Polymer-based Microfabrication
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1 Polymer-based Microfabrication PDMS SU-8 PMMA Hydrogel 1
2 Soft Lithography Developed by Whitesides, et. al A set of techniques for microfabrication based on the use of lithography, soft substrate materials (PDMS) as a substrate, and molding of polymers Simple and cheap fabrication Rapid process for prototyping Micromolding Microtransfer molding Replica molding Microcontact Printing Monolayer (protein, cells.etc) 2
3 Micromolding Lithographyh (e.g. SU-8) Soft materials (PDMS) Molding Why micromolding? 3
4 Microcontact Printing Printing on a planar substrate with a rolling stamp Printing on a planar substrate with a planar PDMS stamp Print and pattern a layer of molecules Print and pattern probes on microarray Printing on a curved substrate with a planar stamp 4
5 Microtransfer molding (µtm) 5
6 Micromolding in Capillaries (MIMIC) 6
7 Solvent Assisted Micromolding (SAMIM) PDMS mold is wetted a solvent that can swell the polymer Solvent swells/dissolves a thin layer of polymer The resulting fluid (gellike Polymer/solvent) conforms the mold pattern Solvent evaporates and pattern solidifies Polystyrene, etc. solvent 7
8 Technical Problems in Soft Lithography Pairing Occurs at high aspect ratio Caused by weight and surface tension Occurs at low aspect ratio Caused by compression force while inking Sagging Shrinking during curing Swelling by nonpolar solvents Shrinking / swelling 8
9 PDMS (Polydimethylsiloxane) Deforms reversibly Can be molded with high fidelity Optically transparent down to ~300nm Durable and chemically inert Non-toxic Inexpensive Upon treatment in oxygen plasma, PDMS seals to itself, glass, silicon, silicon nitride, and some plastic materials 9
10 Rapid Prototyping Procedure for Soft-lithography 10
11 Thick Resist (e.g. Su-8) Lithography SU-8 is a negative photoresist based on EPON SU-8 epoxy resin for the near-uv wavelengths from 365 nm to 436 nm. At these wavelengths the photoresist has very low optical absorption, which makes photolithography of thick films with high aspect ratios possible. 1 St(Stroke)= 1 cm 2 s -1 11
12 Steps Spin speed: C nm C Baking times (min) : C (Microchem, Inc.) 12
13 PMMA (Poly methyl methacrylate) Dot pattern imprinted into PMMA ( polymethymethacrylate ). The dots have a 25 nm diameter and 120 nm period (Renstrom) Ti/Au dot pattern on a silicon substrate fabricated using nano-imprinting and a lift-off process. The dots have a 25 nm diameter and 120 nm period 13
14 Hydrogel Based Microfabrication Hydrogel Fabrication Photosensitive (polarity like negative PR) Liquid-phase photo-polymerization Laminar flow-aided patterning Functional (stimuli-responsive) and non-functional materials Fabrication of fluidic channels, actuators, valves, pumps Typical polymerization time: 5-40 sec (UV light) Minimal Total fabrication time of a system ( <10 min) A hydrogel jacket valve in a T channel (D. Beebe) 14
15 Fabrication of a valve in a Hydrogel Microchannel 2-D and 3-D micro fluidic network 15
16 Geometry Control during Fabrication by Using Laminar Flows 16
17 Rigid Materials vs. Soft (Elastomeric) Materials Rigid id materials Crystalline silicon, amorphous silicon, glass, quartz, metals Advantages: Fabrication process is mature and well developed Bulk-etching for forming two- and three-dimensional shapes Batch process compatible with IC process Silicon dioxide: good quality, stable chemically and thermally Disadvantages: Expensive Brittle Opaque (for silicon) in the UV/Vis regions Low dielectric strength (Si) Surface chemistry is difficult to manipulate Packaging/Bonding: Anodic bonding Fusion bonding Polymer bonding Good and Bad!! 17
18 Rigid Materials vs. Soft (Elastomeric) Materials Soft materials PDMS, PMMA, Polyimide, Hydrogel, etc.. Advantages: Quick Inexpensive Flexible (for actuation such as valuing) Transparent to visible/uv Durable and chemical insert Surface property easily modified Improved biocompatibility and bioactivity Disadvantages: Limited to simple structure Low thermal stability Low thermal and electrical conductivity Techniques for microfabrication not as well developed Packaging/Bonding: Through surface modification easy but not robust 18
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