Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html
Agenda Trends and Developments ECO Trend Wärmemanagment Embedding Miniaturisierung
Trends and Developments Eco Trends Panasonic R1533E
ECO - Trend HF Material Your company only
Your company only Basic data of R-1533E Specification key data: Green Material - Halogen Free Resin System Designed for a wide range of Industrial Applications Glass Transition Mid-TG Level (150 ºC) CTI Value - UL Class 1 (400-599 V) Reflow Resistivity min. 3 times reflow @ 260 ºC CAF Reliability according to Industrial Standards Price Level within the range of a conv. Mid TG IPC: IPC-4101D No. 128
Your company only Material properties Comparison Material properties Thickness: 0.75mm Method R1755C R1755M R1533E DSC DSC ( C) 135 153 153 T-288 TMA (min) >120 110 >120 Td TGA -5% 370 355 365 CTE(z) TMA < Tg 50ppm/ 40ppm/ 35ppm/ CTE(z) TMA >Tg 260 ppm/ 240 ppm/ 190ppm/ Peel Strength 35µm IPC TM 650 kn/m 1,5 1,5 1,4 CTI ASTM D3638 200 200 500 Flammability UL method 94V-0 Bromine 94V-0 Bromine 94V-0 halogen free The above data are our actual values and not assured values.
Trends and Developments Wärmemanagement ECooL Serie ECooL CEM3 ECooL Flex ECooL Multilayer ECooL sheet
Panasonic thermal conductive material line-up Item Unit ECOOL-M R-15T1 ECOOL-F R-F775 ECOOL R-1586(H) ECOOL R-1787 UL / ANSI grade No ANSI No ANSI CEM-3 CEM-3 FR-4.0 Dielectric layer thickness mm 0.08 0.025 1.0 1.0 1.0 conventional FR-4 Thermal conductivity 1 W/m K 1.5 0.3 1.5 1.1 0.4 Thermal resistance C/W 0.4 2 0.6 5.0 6.7 17.5 CONDITION: AS RECEIVED 1 LASER FLASH METHOD 2 CALCULATED VALUE THE ABOVE DATA IS ACTUAL VALUES AND NOT GUARANTEED VALUES
General Properties ECooL M THE ABOVE DATA IS ACTUAL VALUES AND NOT GUARANTEED VALUES
Ecool M
Your company only 11 Overview Cover Film (OPP or PET) 15~200μm Base Film (PET) Base Film (PET) Filler-filled Epoxy (B-stage) Cut (white, Black) Rolled
Application : Thermal PCB Your company only Metal Substrate insulator Copper foil or PCB CV2079 series Application1 single 1layer (with using copper foil) Application2 single 2layer (with using PCB) Metal (Al etc) Power Module Interface CV2079 series Alternated DBC (Dirrect bonding copper) Ceramic substrate almina ceramic DBC NEW stracture (proposal) CV2079 series
Thermal resistance ( /w) CV2079B 3W/mK (Mass Production) Application : Thermal PCB CV2079D 5W/mK (Commercial) Excellent thermal conductivity Fine pattern High and controllable flowabilty Power device modules Resin mold Thick Copper CV2079 series Copper foil (70~105um) 0.05 0.10 DBC Large current circuit boards Copper foil (12~105um) CV2079 series Thick Copper circuit board (70~200um) Item Unit DBC CV2079D Thermal conductivity w/mk 30 5.0 Thermal resistance /w 0.1 0.05 L/S μm 600/600 100/100 Pattern thickness μm 200-250 < 400 Embedded pattern and parts μm Impossible t= 400 0.20 Low Metal PCB COST High
Your company only Line up (for Thermal PCB) Item unit CV2079B CV2079D Thermal conductivity W/mK 3.2 5.0 Curing temperature 170 0 C or more 170 0 C or more Sheet thickness um 50~200 100~200 Filler size(max) um 35 55 Glass Trans temp 0 C 210 190 CTE a1/a2 ppm/ 0 C 13/35 12/30 Dielectric factor - 7.2 8.3 Dielectric tangent - 0.006 0.006 Flexural modulus GPa 26 33 Flexural strength MPa 200 200 THE ABOVE DATA IS ACTUAL VALUES AND NOT GUARANTEED VALUES
Your company only Properties CV 2079# serie THE ABOVE DATA IS ACTUAL VALUES AND NOT GUARANTEED VALUES
Trends and Developments Embedding
Your company only Line Up Encapsulant Liquid Materials Epoxy Molding Compound Sheet Form Encapsulant Materials CV2000 series Cut (white, Black) Rolled CCL EMC Core technology Epoxy Formulation tech. Filler Distribution tech. Evaluation tech. Coating tech. Drying tech. 17
Your company only 18 Overview : Advantage 1. Excellent in embedding thick copper and components since there is no glass fabric (vs prepreg) (Prepreg) Thin (Sheet) Thick Component Thick Copper Copper Foil Thick Copper Thin insulating layer 2. Excellent in forming a thin film in a large area (vs EMC, ELC) (EMC, ELC) (Sheet) 3. Possible to control the B stage property (Flow, Reactivity etc. ) 4. Possible to control the cured property (CTE, Modulus, Tg, Dielectric constant, Thermal conductivity etc. )
Your company only 19 CV2008 Application (High: Tg) Embedded module CV2006 (Small filler) CV2106FB (High strain) Thick parts embedded (<400μm) Excellent flatness after pressing Thin encapsulation on large area Chip component Embedded Chip inductor Prepreg Type Sheet Type Paste T/H Via Flatness after pressing Prepreg CV2008 CV2000 series Embedded Chip condenser Narrow clearance between upside copper and top of parts Item Embeded process w/ window w/o window Embeded parts Low density High density Thickness Remain glass cloth No glass cloth Components are filled with high CTE material low CTE material
Your company only Line up for Embedded module Item unit CV2008 CV2006 CV2106FB Feature - > Low CTE > High Tg > High Tg > Small filler size > Cured products: Tough > Low Temp. curable > Small filler size Curing temperature 170 0 C or more 170 0 C or more 140 0 C or more Sheet thickness um 45~200 20~200 20~200 Filler size(max) um 20 5 5 Glass Trans temp 0 C 205 197 135 CTE a1/a2 ppm/ 0 C 13/45 23/66 22/62 Dielectric factor - 3.9 3.9 3.8 Dielectric tangent - 0.008 0.01 0.007 Flexural modulus GPa 17 14 13 Flexural strength MPa 230 210 220 Strain by bending test Mm 0.9 1.0 2.4 Thermal conductivity W/mK 0.8 0.8 0.8 THE ABOVE DATA IS ACTUAL VALUES AND NOT GUARANTEED VALUES 20
Trends and Developments Miniaturization
22
G525 concept 23
Basis properties
Overview IC Material line up Overview IC Materials
Panasonic material overview
Product Development from viewpoint of customer Servers Routers Networking Equipment LED, Automotive, Power Device LED back light ECUs, Headlamp LED lightings etc. Switches Base Stations etc. High thermal dissipation Materials Low Dk/Df and High Tg Circuit Board Materials series series Requirements Products Material Design Technology IC Substrate Materials Process Technology Evaluation and Analysis Acquired Technology Technology (Black type) series High Reliability Circuit Board Materials PreMulti (Mass laminations) series IC Substrates CSP Cards BOCs PC-BGAs etc. Automotive/ Industrial Automotive etc. Halogen free Halogen-free FR-4 Halogen-free CEM-3 Halogen-free FR-1 Flexible Circuit Board Materials series Advanced Films Roboter TVs Note PCs DVCs DVD Players Printers DVD-ROM drives etc. Home Appliances PC-related Devices Laundry machines series Tablet PCs Note PCs Smart phones DSCs Mobile Products Digital Audio Players etc.
Summary let s go halogen free! Panasonic offer with the new halogen free R1533E material a cost neutral way for industrial applications! Ecool sheet CV2079 series new thermal conductive offering for thermal interfaces Sheet material CV 200# series The new way of embedding Your company only Miniaturization with Low cte x/y material and low stress material