SHENZHEN BBIEN TECHNOLOGY LIMITED B/O HANON TECHNOLOGY INDUSTRY LIMITED 产品说明书 PRODUCT ANALYSIS CERTIFICATE. Sn96.5Ag3.0Cu0.

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1 SHENZHEN BBIEN TECHNOLOGY LIMITED B/O HANON TECHNOLOGY INDUSTRY LIMITED 产品说明书 PRODUCT ANALYSIS CERTIFICATE Sn96.5Ag3.0Cu0.5 solder powder Add: 5th/F,Jindu Building,BanXuegang Road No.1-4,Bantian Street,Longgang Distric,Shenzhen City,Chi na FactoryAdd: Fuxiang Street No.45,HuangNiupu,Huangjiang TownGongChang RoadDongguang City,China Factory No.18 of Jinlang Secondary Street,Diaolang Village,Huangjiang Town,Dongguan,China International dept:hanon TECHNOLOGY INDUSTRY LIMITED OFFICE 3A,12/F,KAISER,NO18 CENTRE STREE,SAI YING PUN,HONG KONG,CHINA Phone: Tell: Fax: ; 1. 适用范围 (Application): 消费电子

2 此承认书仅适用本公司, 交付于 SHENZHEN BBIEN TECHNOLOGY CO.,LTD This file is provided by Shenzhen bbien technology Co.,Ltd BBIEN LF-05 types SAC305 tin silver alloy solder powder Type 7 SAC305 powder instruction BBIEN S LF-05 SAC305(SN96.5Ag3.0Cu0.5) is a lead-free,tin silver copper alloy solder powder designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.the melting point of SAC305 is 217degree Celsius. Packing with 1kg and 5kg per vacuum bag filled with nitrogen. Availability size of powder: Available type:it is available in Sn96.5Ag3.0Cu0.5 type 3 powder mesh is normally recommended, but type4,type5,type6 and type7 are all skilled and available for this alloy solder paste. BBIEN S LF-05 SAC305(SN96.5Ag3.0Cu0.5) solder powder is available for fine pitch applications with SnAgCu alloys in a similar melting range to the listed alloys,for specific packaging information. Sn96.5Ag3.0Cu0.5 tin silver solder powder, the following size of powder can be available Small variations in composition and the level of impurities can affect wetting properties of the solder paste: oxidation behavior, melting temperatures, flow within the joint and joint strength. The ideal solder composition will feature tight tolerances of alloy composition BBIEN SAC305 silver solder type7 to type3 powder is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. Storage, Handling, and Shelf Life: Recommended optimum storage condition for solder powder to maintain consistent viscosity,reflow characteristics, and overall performance. BBIEN S SAC305 should be stabilized at room temperature prior to

3 printing. BBIEN SAC305 should be kept at standard refrigeration temperatures, 20~28 C. Please contact BBIEN,if you require additional advice with regard to storage and handling of this material. Shelf life is 6months from date of manufacture and held at 20~28 C BBIEN LF-05 SAC305 powder feature Powders are divided into six or seven particle type with the finer powder represented by higher numbers. Table 1 also includes the customary designation of powders by mesh sizes of the sieves used to sort the particles according to ASTM B-214 Test Method 1.The welding powder is ball shaped,the dark part is a tin rich area and the light part is a lead rich area.the pictures show the good sphericity, homogenous alloy composition and smooth surface of the product. 2.Particle size classification and final typing technology enables stable particle size of the product provided to customers. 3. SAC305 type7 silver powder has low oxygen content oxygen content is strictly controlled during production and packing of allalloy welding powder.leco oxygen determinator is adopted to determine the surface oxygen content and chemical assay is adopted to determine the total oxygen content. 4.Advanced powder classification and collection technology enables Type 4-Type 3 alloy welding powder free of powder smaller than 20um. BBIEN SAC305 solder powder technical Datasheet Test Item Test Result Test Method Copper Plate Corrosion Test Pass JIS-Z-3197, Spread Test > 75% JIS-Z-3197, Copper Mirror Test Pass IPC-TM-650, Viscosity Test(25 C,10rpm) 220 ± 30 Pa s JIS-Z Annex 6 Tackiness Test (gf) > 130 (8hr) JIS-Z Annex 9 Slump Test Pass JIS-Z Annex 7, 8 Solder Ball Test Pass JIS-Z Annex 11 Test Content----Reliability Test--

4 S.I.R. Test > Ω, Pass IPC-TM-650, Electro Migration Test Pass IPC-TM-650, Purity and chemistry component Specification Appearance Packing Sn96.5-Ag3.0-Cu0.5 type7 and type6 solder powder Gray/black small size of powder on surface General 1kg/bag and 5kg/bag foil bag with nitrogen packed-in Chemistry component Elements Max Tested result(%wt) Specification (%) Sn96.5± Ag 3.0± Al As Sb Bi Cu 0.4~ Fe In Ni Pb Cd Au Mark: The above concentration of specification are in % weight. a. Single value listed are the maximum allowable standard. c. Size: 5-45micro- 50% average size: smaller than 10 micro - Oxygen content: less than 200ppm Sort Melting Spec. Gravity MPa Point g/cm3 Tensile Strength Sn96.5Ag3.0Cu g/cm3 68.5

5 3.Physical feature 5th/F,Jimdu Building,BanXuegang Road No.1-4,Bantian Street,Longgang Distric,Shenzhen City China Alloy Melting Suggesting Gravity Rigidity Conduct Extend Extend Condu compone point Working g/cm 3 HB heat Mpa rate ctivity nt temperatur M.S.K % % e Sn96.5A g3.0cu Above Packing Details: The packing materials can be separated into inner layer vacuum bag and outer package with plastic barrel, so as to better secure for shipping and transportation. Specification Appearance Weight Sn96.5Ag3.0Cu0.5 type7,type6,type5,type4 and type3 gray powder 1kg/bag or 5kg/bag;20-25kg/barrel 1) BBIEN's solder powder as follow SN Alloy Brand Solidus Liquidus Density Available type Temperature Temperature g/cm 3 size 1 Sn42Bi Sn64Bi35Ag Sn64.7Bi35Ag Sn42Bi57.7Ag Type3~type5 5 Sn96.5Ag3.0Cu Sn99Ag0.3Cu Sn63Pb Sn62Pb36Ag Exported countries:

6 BBIEN SAC305 types solder alloy powder have been exported to America,Canada,Taiwan,Hongkong,SouthKorea,Russia,Japan,India We are appreciated your kindly feedback and inquiries. Products Photos Health & Safety: This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product. Application and Photos: BBIEN S SAC305 types of solder powder are used in generally making solder paste with flux miture,applied for the assembly of printed circuit boards (PCBs). BBIEN SAC305 type 7 solder powder is also apply for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others..