Schottky Barrier Diode RBR5L30B

Similar documents
Schottky Barrier Diode RBR10BM40A

Schottky Barrier Diode RB160VAM-40

Schottky Barrier Diode RB550VM-40

Schottky Barrier Diode RB161VAM-20

Schottky Barrier Diode RBR3LAM60B

Schottky Barrier Diode RBR3LAM30A

Schottky Barrier Diode RBR1LAM60A

Rectifier Diode RRE02VSM6S

Schottky Barrier Diode RBQ30TB45BHZ

2.6± ±0.1. Taping specifications (Unit : mm) 4.0± ±0.05 φ1.55± ± ±0.1 φ1.0± Duty 0.5

Schottky Barrier Diode RB168LAM150

Schottky Barrier Diode RBQ10BM65A

Schottky Barrier Diode RB160VA-40

Super Fast Recovery Diode RFU02VSM6S

Schottky Barrier Diode RB160MM-60

Super Fast Recovery Diode RF05VAM2S

Schottky Barrier Diode RB168MM-60

New Designs. Not Recommended for. Rectifier Diode 1SR Datasheet. Series Dimensions (Unit : mm) Land Size Figure (Unit : mm) Standard Rectifier

Schottky Barrier Diode BAS40-04HMFH

Ultra Low Capacitance ESD Protection Diode RSAC6.8CS 0.9± ±0.1. ROHM : VMN2 dot (year week factory)+ day

Schottky Barrier Diode BAS40-05HMFH

Rectifier Diode RR1VWM6STF

Schottky Barrier Diode RB098BM150FH

Super Fast Recovery Diode RFUS20NS6S. ROHM : LPDS JEITA : TO263S 1 Manufacture Year, Week and. Taping Dimensions (Unit : mm)

Super Fast Recovery Diode RF601BM2D

Super Fast Recovery Diode RF081M2S 1.6± ± ± ±0.1. ROHM : PMDU JEITA : SOD : Manufacture Date. Taping Dimensions (Unit : mm)

Rectifier Diode 1SR TF

BAW56HM Switching Diode (High speed switching)

Rectifier Diode RR1VWM6S

Rectifier Diode RR268MM-600

Schottky Barrier Diode RBQ20BM65AFH

Rectifying Diode RR264M-400

BAS16HM Switching Diode (High speed switching)

RB060LAM-40 Schottky Barrier Diode

Rectifying Diode RR1LAM6S

New Designs. Not Recommended for. DAN222 Switching Diode (High speed switching) Data sheet. Outline V RM 80 V. I FM 300 ma. I o 100 ma.

Schottky Barrier Diode BAT54SHMFH

New Designs. Not Recommended for. RN142ZS PIN Diodes. Data sheet. Outline V R 30 V. I F 50 ma. C t 0.45 pf. rf 2.5 Ω

Ultra Low Capacitance ESD Protection Diode RSAC16CS

New Designs. Not Recommended for. ESD Protection Device (TVS) RSA12M. RSA12M Diodes 1/2

RN142S PIN Diodes Outline V R 60 V SOD-523 EMD2 SC-79

Super Fast Recovery Diode RFN2LAM6S

Super Fast Recovery Diode RF201LAM2S

Schottky Barrier Diode RB095BM-60

New Designs. Not Recommended for. DAN202UFH Switching Diode (High speed switching) (AEC-Q101 qualified) Data sheet. Outline V RM 80 V.

Super Fast Recovery Diode RF505BM6S

PDZV24A Zener Diode. Data sheet. Inner Circuit. P D 1000 mw. Features High reliability Small power mold type. Inner Circuit

DA204U Switching Diode

New Designs. Not Recommended for. GDZ5.6 Zener Diode. Data sheet. Outline. P D 100 mw. Inner Circuit. Feature High reliability Super small mold type

Schottky Barrier Diode BAT54CHMFH

DA204K Switching Diode

1SS400G Switching Diode (High speed switching)

DAN217UMFH Switching Diode (High speed switching)

BAV70HM Switching Diode (High speed switching)

DAP202K Switching Diode (High speed switching)

1.25± ± ±0.05. Taping specifications (Unit : mm) 4.0± ± ± ±0.1 φf1.05. V F

CDZV3.3B Zener Diode. Data sheet. Outline. P D 100 mw. Feature High reliability Small mold type. Inner Circuit. Application

RB751VM-40 Schottky Barrier Diode

Switching Diode BAS21VM

EMP11 Switching Diode (High speed switching)

RB521VM-40 Schottky Barrier Diode

1.0± ± ±0.1. ROHM : PMDU JEDEC :SOD-123 Manufacture Date. Taping specifications (Unit : mm) 4.0± ±0.05 φf

ESD Protection Diode RSA6.1U5

1SS380VM Switching Diode (Low leakage)

New Designs. Not Recommended for. DA221M Switching Diode. Data sheet. Outline V RM 20 V. I FM 200 ma. I o 100 ma. I FSM 300 ma

DAN217FH Switching Diode (High speed switching)

RB088LAM150TF Schottky Barrier Diode

New Designs. Not Recommended for. DAN222M Switching Diode (High speed switching) Data sheet. Outline V RM 80 V. I FM 300 ma. I o 100 ma.

UMR12N Switching Diode

CDZFH13B Zener Diode (AEC-Q101 qualified) Outline

Bi-Directional Zener Diodes

RESD1CANFH Transient Voltage Suppressor (AEC-Q101 qualified) Data sheet

Schottky Barrier Diode

AEC-Q101 Qualified Application Dimensions (Unit : mm) Land size figure (Unit : mm) High frequency switching 1.6± ± ± ±0.

Schottky Barrier Diode RB522ES-30

RB088NS100 Schottky Barrier Diode

YDZVFH18 Zener Diode. (AEC-Q101 qualified) Data sheet. Outline. P D 500 mw. Features High reliability Small mold type. Inner Circuit.

New Designs. Not Recommended for. Super Fast Recovery Diode. Data Sheet RFUS20TM4S. 1/ Rev.A. Series Dimensions (Unit : mm) Structure

1SS355VMFH Switching Diode (High speed switching)

Linear Regulator Application Information

Super Fast Recovery Diode

New Designs. Not Recommended for. Schottky barrier diode. Data Sheet RB520CS-30. 1/ Rev.D

BZX84B5V1L Zener Diode

New Designs. Not Recommended for. Schottky barrier diode RB162M-40. Data Sheet C C. 1/ Rev.B

New Designs. Not Recommended for. ESD Protection diode. 1/ Rev.A RSB6.8CS. Land size figure (Unit : mm)

KDZTF24B Zener Diode (AEC-Q101 qualified) Outline

ROHM : UMD3F dot (year week factory) Taping dimensions (Unit : mm) 2.0± ± ± ±0.08. A mw/total C C

VS15VUA1LAM Transient Voltage Suppressor

AEC-Q101 Qualified Application External dimensions (Unit : mm) Structure Switching power supply 10.0± ± ± ±

New Designs. Not Recommended for. Super Fast Recovery Diode. Data Sheet RFX10TF6S. 1/ Rev.A. Series Dimensions (Unit : mm) Structure

Transient Voltage suppressor (AEC-Q101 qualified) Outline

Bi direction ESD Protection Diode

Transient Voltage suppressor (AEC-Q101 qualified) Outline

Schottky Barrier Diode RB080L-30

Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV e

Bi direction ESD Protection diode

New Designs. Not Recommended for. TFZ11B Zener Diode Data sheet Outline P D 500 mw TUMD2. Feature High reliability Small mold type.

STZU6.2N Transient Voltage Suppressor

UDZVFH18B Zener Diode (AEC-Q101 qualified) Outline

1.6± ± ± ±0.1 JEDEC :SOD-123 Manufacture Date ROHM : PMDU. Taping dimensions (Unit : mm) 4.0± ±0.05 φ 1.55±0.

Transcription:

Schottky Barrier Diode RBR5L3B Application Dimensions (Unit : mm) Land Size Figure (Unit : mm) General rectification 2.6±.5 2. 2. 5.3±..5 9.5±. 5.5±.5 2±.2.75±. Features ) Small power mold type (PMDS) 2) High reliability 3) Low V F 2.5±.2 4.5±.2 2.±.2.2±.3.±.2 5.±.3 PMDS Structure 4.2 Cathode Construction Silicon epitaxial planar type ROHM : PMDS JEDEC : SOD-6 2 : Manufacture Date Taping Dimensions (Unit : mm) 4.±. 2.±.5 f φ.55±.5 Anode.3 2.9±. 4.±. f φ.55 2.8MAX Absolute Maximum Ratings (T c = 25 C) Parameter Symbol Conditions Limits Unit Repetitive peak reverse voltage V RM Duty.5 3 V Reverse voltage V R Direct reverse voltage 3 V Average forward rectified current I o Glass epoxy board mounted, 6Hz half sin wave, Non-repetitive forward current surge peak I FSM resistive load, T c =69ºC Max. 6Hz half sin wave, one cycle, non-repetitive at T a =25ºC 5 A 5 A Operating junction temperature T j - 5 C Storage temperature T stg - -55 to +5 C Electrical Characteristics (T j = 25 C) Parameter Symbol Conditions Min. Typ. Max. Unit Forward voltage V F I F =5.A - -.49 V Reverse current I R V R =3V - - 5 ma 25 ROHM Co., Ltd. All rights reserved. /5 25.4 - Rev.A

RBR5L3B Electrical Characteristic Curves FORWARD CURRENT : I F (A). T j = 5 C T j = 25 C T j = 75 C T j = 25 C T j = -25 C REVERSE CURRENT : I R (ma). T j = 5 C T j = 25 C T j = 75 C T j = 25 C T j = -25 C. 2 3 4 5 6 7. 2 3 FORWARD VOLTAGE : V F (mv) V F -I F CHARACTERISTICS REVERSE VOLTAGE : V R (V) V R -I R CHARACTERISTICS CAPACITANCE BETWEEN TERMINALS : C t (pf) T j = 25 C f = MHz FORWARD VOLTAGE : V F (mv) 46 455 45 445 44 435 43 425 42 45 Ave. : 429mV T j =25 C I F =5.A n=3pcs 5 5 2 25 3 4 REVERSE VOLTAGE : V R (V) V R -C t CHARACTERISTICS V F DISPERSION MAP 25 ROHM Co., Ltd. All rights reserved. 2/5 25.4 - Rev.A

RBR5L3B Electrical Characteristic Curves REVERSE CURRENT : I R (ma) 65 6 55 5 45 Ave. : 46mA T j =25 C V R =3V n=3pcs CAPACITANCE BETWEEN TERMINALS : C t (nf).5.4.3.2. Ave. :.9nF T j =25 C f=mhz V R =V n=pcs 4 I R DISPERSION MAP C t DISPERSION MAP PEAK SURGE FORWARD CURRENT : I FSM (A) 5 4 3 2 I FSM Ave. : 88A cyc 8.3ms T a =25 C REVERSE RECOVERY TIME : t rr (ns) 3 25 2 5 5 Ave. : 7ns T j =25 C I F =.5A I R =.A I rr / I R =.25 n=pcs I FSM DISPERSION MAP t rr DISPERSION MAP 25 ROHM Co., Ltd. All rights reserved. 3/5 25.4 - Rev.A

RBR5L3B Electrical Characteristic Curves 25 4 PEAK SURGE FORWARD CURRENT : I FSM (A) 2 5 5 I FSM 8.3 ms cyc 8.3 ms T a =25 C PEAK SURGE FORWARD CURRENT : I FSM (A) 35 3 25 2 5 5 I FSM time cyc T a =25 C NUMBER OF CYCLES I FSM -CYCLE CHARACTERISTICS TIME : t (ms) I FSM -t CHARACTERISTICS TRANSIENT THERMAL IMPEDANCE : R th ( C/W) R th(j-a) R th(j-c) Glass epoxy board mounted IM=mA time ms 3ms.... TIME : t (s) R th -t CHARACTERISTICS I F =5.A FORWARD POWER DISSIPATION : P F (W) 3.5 3 2.5 2.5.5 Sin(θ=8) D = /2 T j = 5 C DC 2 4 6 8 AVERAGE RECTIFIED FORWARD CURRENT : I o (A) I o -P F CHARACTERISTICS 25 ROHM Co., Ltd. All rights reserved. 4/5 25.4 - Rev.A

RBR5L3B Electrical Characteristic Curves REVERSE POWER DISSIPATION : P R (W) 4 3 2 DC D = /2 Sin(θ=8) T j = 5 C AVERAGE RECTIFIED FORWARD CURRENT : I o (A) 4 2 8 6 4 2 DC Glass epoxy board mounted I O A V V R t T D=t/T V R =V RM /2 T j =5 C Sin(θ=8) 2 3 D = /2 25 5 75 25 5 REVERSE VOLTAGE : V R (V) V R -P R CHARACTERISTICS AMBIENT TEMPERATURE : T a ( C) DERATING CURVE (I o -T a ) AVERAGE RECTIFIED FORWARD CURRENT : I o (A) 4 2 8 6 4 2 DC D = /2 Sin(θ=8) Glass epoxy board mounted I O A V V R t T D=t/T V R =V RM /2 T j =5 C ELECTROSTATIC DISCHARGE TEST : ESD (kv) 3 25 2 5 5 Ave. : 9.9kV No destruction at 3kV 25 5 75 25 5 CASE TEMPERATURE : T c ( C) DERATING CURVE (I o -T c ) C=2pF R=W C=pF R=.5kW ESD DISPERSION MAP 25 ROHM Co., Ltd. All rights reserved. 5/5 25.4 - Rev.A

Datasheet Notice Precaution on using ROHM Products. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note ), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( Specific Applications ), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM s Products for Specific Applications. (Note) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E 25 ROHM Co., Ltd. All rights reserved. Rev.

Datasheet Precautions Regarding Application Examples and External Circuits. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E 25 ROHM Co., Ltd. All rights reserved. Rev.

Datasheet General Precaution. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an as is basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice WE 25 ROHM Co., Ltd. All rights reserved. Rev.