Conductive Compounds Selector Guide

Transcription

1 aerospace climate control electromechanical filtration fluid & gas handling hydraulics pneumatics process control sealing & shielding Conductive adhesives, conductive sealants/gap fillers, and conductive coatings ENGINEERING YOUR SUCCESS.

2 CHO-SHIELD Conductive Coatings Filler Resin Type (Parts) Mix Ratio by A:B or A:B:C Specific Gravity 4 g/ml Max. Surface Resistance (Rec. Thickness 3 ) ohm/sq. (mils) 2044* Ni Acrylic (1) (2) 2056* & Acrylic (1) (1) 2040* Acrylic (1) (1) 610* * 596* 579 A:B 100:28.25 A:B 100:10.9 A:B 100:27.5 A:B 100:37 A:B 100: (2) (1) (1) (1) (1) 608 Polyester (1) (1) 604 Polyurethane (1) (1) 4994* 2001* Cu 2002* Cu 2003* Cu Polyurethane (4) A:B:C:D 100:18.33: 1.36:20.91 Polyurethane (3) A:B:C 100:10.06:41.96 Polyurethane (3) A:B:C 100:10.34:42.18 Polyurethane (3) A:B:C 100:10.06: (1) (3) (3) (3) Min/Max. Use Temp. F( C) -40/212 (-40/100) -85/257 (-65/125) -40/257 (-40/125) -40/257 (-40/125) -40/302 (-40/150) -40/302 (-40/150) -85/185 (-65/85) -85/185 (-65/85) -85/185 (-65/85) Elevated Cure F ( C) RT F ± 10 F (66 C ± 6 C) RT F ± 10 F (66 C ± 6 C) RT F ± 10 F (66 C ± 6 C) 4 hr.@ 175 F (79 C) 15 R.T F (65 C) 0.75 hr.@ 150 F (66 C) F (99 C) RT Cure Time Working Minutes Shelf Months 5 24 hr. n/a 9 24 hr. n/a hr. n/a 12 1 week n/a week F (121 C) 1 week min. RT F (121 C) 15 R.T F (74 C) 15 R.T F (125 C) 2 hr. RT & 40-60% RH F (55 C) 0.5 hr.@ 250 F (121 C) 0.5 hr.@ 250 F (121 C) 0.5 hr.@ 250 F (121 C) 1 week n/a unlimited 9 n/a unlimited 9 1 week week week week * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. Theoretical (Rec. Thickness 3 ) ft 2 /g (mils) m 2 /g (μm) (2) (51) (1) (25) (1) (25) (2) (51) (1) (25) (1) (25) (1) (25) (1) (25) (1) (25) (1) (25) (3) (25) (3) (76) (3) (76) (3) (76) VOC 2 g/l Typical Application Comments Plastic enclosure shielding Solvent sensitive Plastic enclosure shielding Solvent sensitive sciences electronic housings Solvent sensitive Corrosion resistance Board level shielding for semiconductor packages 560 Plating applications Protecting EMI flanges by reducing dissimilar metal concerns with EMI gaskets Protecting EMI flanges by reducing dissimilar metal concerns with EMI gaskets Parts with complex geometries Board level shielding for semiconductor packages Aircraft coatings; grounding Protecting EMI flanges Corrosion resistant coating for extreme conditions Protecting EMI flanges Corrosion resistant coating for extreme conditions Protecting EMI flanges Corrosion resistant coating for extreme conditions Commercial grade Commercial grade; black version available Commercial grade. For an filled aerosol acrylic, use CHO-SHIELD 4900 Corrosion protection Replaces stamped metal cans for board level shielding, designed for high volume, precise application in clean rooms Provides selective platable conductive paths on dielectric plastic substrates Solvent, abrasion and high temperature resistant; corrosion resistant CHO-SHIELD 579 is a lower VOC version of CHO-SHIELD 596 Solvent, abrasion and high temperature resistant; corrosion resistant Low VOC version of CHO-SHIELD 596 Flexible coating designed for thin applications < ( mm) Highly conductive, advanced coating developed for high volume, precise spray applications on circuit boards and semiconductor packages Very smooth and very conductive; long pot life; excellent sprayability Corrosion protection; flange protection Requires use of 1091 primer, sold separately. Chromate free; flange protection Requires use of 1091 primer, sold separately. Darkened version of CHO-SHIELD 2001 Requires use of 1091 primer, included in kit unless otherwise noted. Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material.

3 Adhesives Filler TECKNIT 8116* * 1029* Resin Type (Parts) Mix Ratio by A:B 584:29 100: : : : :100 A:B 100: :20 100:100 Specific Gravity 4 g/ml Max. Vol. Resistivity 3 ohm-cm Silicone (1) Silicone (2) A:B 100: Min/Max. Use Temp. F( C) -80/210 (-62/99) -80/210 (-62/99) -80/212 (-62/100) -80/212 (-62/100) -67/392 (-55/200) Min. Lap Shear 4 psi (kpa) 1200 (8274) 700 (4826) 700 (4826) 1400 (9653) 1600 (11032) 200 (1379) 450 (3103) Elevated Cure F ( C)** F (113 C) F (100 C) F (100 C) F (100 C) + 24 RT F (66 C) 20 RT Cure Time Working Shelf Months Minutes 5 VOC 2 g/l 24 hr Typical Application Comments Bonding enclosures; connnector shielding 24 hr Bonding enclosures 24 hr Bus bar grounding for shielded windows 1 week Bonding enclosures Epoxy solder 24 hr EMI gasket attachment; bonding enclosures n/a 1 week EMI gasket attachment F (121 C) 1 week EMI gasket attachment General purpose; light paste; fast heat or RT cure; mm bond lines; available in easy mix CHO-PAKs & SYRINGE-PAKs May be sprayed by thinning with toluene. CHOBOND /toluene weight mix ratio is 100:150 General purpose; medium paste; fast heat or RT cure; Easy 1:1 mix ratio (wt.); ( mm) bond lines May be sprayed by thinning with solvent. Solvent weight mix ratio is 50:30:20, toluene:butanol:propanol, CHOBOND /solvent weight mix ratio is 100:38 General purpose; very thick paste; fast heat or RT cure; Minimum bond line is.010 (0.254 mm) Recommended bond line thickness: < 0.01 (0.25 mm); Primer promotes adhesion. Recommended bond line thickness: < (0.20 mm); Primer promotes adhesion. Recommended primer is 1085 * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. ** For alternate cure schedules contact Applications Engineering. Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material.

4 Sealants/Gap Fillers Filler 4660* TECKNIT 0005* 2165* TECKNIT * 1038* 1075* 1035* / glass Cu Resin Type (Parts) Mix Ratio by A:B Polyisobutylene (1) Specific Gravity 4 g/ml Max. Vol. Resistivity 4 ohm-cm Polyolefin (1) Polyurethane (2) A:B 100: Silicone (1) Ni/C Silicone (1) Silicone (1) /Al Silicone (1) / glass Silicone (1) Min/Max. Use Temp. F( C) -67/212 (-55/100) -80/212 (-62/100) -74/399 (-59/204) -67/392 (-55/200) -67/392 (-55/200) Min. Lap Shear 4 psi (kpa) Elevated Cure F ( C) RT Cure Time Working Minutes Shelf Months 5 VOC 2 g/l n/a n/a 1 week Sealing enclosure seams Typical Application Comments Superior performance in vibration or shear. For vertical seams or longer working life, use CHO- BOND n/a n/a 24 hr Bonding enclosures Flexible thixotropic cream system n/a 150 (1034) 150 (1034) 150 (1034) 175 (1207) 100 (689) 4.0 RT F (125 C) 1 week Airframe form-in-place sealing Corrosion resistant; paintable n/a 72 hr Bonding elastomer gaskets n/a 1 week n/a 1 week Ideal in outdoor applications for EMI shielding and low corrosion Sealing enclosure seams; airframe gap sealing; connector shielding n/a 1 week Sealing enclosure seams n/a 1 week Sealing enclosure seams Rec. bond line thickness: ( mm mm); flexible paste Rec. bond line thickness: > (0.18 mm); Primer promotes adhesion. Rec. bond line thickness: > (0.18 mm); Primer promotes adhesion is a solvent free version Rec. bond line thickness: > (0.25 mm) Primer promotes adhesion Rec. bond line thickness: > (0.18 mm) Primer promotes adhesion * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material.

5 Conductive Coatings - Ordering Information Adhesives - Ordering Information Part No. Primer Included CHO-SHIELD gallon aluminum can Not Required CHO-SHIELD gallon aluminum can Not Required CHO-SHIELD gallon aluminum can Not Required CHO-SHIELD fluid ounce aluminum aerosol can Not Required CHO-SHIELD component, 1/2 pint aluminum can kit Not Required CHO-SHIELD component, 1 pint aluminum can kit Not Required 85 2 component, 1/2 pint aluminum can kit Not Required CHO-SHIELD component, 1 pint aluminum can kit Not Required CHO-SHIELD component, 1 pint aluminum can kit Not Required CHO-SHIELD gallon aluminum can Not Required CHO-SHIELD quart aluminum can Not Required 4 component, 1 quart aluminum can kit Not Required CHO-SHIELD component, 1 gallon aluminum can kit Not Required CHO-SHIELD /2 pint aluminum can Not Required CHO-SHIELD 2001* CHO-SHIELD 2002* CHO-SHIELD 2003* component, 1/2 pint aluminum can kit No component, 1/2 pint aluminum can "touch-up" kit No component, 1 pint aluminum can kit No component, 1 quart aluminum can kit No component, 1/2 pint aluminum can kit No component, 1/2 pint aluminum can "touch-up" kit No component, 1 pint aluminum can kit No component, 1 quart aluminum can kit No component, 1/2 pint aluminum can kit component, 1/2 pint aluminum can "touch-up" kit No component, 1 pint aluminum can kit component, 1 quart aluminum can kit Part No. Primer Included 1 2 component, premeasured CHO-PAK Not Required component, premeasured CHO-PAK Not Required 3 2 component, premeasured, 10 syringe kit Not Required 10 2 component, premeasured CHO-PAK Not Required 85 2 component, 4 fluid ounce polypropylene kit Not Required component, 8 fluid ounce polypropylene kit Not Required 85 2 component, 4 fluid ounce polypropylene kit Not Required component, 16 fluid ounce polypropylene kit Not Required component, 8 fluid ounce polypropylene kit Not Required component, 16 fluid ounce polypropylene kit Not Required TECKNIT component, 2 fluid ounce polypropylene kit Not Required component, 1/2 pint aluminum can kit Not Required component, 1 pint aluminum can kit Not Required fluid ounce aluminum foil tube fluid ounce aluminum foil tube No fluid ounce SEMCO tube fluid ounce aluminum foil tube fluid ounce SEMCO tube * Requires the use of 1091 Primer. continued on next page...

6 Sealants/Gap Fillers - Ordering Information Primer - Ordering Information 4660 Part No. Primer Included fluid ounce aluminum foil tube Not Required gallon fiber cartridge Not Required fluid ounce aluminum foil tube Not Required gallon fiber cartridge Not Required TECKNIT pint aluminum can Not Required 2165* component, 1/2 pint aluminum can kit No component, 1pint aluminum can kit No component, 1/2 pint aluminum can kit No 71 4 fluid ounce aluminum foil tube fluid ounce SEMCO tube fluid ounce aluminum foil tube fluid ounce aluminum foil tube No fluid ounce SEMCO tube fluid ounce SEMCO tube No fluid ounce SEMCO tube No fluid ounce SEMCO tube No fluid ounce aluminum foil tube fluid ounce SEMCO tube fluid ounce aluminum foil tube fluid ounce aluminum foil tube No fluid ounce SEMCO tube Part No pint can dram glass vial fluid ounce glass bottle pint can fluid ounce glass bottle fluid ounce plastic bottle * Requires the use of 1091 Primer.