LM1235HP Series SMD Power Choke Coil

Transcription

1 1. PART NO. EXPRESSION : LM 1 5 H P 1 R M F - (a) (b) (c) (d) (e)(f) (g) (a) Series code (b) Dimension code (c) Type code (d) Inductance code : 1R = 1.uH (e) Tolerance code : M = ± %, Y = ± % (f) F : RoHS Compliant (g) 11~99 : Internal controlled number. CONFIGURATION & DIMENSIONS : A C D B 1R 1 E Unit:m/m A B C D E ±.5 ±..±..±. 4.7±.. SCHEMATIC : 4. MATERIALS : d (a) Core : Carbonyl Powder. e (b) Wire : Polyester Wire or equivalent (c) Solder Plating : 1% free solder (d) Ink : Halogen-free ketone a b c (e) Paint : Epoxy resin 5. GENERAL SPECIFICATION : a) Test Freq. : L : 1KHz/1.V b) Ambient Temp. : 5 C c) Operating Temp. : -4 C to +15 C d) Storage Temp. : -1 C to + 4 C e) Humidity Range : 5 ~ % RH (Product without taping) f) Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 4 C (keep 1min.) g) Saturation Current (Isat) will cause L to drop % typical. (keep quickly). h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 15 C under worst case operating conditions tel (9/1) LM15HP-1

2 . ELECTRICAL CHARACTERISTICS : Part No. Inductance L ( μh A Irms ( A ) Typ. Isat ( A ) Typ. DCR ( mω ) 5 C DCR ( mω ) 5 C LM15HPR1YF LM15HPR15YF LM15HPRMF LM15HPRMF LM15HPR47MF LM15HPRMF LM15HPR8MF LM15HPR8MF LM15HP1RMF LM15HP1R5MF LM15HP1R8MF LM15HPRMF LM15HPRMF LM15HP4R7MF LM15HP5RMF LM15HPR8MF LM15HP8RMF LM15HP1MF Tolerance : M = ± %, Y = ± % tel (9/1) LM15HP-

3 7. CHARACTERISTICS CURVES :. LM15HPR1YF TMPC15HP-R1 1.4 LM15HPR15YF TMPC15HP-R LM15HPRMF TMPC15HP-R 1.8 LM15HPRMF TMPC15HP-R LM15HPR47MF TMPC15HP-R LM15HPRMF TMPC15HP-R tel (9/1) LM15HP-

4 7. CHARACTERISTICS CURVES : LM15HPR8MF TMPC15HP-R8 1 TMPC15HP-R8 LM15HPR8MF LM15HP1RMF TMPC15HP-1R 1.5 LM15HP1R5MF TMPC15HP-1R LM 15HP1R8MF TMPC15HP-1R8 1 4 LM 15HPRMF TMPC15HP-R tel (9/1) LM15HP-4

5 7. CHARACTERISTICS CURVES : LM15HPRMF TMPC15HP-R 1 1 LM15HP4R7MF TMPC15HP-4R LM 15HP5RMF TMPC15HP-5R 1 1 LM 15HPR8MF TMPC15HP-R LM15HP8RMF TMPC15HP-8R 1 15 LM15HP1MF TMPC15HP tel (9/1) LM15HP-5

6 8. RELIABILITY AND TEST CONDITION Electrical Characteristics Test Inductance DCR ITEM Heat Rated Current (Irms) PERFORMANCE Refer to standard electrical characteristics list Approximately ΔT 4 C TEST CONDITION HP484A, CH115, CH, CH1, CH1S LCR meter. CH15, Agilent4A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately ΔT( C) without core loss 1. Applied the allowed DC current(keep 1min).. Temperature measured by digital surface thermometer Saturation Current (Isat) Reliability Test High Temperature Exposure Test Low Temperature Life Test ΔL% typical. Electric specification should be satisfied Isat(A) will cause Lo to drop ΔL(%) (keep quickly). Temperature : 15± C Time : 1± 1 hours Measured at room temperature after placing for to hrs (MIL-PRF-7) Temperature : -4± C Time : 5± 1 hours Measured at room temperature after placing for to hrs Thermal Shock Test Conditions of 1 cycle. Step Temperature ( C) 1-4+/- Room Temperature +15+/- Times (min.) 15± 1 Within <. 15± 1 Total : cycles Measure at room temperature after placing for to hrs. (AEC-Q-REV C) Humidity Resistance Vibration Test Reflow Test Solder test Terminals should be covered by over 95% solder on visual inspection. Temperature : 85± C Humidity : 85± % RH Time : 1± 1 hours Measured at room temperature after placing for to hrs (AEC-Q-REV C) Frequency : 1--1Hz for min. Amplitude: Parts mounted within " from any secure point. Directions and times : X, Y, Z directions for min. This cycle shall be performed 1 times in each of three mutually perpendicular directions. (Total 1 hours) (MIL-STD- Method 4 D Test condition B) Preheat : 15± 5 C Duration : 5 minutes Temperature : ± 5 C, ~4 seconds (IPC/JEDEC J-STD-C) After dip into flux,dip into solder 5± 5 C, 4± 1seconds Flux, solder for lead free (ANSI/J-STD-C Method B) tel (9/1) LM15HP-

7 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure Soldering Iron (Figure ) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 15 C. b) 55 C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.mm tip diameter (max) e) Use a watt soldering iron with tip diameter of 1.mm f) Limit soldering time to 4~5 secs. TEMPERATURE C 5 Preheating Soldering ~4s TP( C/4s max.) ~15s ~18s 48s max. Time(sec.) Natural cooling TEMPERATURE C 5 15 Preheating Over 1min. Soldering Natural cooling Gradual Cooling Within 4-5s Figure 1. Re-flow Soldering: times max. Figure. Hand Soldering: 1 times max tel (9/1) LM15HP-7

8 1. PACKAGING INFORMATION : 1-1. Reel Dimension COVER TAPE.±.5 ØC D B A EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) 1" x 4mm 4.±.5 1±. ±.5 1- Tape Dimension T W 1R Bz B F 1R 1R 1R 1R 1R P Az A Series Ao(mm) Az(mm) Bo(mm) Bz(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) LM15 1.9±.1 7.± ±.1 1.±.1 4.±.1 1.±.1 4±. 1±.1.5± Packaging Quantity Size Chip / Reel Inner Box Carton LM tel (9/1) LM15HP-8

9 1-4. Tearing Off Force Top cover tape F 15 to 18 The force for tearing off cover tape is 1 to 1 grams in the arrow direction under the following conditions. (referenced ANSI/EIA-481-C- of 4.11 standard) Room Temp. ( C) Room Humidity (%) Room atm (hpa) Tearing Speed (mm/min) 5~5 45~85 8~1 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than C and 7% RH. b) Recommended products should be used within months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air.. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized tel (9/1) LM15HP-9

10 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ICE Components: LM15HPR47MF LM15HPR8MF LM15HP1RMF LM15HP1R5MF LM15HPRMF LM15HPR8MF LM15HPRMF LM15HPR15YF LM15HPR1YF LM15HP5RMF LM15HPR8MF LM15HPRMF LM15HPRMF LM15HPRMF LM15HP1R8MF LM15HP1MF LM15HP4R7MF LM15HP8RMF