ThunderClad 2 TU-883 HF Very Low Loss Material Laminates & Prepregs Mass Lamination Service Insulated Metal Substrate Materials
TUC Product Roadmap 2 ULVP VLP HCF Ultra Low Void Prepreg Very Low Profile Copper Foil Heavy Cu foil (max. 12 oz) LDP Laser Drillable Prepreg UTC Ultra-Thin Core (1mil) ZBC Buried Capacitance D+9 DS within +/-100 ppm Super Low Loss CCL / ThunderClad 3 HF Low Loss CCL / ThunderClad 1 --- Df 0.008 @ 1GHz / Low Signal Loss Board HF Mid-Tg Low Dk / TU-787 LK --- Dk 3.4, Df 0.0025@10GHz / High Speed / RF HF Very Low Loss / ThunderClad 2 --- Df 0.0050 @ 10GHz / Excellent Signal Integrity --- Dk 3.2 ; Df < 0.010 / Anylayer HF High Reliability CCL / TU-865 --- Hi-Tg Low CTE / Harsh Environment High Thermal Reliability Green Materials Low Loss Lead Free Process Compatibility 10 cycles 6 cycles TU-768/768 F (Tg180) TU-662/668 (Tg150) --- high Layer Count/ High density Multi-layer Board TU-722 (Tg180) ---High Layer Count/ High Density Multi-layer Board TU-862 HF (Tg180) TU-84P NF --- Rigid-Flex TU-747 LK (Tg150) TU-747 HF (Tg150) --- Mid-Loss --- Low Dk / Any-layer ---Consumer / HP / NB High Speed / Low Dk/Df TU-872 SLK / SLK Sp Low Dk/Df Laminate TU-872 LK IMS ---High Speed /Low Signal Loss Board Insulated Metal Substrate TU-322 / TU-362 / TU-351 --- 2 W/mK / 1 W/mK
ThunderClad 2 3 TU-883 / HF Very Low Loss Material Design for high speed digital / RF application Lead-free process compatible Build-up with either E-glass or NE-glass Build-up with RTF or VLP foil Flat Dk / Df varied with frequency Dk=3.6@10GHz ; Df=0.0049@10GHz (1080 GF ) Tg = 210 o C (DMA) Status : Sample stage / ready for PCB/OEM evaluation.
ThunderClad 2 4 Type Performance Tg, (DSC), C Tg, (DMA), C Tg, (TMA), C Td, (TGA, 5%wt loss) C ThunderClad 2 TU-883 180 210 170 410 TU-872 SLK 200 220 190 340 Z-axis Expansion, (25-260 C), % 2.5 2.3 Dk @ 1GHz ( SPC method ) / (1080 GF) Df @ 1GHz ( SPC method ) / (1080 GF) 3.6 0.0033 3.7 0.0082 Flammability, UL94 94V-0 94-V0 Peel strength (1oz), lb/in 4~6 5~7 T-260, min T-288, min >60 >60 60 20 PCT/1hr/Dip (288 C), sec >180 >120
Viscosity ( Pa.s ) Rheology 5 1.E+06 TU-883 Heat Rise Rate : 2.0 deg C/min 1.E+05 1.E+04 1.E+03 1.E+02 80 100 120 140 160 180 Temperature ( degc )
Dk Propagation 6 4.15 4.00 3.85 Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz TU-872 SLK MLS TU-883 VSP TU-883 MLS Competitor-M 3.70 3.55 3.40 0 4 8 GHz 12 16 20
Insertion Loss Construction & Foil 7
Dk Phase Constant - Temperature 4.5 4.2 Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz 3.9 TU-872 @ 15 GHz 3.6 TU-883 @ 15 GHz 3.3 3.0-50 -30-10 10 degc 30 50 70 90 Two-line method
Loss db/in Loss [db/in] Insertion Loss - Temperature 0.0-0.5 4 GHz 8 GHz -1.0 TU-872 SLK @ 15 GHz 15 GHz -1.5-2.0 Cu H oz 2116 x 1 Cu H oz 2116x1 Cu H oz -2.5-50 -30-10 10 30 50 70 90-3.0 degc 0.0-0.5-1.0-1.5-2.0-3.5-4.0-4.5 Two-line method 0 2 4 6 8 10 12 14 16 18 20 Freq. [GHz]
Thermal Reliability (case 1) 26L 10 Material : ThunderClad 2 (TU-883) Layer count : 26 layer Board Thickness : 3.2 mm 2 oz copper foil : x 4 layers Pitch design : 0.65, 0.8 & 1.0 mm Drilling hole size : 0.3 mm Pattern design : x 4 types ( D1 ~ D4 ) Test criteria : 260 o C, reflow 10X & 288 o C solder float x6
Thermal Reliability (case 1) 26L 11 L1 H oz PP 2116HRC 1 L2/3 3mil 1/1 PP 2116HRC 1 L4/5 3mil 1/1 PP 2116HRC 1 L6/7 3mil 1/1 PP 2116HRC 1 L8/9 3mil 1/1 PP 2116HRC 1 L10/11 3mil 1/1 PP 106HRC 2 L12/13 6mil 2/2 (2ply) PP 106HRC 3 L14/15 6mil 2/2 (2ply) PP 106HRC 2 L16/17 3mil 1/1 PP 2116HRC 1 L18/19 3mil 1/1 PP 2116HRC 1 L20/21 3mil 1/1 PP 2116HRC 1 L22/23 3mil 1/1 PP 2116HRC 1 L24/25 3mil 1/1 PP 2116HRC 1 L26 H oz
Thermal Reliability 0.8 mm / Solder 6x 12 Solder 6x D2 design D3 design
Thermal Reliability 0.65 mm / Solder 6x 13
Thermal Reliability 1.0 mm / reflow 10x 14 Reflow 10x Pitch 1.0 mm D2 design Reflow 10x D3 design Pitch 1.0 mm
Thermal Reliability 0.8 mm / reflow 10x 15 Reflow 10x Reflow 10x D3 design Pitch 0.8 mm D2 design Pitch 0.8 mm
Thermal Reliability 0.65 mm / reflow 10x 16 Reflow 10x Reflow 10x D3 design Pitch 0.65 mm D2 design Pitch 0.65 mm
Thermal Reliability (case 1) : 26L 17 Design / stress Solder 6x Pitch 1.0 mm Pitch 0.8 mm Pitch 0.65 mm D1 D2 D3 D4 D1 D2 D3 D4 D1 D2 D3 D4 Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass reflow 10X Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass No delamination No crack No ICD No Pad Lifting
Thermal Reliability (case 2) 24L 18 Material : ThunderClad2 (TU-883) Layer count : 24 layer Board Thickness : 3.3 mm 2 oz copper foil : x 4 layers Pitch design : 0.5, 0.65, 0.8 & 1.0 mm Drilling hole size : 0.3 mm Pattern design : enclosed design Test criteria : 260 o C, reflow 8x, 288 o C solder float x10
Thermal Reliability (case 2) 24L 1 Stack-up Org. P/P Thick Cu Remaining % Thickness Predicted Thickness L1 H 1.5 1.900 Prepreg 3313 RC57 4.5 3.974 3.974 L2 H 0.7 19 0.700 Core 3313X1 4 4.000 4.000 L3 H 0.7 19 0.700 Prepreg 2116 RC57 5.5 4.440 4.440 L4 H 0.7 18 0.700 Core 3313X1 4 4.000 4.000 L5 H 0.7 17 0.700 Prepreg 1067 RC70 2.5 1.960 Prepreg 1067 RC70 2.5 1.980 3.940 L6 H 0.7 20 0.700 Core 3313X1 4 4.000 4.000 L7 H 0.7 19 0.700 Prepreg 106 RC75 2.5 1.974 Prepreg 106 RC75 2.5 1.434 3.408 L8 1 1.35 18 1.370 Core 3313X1 4 4.000 4.000 L9 1 1.35 17 1.370 Prepreg 1078 RC67 3.4 2.321 Prepreg 106 RC75 2.5 2.500 6.115 1080 RC67 3.4 1.294 L10 2 2.7 19 2.700 Core 3313X1 4 4.000 4.000 L11 2 2.7 19 2.700 Prepreg 1080 RC67 3.4 1.294 Prepreg 106 RC75 2.5 2.500 6.102 1078 RC67 3.4 2.308 L12 1 1.35 16 1.350 Core 3313X1 4 4.000 4.000 L13 1 1.35 16 1.350 Prepreg 1078 RC67 3.4 2.308 Prepreg 106 RC75 2.5 2.500 6.050 1080 RC67 3.4 1.242 L14 2 2.7 17 2.700 Core 3313X1 4 4.000 4.000 L15 2 2.7 17 2.700 Prepreg 1080 RC67 3.4 1.242 Prepreg 106 RC75 2.5 2.500 6.063 1078 RC67 3.4 2.321 L16 1 1.35 17 1.350 Core 3313X1 4 4.000 4.000 L17 1 1.35 18 1.350 Prepreg 106 RC75 2.5 1.434 Prepreg 106 RC75 2.5 1.974 3.408 L18 H 0.7 19 0.700 Core 3313X1 4 4.000 4.000 L19 H 0.7 19 0.700 Prepreg 1067 RC70 2.5 1.974 Prepreg 1067 RC70 2.5 1.960 3.934 L20 H 0.7 17 0.700 Core 3313X1 4 4.000 4.000 L21 H 0.7 18 0.700 Prepreg 2116 RC57 5.5 4.440 4.440 L22 H 0.7 19 0.700 Core 3313X1 4 4.000 4.000 L23 H 0.7 20 0.700 Prepreg 3313 RC57 4.5 3.980 3.980 L24 H 1.5 1.900 Thickness 151.5 130.994 19
Reliability : Solder float / x-section 20 Pitch: 0.8mm Hole : 0.3mm Solder Float@288C x10 : Pass 50x 100x
Reliability : Solder float / x-section 21 Pitch: 0.65mm Hole : 0.3mm Solder Float@288C x10 : Pass 50x 100x
Reliability : reflow / x-section 22 Pitch: 0.80mm Hole : 0.3mm IR Reflow @260C x 8 (> 255C, 20-30sec) : Pass 50x 100x
Reliability : reflow / x-section 23 Pitch: 0.65mm Hole : 0.3mm IR Reflow @260C x 8 (> 255C, 20-30sec) : Pass 50x 100x
Thermal Reliability (case 2) : 24L 24 Design / stress Pitch 1.0 mm Pitch 0.8 mm Pitch 0.65 mm Pitch 0.50mm Solder 10x Pass Pass Pass Pass reflow 8X Pass Pass Pass Pass No De-lamination No crack No ICD No Pad Lifting
Thermal Reliability (case 3) 30L 25 Material : ThunderClad2 (TU-883) Layer count : 30 layer Board Thickness : 3.6 mm 2 oz copper foil : x 4 layers Pitch design : 1.0 mm Drilling hole size : 0.3 mm Test criteria :288 o C solder float x8 L1 1 oz 106RC75x2 L2/L3 2mil 1/1 1067x1 RTF L4/L5 3mil H/H 1078x1 RTF L6/L7 3mil H/H 1078x1 RTF L8/L9 3mil H/H 1078x1 RTF L10/L11 3mil H/H 1078x1 RTF L12/L13 4mil 1/2 1067x2 RTF 1080RC63x2 L14/L15 4mil 2/2 1067x2 RTF x2 L16/L17 4mil 2/2 1067x2 RTF 1078RC67x2 L18/L19 4mil 2/1 1067x2 RTF L20/L21 3mil H/H 1078x1 RTF L22/L23 3mil H/H 1078x1 RTF L24/L25 3mil H/H 1078x1 RTF L26/L27 3mil H/H 1078x1 RTF L28/L29 2mil 1/1 1067x1 RTF 106RC75x2 L30 1 oz
Thermal Reliability (case 4) 30L 26 After 8x 10sec 288C Solder Float 1.0mm pitch
Thermal Reliability (case 3) : 30L 27 Design / stress Solder 8x Pitch 1.0 mm Pass No De-lamination No crack No ICD No Pad Lifting
Thermal Reliability (case 4) 30L 28 Material : ThunderClad2 (TU-883) Layer count : 30 layer Board Thickness : 3.6 mm 2 oz copper foil : x 4 layers Pitch design : 0.8, 0.7 mm Drilling hole size : 0.3 mm Test criteria :288 o C solder float x8 L1 1 oz 106RC75x2 L2/L3 2mil 1/1 1067x1 RTF L4/L5 3mil H/H 1078x1 RTF L6/L7 3mil H/H 1078x1 RTF L8/L9 3mil H/H 1078x1 RTF L10/L11 3mil H/H 1078x1 RTF L12/L13 4mil 1/2 1067x2 RTF 1080RC63x2 L14/L15 4mil 2/2 1067x2 RTF x2 L16/L17 4mil 2/2 1067x2 RTF 1078RC67x2 L18/L19 4mil 2/1 1067x2 RTF L20/L21 3mil H/H 1078x1 RTF L22/L23 3mil H/H 1078x1 RTF L24/L25 3mil H/H 1078x1 RTF L26/L27 3mil H/H 1078x1 RTF L28/L29 2mil 1/1 1067x1 RTF 106RC75x2 L30 1 oz
Thermal Reliability (case 4) 30L 29 20 A 0.7 20 B 0.7 30 A 0.8 30 B 0.8 matrix hole 20x20 20x20 30x30 30x30 pitch 0.7mm 0.7mm 0.8mm 0.8mm drilling bit size 0.25 mm
Thermal Reliability (case 4) 30L 30 After 8x 10sec 288C Solder Float 0.7mm pitch design A 0.7mm pitch design B
Thermal Reliability (case 4) 30L 31 After 8x 10sec 288C Solder Float 0.8mm pitch design A 0.8mm pitch design B
Thermal Reliability (case 5) : 24L 32 Design / stress Pitch 0.8 mm design A Pitch 0.8 mm design B Pitch 0.7 mm design A Pitch 0.7 mm design A Solder 8x Pass Pass Pass Pass No De-lamination No crack No ICD No Pad Lifting
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