Sputtering Targets for Semiconductor Manufacturing Applications TECHCET s Market & Supply Chain Critical Materials Report By Terry A. Francis Edited by L. Shon Roy TECHCET Group a TECHCET CA LLC Company August 2017 www.techcet.com info@techcet.com
Table of Contents 1: Executive Summary... 10 2: Scope & Methodology... 14 3: Semiconductor Market Overview...18 3.1 Forecast Trends...20 3.2 Wafer StartForecast...21 4: Raw Material Economic Overview...22 4.1 Copper...23 4.2 Tantalum...25 4.3 Aluminum...27 4.4 Titanium Sponge...29 4.5 Tungsten...31 5: Supply Chain Update... 33 5.1 Copper Supply Tightens...34 5.2 Titanium...35 5.3 Tungsten China Update...36 6: Supply Chain Analysis & Pricing...37 6.1 Copper...44 6.2. Tantalum...46 6.3 Aluminum...48 6.4 Titanium...52 6.5 Tungsten...56 6.6 Other...60 6.7 Total...61 6.8 Cumulative Target Price Forecast...62 7: Technology Trends...64 7.1 Technology Updates...65 7.2 Cobalt Integration...66 7.3 Material Challenges...67 7.4 Beyond Copper...68 7.5 Approaches to Solve Barrier Problems.69 7.6 TSV...70 8: Regulatory Updates...72 8.1 Conflict Minerals: Dodd Frank...73 8.2 European Union (EU) Commission, Council and Parliament...77
Table of Contents, continued 9: Business Trends and Analysis...78 9.1 2013 Supplier Market Share...79 9.2 Target Production...80 9.3 Competitive Environment Cu & Al...82 9.4 Tungsten...83 9.5 Cobalt...84 9.6 Sn Update...85 9.7 Conflict Minerals...86 9.8 Precious Metals...87 9.9 Rare Earths...88 9.10 Summary...89 10: Supplier News and Profiles...90 10.1 Honeywell...91 10.2 JX Nippon...94 10.3 Praxair...97 10.4 Tosoh SMD...101 10.2 KFMI...105 10.3 Grikin...108 Appendix B: Raw Materials Process Overview...140 B.1 Copper: Process Overview...141 B.2 Tantalum: Process Overview...142 B.3 Aluminum: Process Overview 143 B.4 Titanium: Process Overview...144 A.5 Tungsten: Overview...145 Appendix C: China Perspective...146 C.1 China Perspective...147 Appendix D: Approaches to Solve Barrier Problems...148 D.1 Approaches to Solve Barrier Problems...149 Appendix E: Technology Trends...150 E.1 200mm devices...151 300mm devices...152 Limits of Barrier Thickness...154 Appendix A: Key Manufacturing Cost Drivers..114 A.1 Cost Components...115 A.2 Key Cost Drivers of Copper Targets...118 A.3 Key Cost Drivers of Tantalum Targets.. 122 A.4 Key Cost Drivers of Aluminum Targets...127 A.5 Key Cost Drivers of Titanium Targets...131 A.6 Key Cost Drivers of Tungsten Targets...135
List of Figures Figure 1.1: Sputtering Target Total Revenue...12 Figure 3.1: Wafer Starts by Device Type...19 Figure 3.2: Wafer Start Forecast...21 Figure 4.1: 2016 Global Cu Mine Production....23 Figure 4.2: 2015 Global Cu Consumption...24 Figure 4.3: 2015 Ta Mine Production.....25 Figure 4.4: 2015 Global Ta Metal Demand.....26 Figure 4.5: 2015 WW Al Production... 30 Figure 4.6: 2015 US Domestic Al Demand...28 Figure 4.7: 2016 Ti Sponge Production......29 Figure 4.8: 2016 Global Ti Sponge Demand.... 34 Figure 4.9: 2015 W Mine Production....31 Figure 4.10: 2015 Global W Metal Demand... 32 Figure 4.15: W Process Summary...38 Figure 6.3 : Cu Sputtering Target Revenue Forecast... 42 Figure 6.4: Ta Target Price Forecast...46 Figure 6.5 : Ta Sputtering Target Revenue Forecast.47 Figure 6.6: Al Target Price Forecast...50 Figure 6.7 : Al Sputtering Target Revenue Forecast. 51 Figure 6.8: Ti Target Price Forecast...54 Figure 6.9 : Ti Sputtering Target Revenue Forecast 55 Figure 6.11 W Target Price Forecast...58 Figure 6.10: W Sputtering Target Revenue Forecast...59 Figure 6.12: Other Sputtering Target Revenue Forecast.60 Figure 6.13: Sputtering Target Market Share by Application 61 Figure 6.14: Sputtering Target Cumulative Price Forecast..62 Figure 6.15: Sputtering Target Cumulative Revenue Forecast..63 Figure 6.1 Global growth in Cu: Changes and Surprise 40 Figure 6.2: Cu Target Price Forecast...42
List of Figures (Continued) Figure 7.1 Interconnect metallization Roadmap..66 Figure 7.2: Contact Resistance Comparison with Cobalt..67 Figure 7.3: TSV Middle Process v. Standard TSV Last Process...71 Figure 9.1: 2015Target Supplier Market Share...79 Figure 9.2a: 2014 Target Unit Production... 80 Figure 9.2b: 2019 Target Unit Production...80 Figure A.1: Copper Raw Material Cost Driver...118 Figure A.2: Copper Purification/Consolidation Cost Driver...119 Figure A.3: Copper Forming Cost Driver... 120 Figure A.4: Copper Machining and Bonding Cost...121 Figure A.5: Ta Raw Material Cost Driver.......122 Figure A.6: Ta Purification Cost Driver... 123 Figure A.7: Ta Consolidation Cost Driver... 124 Figure A.8: Ta Forming Cost Driver....125 Figure A.9: Ta Machining and Bonding Cost Driver 126 Figure A.10: Al Raw Material Cost Driver... 127 Figure A.11: Al Purification/Consolidation Cost Driver 128 Figure A.12: Al Forming Cost Driver... 129 Figure A.13: Al Machining and Bonding Cost Driver 130 Figure A.14: Ti Raw Material Cost Driver....131 Figure A.15: Ti Purification/Consolidation Cost Driver 132 Figure A.16: Ti Forming Cost Driver... 133 Figure A.17: Ti Machining and Bonding Cost Driver...134 Figure A.18: W Raw Material Cost Driver......135 Figure A.19: W Purification Cost Driver...,....136 Figure A.20: W Consolidation Cost Driver...137 Figure A.21: W Forming Cost Driver...138 Figure A.22: W Machining and Bonding Cost Driver...139 Figure B.1: Cu Process Summary..141 Figure B.2: Ta Process Summary..142 Figure B.3: Al Process Summary..143 Figure B.4: Ti Process Summary..144 Figure B.5: W Process Summary..145
List of Figures and Tables Figures (Continued) Figure C.1 China Target Market Share%...147 Figure E.1 5nm BEOL Approaches..153 Figure E.2 Barrier Limits. 154 Tables Table 6.1: CU Target Supplier Supply Chain Integration. 38 Table 6.2: Ta Target Supplier Supply Chain Integration....44 Table 6.3: Al Target Supplier Supply Chain Integration...48 Table 6.4: Ti Target Supplier Supply Chain Integration... 52 Table 6.5: W Target Supplier Supply Chain Integration... 56 Table 7.1: Alternatives to Cu, Resistivity Comparison. 68 Table 10.1: KFMI Target Specifications... 106 Table 10.2 Grikin Target Specifications....110 Table A.1: Process to Manufacture High Purity Grade Sputtering Targets....116