Fluxes for ball attach process
Yield loss in ball attach production lines remains a main issue. At the time the market has switched to lead free ball attach processes and due to increasing expectations for package reliability, Umicore is in the position to offer the industry advanced material solutions. Umicore can offer a perfect system, adjusted to the needs of the industry. State of the art solder balls and outstanding Tacky Flux Series. Quality Focus As part of our commitment to highest quality standards, Umicore quality management system (QMS) is certified in accordance with ISO/TS16949:2002. Umicore QMS will consequently strive to a defect prevention and insures a stable and good workability of supplied materials. Continuous improvement processes and customer focus are part of the philosophie. Umicore is used to assist customers in process troubleshooting and to co-operate in new product development. Umicores Business Line Microbond-Electronic Packaging Materials with an awarded quality system for their worldwide operations- sets the standard in its Industry. Microbond is where the market is. With three locations for the Flux production worldwide, with regional R&D operations and a close to our customer newtork for Applied Technology and Sales.
Microbond Tacky Fluxes 500 Flux viscosity [kcps] 450 WS Viscosity [kcps] NC Viscosity [kcps] 400 350 300 250 200 150 100 50 opening time [hours] 0 0 20 40 60 80 100 120 140 160 Viscosity in relation to opening time (23 C; 55% RH) Watersoluble (WS) & No Clean (NC) Series Blue or Amber colored for easy detection Customized viscosity range and activation Perfect tackiness Designed for Pin Transfer, Ball dipping and printing processes High thermo stability Excellent wetting results with Pb-free alloys, like SAC or Castin on bare Copper (OSP) and Au/Ni substrates Superior shear strength results due to perfect intermetallic phases Viscosity [kcps] 450 400 350 300 250 WS Viscosity [kcps] NC Viscosity [kcps] 200 150 100 50 0 17 18 19 20 21 22 23 24 25 26 27 Temperature [ C] Viscosity in relation to temperature 250 Tackiness [g] 200 WS Tackyness [g] NC Tackyness [g] 150 100 50 Opening time [hours] 0 0 20 40 60 80 100 120 140 160 Tackiness in relation to opening time (23 C; 55% RH) Technical Properties WSD3810 Applicable for Pin Transfer, Ball dipping & Printing Processes Fineness of grain (Grindometer) < 30 µm Viscosity (Brookfield-Helipath RVT DVII, spindle E95, 5rpm 23 C) Standard Values: 150 +/- 50 kcps 350 +/- 50 kcps 650 +/- 50 kcps adjustable to customers process requirements
Halidefree, meets ANSI/J-STD004, classification ORLO Suitable for Pb-free as well as Pb containing solder balls Designed for bare copper (OSP) and Au/Ni substrates Neutral flux smell Residues after reflow are completely soluble with water (50-60 C) blue or amber colored Advanced Flux Properties of WSA3810 Microbond Tacky Flux WSA 3810 with advanced halide free activation that meets ANSI/J-STD-004 classification ORL0. It is suited for attaching solder spheres containing standard alloys SnPb36Ag2 or SnPb37 and lead-free alloys SnAg3,5; SnAg4Cu0,5 or SnAg2,5Cu0,75Sb0,5 (Castin258 ). The flux viscosity is designed for pin transfer, ball dipping and printing processes. Good tack with superior open times and the ease of water cleaning give Microbond s flux a distinct advantage. Optimized ability to reduce metal oxides Fineness of grain (Grindometer) < 30 µm Viscosity (Brookfield-Helipath RVT DVII, spindle E95, 5rpm 23 C) Standard Values: 150 +/- 50 kcps 350 +/- 50 kcps 650 +/- 50 kcps adjustable to customers process requirements Suitable for Pb-free as well as Pb containing solder balls Designed for bare copper (OSP) and Au/Ni substrates Neutral flux smell Residues after reflow are completely soluble with water (50-60 C) blue or amber colored
NC 5115 Application Microbond Tacky Flux NC 5115 is halide free and meets ANSI/J-STD-004 classification as an ORL0 flux. It is suited for both lead-free and standard BGA solder alloys because of its excellent thermo stability. It has a designed viscosity for pin transfer or ball dipping as well as for printing processes. The excellent tackiness ensures an exact positioning of BGA solder spheres and the advanced flux chemistry produces perfect solder joints with excellent shear strength results. Residues after reflow passes corrosion and SIR requirements according to ANSI/J-STD 004 and can remain on the board. After reflow the flux residues are nearly colorless. In case cleaning is required, common solvents and equipment are suitable. The excellent properties of Microbond Tacky Fluxes ensure that the flux will not settle or separate during storage. The fluxes are adjusted for pin transfer, ball dipping and printing processes. Reflow peak temperature should be 195-220 C and 20-60 sec above melting point for standard applications. Recommended reflow peak temperature for Pb-free alloys should be 240-250 C for 20-70 sec. The fluxes are suitable for all standard reflow-soldering processes (IR or convection oven). Fineness of grain (Grindometer) < 30 µm Viscosity (Brookfield-Helipath RVT DVII, spindle E95, 5rpm 23 C) Standard Values: 250 +/- 50 kcps adjustable to customers process requirements Suitable for Pb-free as well as Pb containing solder balls Designed for bare copper (OSP) and Au/Ni substrates Neutral flux smell amber colored Packaging & Shelf Life The flux will be delivered in sealed polyethylene cartridges / syringes filled with 150 g. Other packing systems are available on request. Shelf life of the original packed flux is 12 months after production date, even in a fridge or at room temperature.
Germany Umicore AG & Co. KG Rodenbacher Chaussee 4 P.O. Box 1351 63403 Hanau (Wolfgang) Germany Phone: +49 (6181) 59-5317 Fax: +49 (6181) 59-5160 USA Umicore Precious Metals NJ, LLC Microbond EPM Division 3420 Tarheel Drive, Suite 100 Raleigh, NC 27609 USA Phone: +1 (919) 876-9971 Fax: +1 (919) 876-9975 Singapore Umicore Precious Metals (Singapore) Pte. Ltd. No. 2, Corporation Road, #06-16/17 Corporation Place (Lobby A) Singapore 618494 Phone: +65 6898 3936 Fax: +65 6265 7118 Japan Umicore Precious Metals Japan Co., Ltd. 2-3, Kita-Aoyama 1-Chome, Aoyama Building 5F, Minato-ku, Tokyo, 157-0061 Japan Phone: +81 (3) 5413 9356 Fax: +81 (3) 5413 9313 China Umicore Marketing Services Hong Kong Ltd. 19/F, Unit A, Manulife Tower 169, Electric Road, G.P.O. Box 100 05 North Point, Hong Kong Phone: +852 2 2700 2020 Fax: +852 2 2807 2440 Umicore Marketing Services (Shanghai) Co., Ltd. Unit A1, 18/F, Zao-Feng Universe Building, No. 1800 West Zhongshan Road, Shanghai 200233, P.R. China Phone: +86 (21) 6440 1100-216 Fax: +86 (21) 6888 0088 www.microbond.de The information and statements contained herein are provided free of charge. They are believed to be accurate at the time of publication, but Umicore makes no warranty with respect thereto, including but not limited to any results to be obtained or the infringement of any propietary rights. Use or application of such information or statements is at user s sole discretion, without any liability on the part of Umicore. Nothing herein shall be construed as a license of or recommendation for use which infringes upon any proprietary rights. All sales are subject to Umicore s General Conditions of Sale and Delivery. 2004 Umicore AG & Co. KG. Printed in the Federal Republic of Germany.