Optimized Thermal Management. with Advanced Ceramic Materials for Power Electronics, CPV and HCPV

Transcription

1 Optimized Thermal Management with Advanced Ceramic Materials for Power Electronics, CPV and HCPV T H E C E R A M I C E X P E R T S

2 Ceramic Base Materials for the Electronics Industry We offer the full range of ceramic base materials for the electronic manufacturers: 96% Alumina Rubalit 708S For thick- and standard thinfilm applications 96% Alumina Rubalit HP For high thermal cycling performance 99% Alumina Rubalit 710 For highest quality thinfilm applications Aluminiumnitride Alunit For high thermal power applications Alumina with Zirkonia Rubalit HSS 25% For high mechanical strength applications Zirkonit For extremly high mechanical strengh requirements Metallized ceramics Wide range of possibilities: W Ni Au Ag Cu etc. 50%, 85%, 96%, 99% Alumina Rubalit 600, 702, 708 and 710 For cylindrical resistor cores Heat-sensitive semi-conductor components are often mounted onto standard substrates. They need to offer suitable thermal conductivity in addition to electrical insulation. The result is often an assembly with multiple layers made of different materials. Each layer introduces its own set of risks, thereby restricting thermal conductivity. Chip on Heatsink on the metalized surface of CeramCool heatsinks makes it possible to achieve an extremely compact design for the entire cooling system. Conventional Heatsink Structure NEW: CeramCool Chip on Heatsink Technology P CONVENTIONAL HEATSINK STRUCTURE Z th = 0,550 k/w* Z th Die Z th Solder Z th Cu Z th Al 2 O 3 Z th Cu Z th Solder Z th Baseplate Z th Thermal grease Z th Heatsink * Examination done by Fraunhofer IISB, Nuremberg NEW CERAMCOOL CHIP ON HEATSINK TECHNOLOGY Z th = 0,268 k/w* P Z th = 0,550 k/w* Z th Die Z th Solder Z th Cu Z th Ceramic Heatsink * Examination done by Fraunhofer IISB, Nuremberg Comparison: Conventional Heatsink Structure vs. CeramCool Chip on Heatsink Technology Multi-K AlN Pressure drop 1,2 1 NEW CERAMCOOL CHIP ON HEATSINK TECHNOLOGY T die coolant [K] W/cm W/cm W/cm W/cm W/cm W/cm Flowrate [l/min] 0,8 0,6 0,4 0,2 pressure drop [bar]

3 CeramCool Sandwich Cooling Sandwich design for double-sided cooling The power semi-conductor can be cooled from the bottom and top to reduce thermal resistance even further. In this sandwich design the semi-conductor chip is mounted between two ceramic heatsinks. The necessary clearance is achieved by means of via-filled, metalized ceramic cuboids that are highly conductive, both electrically and thermally, and have a thermal expansion coefficient very close to that of silicon. The cooling capacity can be increased by up 50% depending on the construction. Optimized Thermal Management with CeramCool Sandwich Cooling Comparison CeramCool Multi-K vs. Sandwich Cooling NEW CERAMCOOL SANDWICH COOLING T die coolant [K] W/cm 2 Multi-K single-sided Sandwich Cooling double-sided Flowrate [l/min]

4 CeramCool 3D Products New possibilities with three-dimensional metalized substrates featuring structured copper technology (SCT) for highperformance electronic circuits. Materials and surface quality Typical R a Value as fired Content Rubalit µm > 96% Al 2 O 3 Rubalit µm > 99% Al 2 O 3 Alunit 0.6 µm ZrO µm Parameters and tolerances Standard tolerances Special tolerances Length and width (as fired) ± 1% 1 ± 0.7% 2 Thickness ± 10% ± 7% Hole diameter < 2 mm ± 0.05 mm ± 0.05 mm Hole diameter 2 10 mm ± 0.10 mm ± mm Hole diameter > 10 mm ± 1% ± 0.7 mm Distance between holes (center distance) ± 1% 1 ± 0.7% 2 Overall camber 0.4% of length 0.3% of length Perpendicularity ± 0.5% 1 Parallelism Quoted upon request Radii and corners 0.2% 1 but not less than +/ 0.1 mm 2 but not less than +/ 0.05 mm 3 but not less than +/ mm Please see our data sheets for further information Indexes and parameters for ceramic substances: In order to profile ceramic substances certain parameters are indicated. The crystalline nature of these substances, statistical fluctuations in the composition of the substances and in the factors that impact on the production processes indicate that the figures quoted are typically mean values and hence the substance parameters quoted in this brochure are only standard, recommended or guide values that might differ given dissimilar dimensions and production processes.

5 CeramCool Advanced Ceramic Materials The ceramic materials used are Rubalit aluminum oxide and Alunit aluminum nitride, which can feature a number of different metalizations and conductor path structures if necessary, even three-dimensional and around the edge. Functional Surfaces 1D, 2D and 3D metallization Materials Rubalit 708, Rubalit 708S, Rubalit 708HP, Rubalit HSS, Alunit Materials and surface quality Basic metallization Metal plating Electroless Cu Ni ( 2 µm 8 µm) Au flash (approx. 0.1 µm), Pd Au Cu Ag W 6 µm Ni ( 2 µm 8 µm) Au flash (approx. 0.1 µm), Pd Au Ag 6 µm Au 6 µm Al 6 µm Other metallization on demand Property Typical R a Value as fired Values Options Double side metallization; vias viafilling and dielectric layer on demand Metallization Adhesion 25 N/mm 2 Solder wettability 95% Solder mask Available, on demand Substrates Materials and surface quality Content Rubalit 708 S < 0.6 µm > 96% Al 2 O 3 Rubalit 708 HP < 0.6 µm > 96% Al 2 O 3 Alunit 0.8 µm AlN Dimensions and tolerances Property Values mm x mm mm x mm Dimensions mm x mm mm x mm mm x mm Length and with ± 1.5% (as fired) tolerance 0.25 mm, 0.38 mm 0.50 mm, 0.63 mm Thickness 0.76 mm, 0.89 mm 1.00 mm, 1.27 mm, Thickness tolerance ± 10% Special thicknesses from 0.1 mm up to 1.5 mm Structured Copper Technology Property Standard ceramic materials Standard dimension of Mastercard Standard usable design area Cu layer thicknesses Pitch Flatness Plating Cu surface Lifetime (shock testing -55 C up to 150 C) Solder wettability on Cu surface Thick wire bondability Thin wire bondability (on NiPdAu surface) Vias and through connections Multilayer Printed resistors Copperfree perimeter around holes Copperfree perimeter around single parts Values Al 2 O 3 (0.38 mm/0.5 mm/ 0.63 mm/1.0 mm) AlN (0.63 mm/1.0 mm) Others thicknesses on demand As fired mm x mm (± 1.5%) mm x mm (± 0.05mm) 17 µm up to 300 µm Layout related Other thicknesses on demand Min. 200 µm (copper thickness and layout related) Layout and material combination related Ni (2 8 µm) NiAu (Au µm) NiPdAu (Pd µm) Ag R t : 50 µm, R a : 2 µm Lower roughness on demand Al2O3 (0.32 mm 0,38 mm) > 1,000 cycles AlN (0.63 mm) > 900 cycles SnAg preform, SnCuIn preform 95% wetting 300 µm Alumina wire AlH11 > 1,000 cn Shear force 25 µm Au wire > 30 cn Shear force Possible, on demand Up to 4 Layers Possible A 0.2 mm A 0.25 mm Peel strength Min. 25 N/mm 2 Solderstop width Min. 0.4 mm +/ 0.2 mm Missmatch between solder mask and copper +/ 0.2 mm Mastercards or single pieces Delivery form (min. dimension 15 mm edge length) Tolerance of total thickness +7%/ 10% Application temperature 55 C/700 C

6 T H E C E R A M I C E X P E R T S CeramTec GmbH CeramTec-Weg Marktredwitz Germany Phone: Fax: electronic_applications@ceramtec.de The measured values mentioned before were determined for test samples and are applicable as standard values. The values were determined on the basis of DIN-/DIN-VDE standards and if these were not available, on the basis of CeramTec standards. The values indicated must not be transferred to arbitrary formats, components or parts featuring different surface qualities. They do not constitute a guarantee for certain properties. We expressly reserve the right to make technical changes. EL EN Lorenz Printed in Germany