Intelligent sensor systems for condition monitoring through additive manufacture of ceramic packages

Transcription

1 Intelligent sensor systems for condition monitoring through additive manufacture of ceramic packages Robert Kay, Maria Mirgkizoudi, Ji Li, Russell Harris, Alberto Campos-Zatarain & David Flynn IeMRC Annual Conference

2 Intelligent sensor systems for condition monitoring through additive manufacture of ceramic packages Loughborough and Heriot-Watt University 2 year project 6 Industrial partners covering full supply chain 2

3 Project Motivation Many industrial sectors require bespoke packages for remote sensor networks that can reliably operate in harsh environments. Ceramic packages have a number of advantages in terms of high reliability, hermetical sealing and ability to withstand high thermal and mechanical shock. To produce Ceramic substrates (LTCC & HTCC) requires template based manufacturing processes that need large batch production sizes in order to become economically viable. The also have a 2.5D limitation. Use of additive manufacturing to overcome the current limitations of ceramic substrate manufacture Multi-Chip Module from Baker Hughes 3

4 Additive Manufacturing / 3D Printing AM offers greater geometric complexity over traditional manufacturing processes. For low production volumes AM is very cost effective. 4

5 ASTM F42 Process families categorisation 1. Material extrusion- A material is selectively dispensed through a nozzle or orifice (FDM). 2. Vat photopolymerization - Liquid photopolymer in a vat is selectively cured by light-activated polymerization (Stereolithography). 3. Powder bed fusion - thermal energy selectively fuses regions of a powder bed (SLS). 4. Material jetting - Droplets of build material are selectively deposited (Ink jet printing). 5. Binder jetting - A liquid bonding agent is selectively deposited to join powder materials (Zcorp 3D printing). 6. Directed energy deposition - Focused thermal energy is used to fuse materials by melting as the material is being deposited (LENS). 7. Sheet lamination - Sheets of material are bonded to form an object (UC). 5

6 Feasibility demonstrator 555 timer circuit 555 timer circuit consists of: 3 x capacitors 1 x LED 4 x resistors 1 x transistor 1 x 555 timer chip. 6

7 3D micro-extrusion apparatus 5-axis table drives the dispensing head with motion accuracy ±25µm. Micro-extrusion head equipped with a piezoelectric actuator is used for printing of a ceramic paste. The actuator is used to quickly open and close the valve to accurately control the dispensing process. Mach3 software controls the motion of the table and the actuation of the extrusion head. 5-axis table Mach3 Software Air Supply Extrusion head Dispensing Controller 7

8 3D ceramic forming process Alumina based paste supplied by Morgan Advanced Materials Fine particle size distribution Exhibited the required viscoelastic characteristics Enabled printing successfully down through 100µm nozzles. Perimeter Infill 150µm nozzle 150µm nozzle used for this printing process Printing process 1. Extrude a perimeter defining the layer features 2. Layer is in-filed using a rectilinear infill pattern 3. The process is then repeated layer-by-layer to build up the substrate 8

9 Resultant fired ceramic substrates Feasibility demonstrator consisted of 4 layers Green part fired at 1600 C Shrinkages ~15% from the process Fired part dimension: 29.5 x 24.5 x 0.8mm Cross sectioning reveals a high density Printed layers not visible Polishing needs improving as grains have been cleaved from the sample surface. Better elimination of air entrapment in the paste prior to printing is required. 9

10 Dispensing the conductor layer Mushasi dispensing system 3-axis motion table is used to drive the dispensing head with motion accuracy ±1µm CCD camera for alignment Laser are used for for surface mapping of 3D geometries Laser and Nozzle sizes down to 20 microns CCD camera 10 Ag based LTCC paste selectively deposited onto the fired ceramic substrate Designed for screen printing 200µm nozzle used Dispensing Head Air Pressure Controller Motion Table

11 Conductor layer print results Material exhibited sheer thinning characteristics required for dispensing however had a tendency to slump and flow to easily through the nozzle. Using a smaller nozzle diameter plus adjustments to the rheological properties of the paste material and a reduction of particle size could enable finer track widths. 11

12 Fired ceramic based electronic substrate After printing the substrate was fired again using a profile of: 3 C/min to 100 C è 2 C/min to 450 C è 10 C/min to 865 C è hold for 20 min è cool at 6-10 C/min Final line width after firing was approximately 700µm. Fired conductor lines exhibited a strong adhesion and a low resistance similar to conventional LTCC conductive tracks. 12

13 Assembly process The ceramic substrate was processed using a conventional surface mount assembly process: 1. Solder paste deposition. 2. Pick and placement of the individual components 3. Reflow process in a convection oven. 13

14 Final assembled demonstrator This work demonstrates the first fully 3D printed ceramic electronic substrate completely compatible with conventional surface mount packaging. 14

15 Future work Multilayer circuit capability High accuracy system alignment Z-axis vias Harsh environment testing, Shake and bake Hermitic packages evaluation Co-fireable ceramic paste formulation Conductor formation on 3D surfaces rather than planar using 5- axis machine and vision system Development of SLID packaging process with SiC power electronic devices Novel Stereolithography Apparatus for dense micron tolerance ceramic parts 15

16 EPSRC Centre for Power electronics feasibility study funding 6 month project Broaden the original remit of the IeMRC project: By incorporating SiC devices into the 3D printed ceramic packages Testing SLID samples for harsh environments - electrodynamic shaker with hotplate custom built at Loughborough University Translate the IeMRC findings and further develop the 3D printing process for power electronics applications 16

17 Conclusions First digitally driven ceramic electronic substrate manufacturing process demonstrated with a working feasibility demonstrator. The use of additive manufacturing has the potential to revolutionise the production of ceramic based packages by enabling: Mass customisation Iterative product development Rapid turnaround time of parts, Cost effective low-volume production, Improved resource efficiency Generation of more complex structures with increased design freedoms. In particular, the offshore renewable energy, oil & gas and military sectors would benefit immensely for having a flexible, fast, low cost manufacturing process where production volume or complexity is not a limiting factor. 17

18 Acknowledgments Financial support from the IeMRC Special thanks to Maria Mirgkizoudi and Ji Li Chris Hampson at Morgan Advanced Materials Alberto Campos-Zatarain and David Flynn at Heriot- Watt University The Industrial Consortium on this project: Baker Hughes, Eltek Semiconductor, MacTaggart Scott, Morgan Advanced Materials, Renishaw, Torishima 18

19 IeMRC 2015 conference posters #21 - Alberto Campos-Zatarain, Maria Mirgkizoudi & David Flynn, Thermomechanical Characterization of Cu-Sn SLID Interconnects for Harsh Environment Applications #22 - Jack Hinton & Tom Wasley, Design and Development of an Optical Alignment System for the Integration of Additive Manufacturing Processes #23 - Matthew Smith, High Resolution 3D Printing of Ceramic Components Using Stereolithography #24 - Alastair Lennox & Alex Bowen, Conditional monitoring of wind turbines using Additive Manufacturing #25 - Chris Ruddock, The Development of an Integrated Swimming Performance Monitor and Training Aid #26 - Tom Wasley, Hybrid Additive Manufacturing of 3D Electronic Circuits #27 - Maria Mirgkizoudi & Ji Li, Digital 3D forming of Ceramic Electronic Components #28 - Ji Li & Tom Wasley, Direct Digital Fabrication of Advanced Manufacturing Processes 19

20 Thank you Any Questions? Dr. Robert Kay Senior Lecturer in Additive Manufacturing Wolfson School of Mechanical & Manufacturing Engineering Loughborough University LE11 3TU UK