and RMA) do not have to be cleaned, especially if halide free! Sticky and can attract particles! Residue can impact bed of nails testing " Penetration of probe " Coating probe
15 Low Residue or No-Clean Fluxes & Solder Pastes (Resin)
16 Low Residue or No-Clean Fluxes & Solder Pastes (Resin)! Resin content varies from 1-35% " Solids content! High solids content $ more residue! Low solids content resin fluxes leave no visible residue
17 Low Residue or No-Clean Fluxes & Solder Pastes (Resin)! Generally not as aggressive as rosin fluxes! Boards need to be handled properly to avoid contamination! Boards should be used FIFO to minimize storage time (aging of finish)! Solder balling more of a problem especially with wave soldering! Compatibility of flux with solder mask and finish must be determined
18 Low Residue or No-Clean Fluxes & Solder Pastes (Resin)! Impact of residue on bed-of-nails testing " Similar to rosin fluxes! Compatibility with conformal caotings must be determined " Conformal coatings are typically silicone or urethane coatings dipped or sprayed onto the board surface after assembly to provide environmental protection in the field
19 Contaminants
20 Contaminants! Particulates " Dust " Lint " Solder balls! Nonpolar " Rosin residues " Synthetic resin " Organic compounds from low residue/no-clean flux formulations " Plasticizers from core flux! Nonpolar (cont.) " Oil used in wave soldering " Greas or oil from palcement of insertion equipment " Hand lotions or makeup " Release agents on components " Insoluble inorganic compounds (oxidation products) " Rheologoical additives to solder paste
21 Contaminants & Solvents
22 Polar Contaminants! Residues that form ions when dissolved in water " Salts # NaCl " Halides " Acids! Increase the conductivity of water
23 Polar Contaminants! Main cause of electromigration " Produces dendritic growth between conductors and causes shorts " Requires: # A voltage difference between conductors # The presence of moisture # Ionic material
24 Polar Contaminants! Corrosion " Pb + ½O 2 = PbO " PbO +2HCl = PbCl 2 + H 2 O " PbCl 2 + H 2 O + CO 2 = PbCO 3 + 2HCl " CuO + 2HCl =CuCl 2 + H 2 O
25 Environmentally Harmful Solvents
26 CFC Phase-out
27 Other Selection Considerations! Economics of usage " Materials costs " Equipment cost " Energy cost " Disposal/treatment costs! In-house technical expertise! Compatibility with equipment & components
28 Other Selection Considerations! Performance! Surface tension " Gaps and spacings! Streaking properties! Odor! Boiling point! Flash point! Fire hazard
29 Cleaning
30 Cleaning Chemicals
31 Batch Solvent Cleaner
32 Semi-aqueous Batch Cleaner
33 Three Stage Semi-aqueous Batch Cleaner
34 Semi-aqueous Batch Cleaner
35 In-line Semi-aqueous Cleaner
36 Effectiveness of Aqueous Detergents
37 Effectiveness of Aqueous Detergents
38 Effectiveness of Aqueous Detergents
39 Chelation! Chelation is a process mwhereby an insoluble product is dissolved with the aid of a complexant! EDTA (ethylenediaminetetraacetic acid) and its sodium salts are typical chelating agents! Chelation is used to dissolve heavy metal salts which are otherwise insoluble in water! The resultant complex or chelate is water soluble
40 Closed loop Design with/without Chelating Agent
41 Aqueous Cleaner
42 Cleanliness Test Methods! Visual inspection " 2-10X microscope! Solvent extraction " Test solvent alcohol and deionized water " Using agitation, submerge board into solvent mixture to dissolve contaminants " Measure the NaCl equivalent in the solvent per square inch of board area " J-STD-001 requires less than 10.06µg NaCl equivalent per square inch
43 Cleanliness Test Methods! Surface Insulation Resistance! J-STD-001! IPC-T-650 Test Method
44 SIR Test Patterns
45 SIR Test Patterns
46 SIR Test Patterns
47 Effect of Humidity on Insulation Resistance
48 SIR Test Conditions
49 Bare Board Cleanliness
50 Example Results
51 Example Results
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