3D inkjet printing of conductive structures using in-situ IR sintering

Similar documents
Photonic Drying Pulsed Light as a low Temperature Sintering Process

Organic Substrate - LCP

Nano Ag Conductive Ink

VISION INNOVATE INSPIRE DELIVER

Bonding Pad Fabrication for Printed Electronics Using Silver Nanoparticles

Manipulation and control of spatial ALD layers for flexible devices. Aimcal Memphis 2016; Edward Clerkx

OPTIMISED CURING OF SILVER INK JET BASED PRINTED TRACES

Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015

Photonic Curing and Soldering

Advanced Inkjet Capabilities: Challenging Screen-Print Performance. Vahid Akhavan, Ph.D. Senior Application Engineer June 21 st, 2017

Novel Conductive Inks For 3D Printing

High Speed Sintering for 3D printing applications

Hybrid AM With Functional Printing. Denis Cormier Rochester Institute of Technology Department of Industrial and Systems Engineering

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials

Carbon Nanotube Solutions for Packaging and Wireless Sensors

Advances in Printing nano Cu and Using Existing Cu Based Manufacturing Processes. Michael J. Carmody Chief Scientist, Intrinsiq Materials

Laser Micromachining of Bulk Substrates and Thin Films Celine Bansal

Embedding of Active Components in LCP for Implantable Medical Devices

Multiphoton lithography based 3D micro/nano printing Dr Qin Hu

Synthesis, Characterization, and Isolation of Metal Precursor Inks

Challenges for Embedded Device Technologies for Package Level Integration

ROLL-TO-ROLL PLATFORM FOR THE DEVELOPMENT OF FUNCTIONAL FLEXIBLE PRODUCTS. 14 th AM Platform Meeting Brussels June 2014

Dhanaji Bhosale 1, Mahesh Wagh 2, Nilkanth Shinde 3

Innovative Roll-to-Roll Equipment & Material Development Suite

Advances in Intense Pulsed Light Solutions For Display Manufacturing. XENON Corporation Dr. Saad Ahmed Japan IDW 2016

Aerosol Jet International User Group Meeting. Metallization and Functional Structures by Aerosol Jet deposition

CREOL, The College of Optics & Photonics, University of Central Florida

Nano- And Micro-Filled Conducting Adhesives For Z-axis Interconnects

Inkjet. A microtool for Nanotechnology

Printed Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum

Chapter 2 Capacitive Sensing Electrodes

Polymer Thick Film Paste & Material Compatibility Discussion

Developments in Printed Electronics

Printed Electronics: Photonic Curing and Enabled Materials

Nanoscale Conformable Coatings for Enhanced Thermal Conduction of Carbon Nanotube Films

ENTEK Membranes LLC Lebanon, Oregon USA

Flexible functional devices at mass production level with the FLEx R2R sald platform

Nanocoating close to the market

PEC (Printed Electronic Circuit) process for LED interconnection

Supplementary Figure S1 Photograph of MoS 2 and WS 2 flakes exfoliated by different metal naphthalenide (metal = Na, K, Li), and dispersed in water.

Advanced Applications for Inorganic Nanomaterials

Electrical and Fluidic Microbumps and Interconnects for 3D-IC and Silicon Interposer

ENS 06 Paris, France, December 2006

Three-Dimensional Molded Interconnect Devices (3D-MID)

Soldermasks - Processes and Properties

Compact hybrid plasmonic-si waveguide structures utilizing Albanova E-beam lithography system

Polymer Nanocomposites, Printable and Flexible Technology for Electronic Packaging

During solution evaporation, there are two major competing evaporation-driven effects, coffee ring effect and Marangoni flow.

Sheet Resistance Anisotropy in Transparent Conductive Films Containing Silver Nanowires

High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices

LASER MICROMACHINING A New Tool for Precision Engineers

Electronics from the Printing Press

Processing Biodegradable Polycaprolactone through 3D Printing Abstract: 1. INTRODUCTION

Supporting Information

Overview of Pixelligent s OLED Lighting Program

We get small. Micron-scale Circuits and Structures from Prototype through Production

Laser treatment of gravure-printed ITO films on PET

Motivation: Biofunctional Composite Nanoparticles

Optimization of ZnO Seed Layer for Growth of Vertically Aligned ZnO Nanorods on Glass Surface

Dispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate

10 Manor Parkway, Suite C Salem, New Hampshire

Innovative Laser Processing Technologies

Inkjet-Deposited Interconnections for Electronic Packaging

Two Chips Vertical Direction Embedded Miniaturized Package

Trench Structure Improvement of Thermo-Optic Waveguides

Laser printing and curing/sintering of silver paste lines for solar cell metallization

3D Stacking of Chips with Electrical and Microfluidic I/O Interconnects

Digital printing with micro plasmas and its effects on surface wettability

TANAKA Confirms Improvement in Bending Durability of Flexible Touch Panels With Single-Sided, Dual-Layer Wiring Structure Metal Mesh Film

Processing Thick-Film Screen Printed Metalon CuO Reduction Ink with PulseForge Tools

Inkjet Printing of Silver for Direct Write Applications

Beam Leads. Spider bonding, a precursor of TAB with all-metal tape

Supplementary Information for

A DEVELOPMENT METHODOLOGY FOR COPPER END TERMINATION PASTE PART 1: ORIGIN OF GREEN DEFECTS*

Activities in Plasma Process Technology at SENTECH Instruments GmbH, Berlin. Dr. Frank Schmidt

25-26 October Suntec Singapore Convention & Exhibition Centre Concourse [Level 3]

Nanotechnology Principles, Applications, Careers, and Education. Copyright 2011 The Pennsylvania State University

Introduction to Polymer-Dispersed Liquid Crystals

A New Continuous Wave 2500W Semiconductor Laser Vertical Stack

Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry

Surface Micromachining of Uncooled Infrared Imaging Array Using Anisotropic Conductive Film

Flexible Substrates for Smart Sensor Applications

ALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE

XTSC SiCap 400µm - NiAu finishing - Assembly by soldering

FY06 ACCOMPLISHMENTS. Nanoelectronics Manufacture, Inspection, and Repair using Thermal Dip Pen Nanolithography

Novel Ag and AgPd Nanoparticles for MLCC s with Ultrathin Electrodes

Nanoimprinting in Polymers and Applications in Cell Studies. Albert F. YEE Chemical Engineering & Materials Science UC Irvine

NanoFabrication Systems DPN. Nanofabrication Systems. A complete line of instruments and tools for micro and nanopatterning applications

Supplementary Material (ESI) for Chemical Communications This journal is (c) The Royal Society of Chemistry 2009

Introduction of CSC Pastes

DNA Microarray Technology

Reference Only. DC Resistance Impedance at 100MHz (mω) Rated Current *1 MURATA (A) Part Number. (Ω) Tolerance Typ. Max.

2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free)

Smart Packaging Solutions for Secure Applications

Silver nanoparticle structures realized by digital surface micromachining

From Vacuum to Atmosphere and back an in-house Process Chain for Different Products

Supporting Information. Low Temperature Oxidation-free Selective Laser Sintering of Cu

Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable Origami Substrates

Application of Inkjet Printing. By Michael Carr, Yuan Gu, and Prof. John Federici New Jersey Institute of Technology, Newark, NJ

Transcription:

3D inkjet printing of conductive structures using in-situ IR sintering E. Saleh*, J. Vaithilingam, C. Tuck, R. Wildman, I. Ashcroft, R. Hague, P. Dickens University of Nottingham, Additive Manufacturing and 3D Printing Research Group, University of Nottingham, Nottingham, UK, NG7 2RD REVIEWED Abstract In this study we investigate the inkjet printing of a silver nanoparticle ink and the optimization of IR sintering conditions to form 3D inkjet-printed conductive structures. The understanding of the interaction between the silver layers and the sintering conditions are key elements to successfully build conductive tracks in 3D. The drop size of conductive ink on glass substrates as well as on sintered conductive film was measured to optimize the printing resolution. The resistivity of the sintered deposition was studied in a planar X-Y direction as well as in a vertical Z direction to analyze the effects of stacking hundreds of silver layers in different deposition orientations. Using the results of the optimized printing and sintering conditions, conductive tracks were demonstrated forming simple 3D inkjet-printed structures powering electronic components. Introduction 3D printing of electronic components and circuitries are key target areas of additive manufacturing (AM) technologies. Taking electronics outside the traditional two-sided or limited layers printed circuit boards (PCB) into the 3rd dimension will enable various new electronic applications. Similar to 3D integrated circuits (3DIC), compact and flexible electronics are amongst those applications that 3D technologies could enable, where conductive tracks can move in a volumetric manner rather than a 2D surface allowing more freedom of track routing [1-3]. Antenna design is another area that has benefited from 3D technologies where conductive tracks printed on 3D surfaces showed better performance and higher efficiency antenna than conventional fabrication methods[4, 5]. Most common form of conductive inkjet inks are precursors of silver nanoparticles dispersed in solvents [6, 7]. A challenge to 3D-print conductive inks is the sintering process which is usually a heating process to evaporate the solvent of the conductive ink and sinter the nanoparticles to form a percolated path[6]. In this study we report using infrared (IR) heating to sinter multilayer tracks of inkjet-printed silver ink. IR sintering has been reported in roll-to-roll processes where the inkjet-printed patterns are sintered using high power IR lamps to form 2D conductive circuits [8-11]. Experimental In order to understand the printing conditions the silver ink was jetted at different substrates to optimize the droplet size and the printing resolution. Upon inkjet printing, the IR lamp was configured to sinter the deposition when each layer of deposition is complete. Tracks containing layers from 1 to 20 were printed and IR sintered using these conditions. The resistance of the 1554

tracks was measured as the number of layers increase. Finally 300 layers of an array of single pixels were printed to study the effect of printing large number of layers on the overall resistance in the z direction and compare it to the x-y planer patterns. Materials: A commercial silver nanoparticle conductive ink from Advanced Nano Product (ANP) product number: DGP 40LT-15C - was used in this study. The ink contains 38.5 wt% of <50 nm silver nanoparticles dispersed in triethylene glycol monomethyl ether (TGME). Glass slides used as substrates were soda lime glass slides from Cole-Parmer Instrument Co. Ltd. Apparatus: The ANP silver ink was inkjet-printed from a Spectra SE128 print-head installed in a bespoke printer from PixDro (commercial name Toucan). An IR lamp from Heraeus (Heraeus 4114) was installed 800 mm away from the print-head in the direction of printing, which occurs by moving the substrate under the IR lamp for a number of passes as shown in figure 1. Figure 1, Toucan inkjet printer with IR sintering unit. The jetting conditions of the ANP ink were 90 V jetting pulses each is 12 µs (2 µs ramp, 8 µs dwell time and 2 µs falling time). The ink was jetted at 30 ºC to tune the viscosity, and the ink pressure on the print-head was maintained at -20 mbar. The height of the print-head from the substrate was 1 mm and the height of the IR lamp was kept at 7 mm away from the substrate which corresponds to a temperature of 290 ºC measured at the surface of a glass substrate. 1555

Results Drop size and printing resolution: The size of the droplet size at the substrate is determined by many factors, one is the substrate material. In 3D inkjet printing, using a glass substrate as an example, the droplet size on the glass substrate would change in the second layer after the first layer of the ink was formed if the materials have different surface energies. To evaluate the printing resolution the droplet size of the ANP ink was measured on soda lime glass slide and also on sintered silver ink. Figure 2 shows a comparison of the droplet size on the two materials. Figure 2, Droplet size of the ANP conductive ink on a) soda lime glass substrate. b) Sintered silver substrate. The average droplet size of the ANP on glass was 118 µm whereas on silver it was 145 µm. Assuming droplets overlap of 70% the resolutions on glass and silver substrates are 308 dpi and 250 dpi, respectively. Electrical characterization: To measure the electrical resistivity of the sintered ink tracks of 7 by 0.5 mm were printed and sintered using the printing conditions described in the experimental section. Square pads were also printed at the end of the tracks to act as measurement points as shown in figure 3. Figure 3, Multi-layer tracks of IR sintered silver ink printed on glass substrate (5mm scale bar). The resistance of each track was measured using Hameg LCR high precision meter to evaluate the development of the resistance as the number of layers increase. Figure 4 shows the average resistance of the tracks taken from multiple samples; each track was sintered by applying 10 passes of IR over the deposition which corresponds to 60 seconds of IR exposure. 1556

Figure 4, The resistance of the tracks as it changes with the number of layers. A number of observations can be made on figure 4. The change in resistance with the increase of layers is nonlinear although in theory the increase is geometry dependent so assuming the volume of each layer is the same the resistance trend should have been linear. This nonlinear trend can be due to different deposition volumes per layer as the layers increase; however the most likely reason of this nonlinearity can be due to the presence of organic residue between the layers. The organic materials between the layers usually come from any additives in the ink other than the solvent (surfactants and viscosity modifiers) which don t evaporate during the sintering process. To measure the resistance of the sintered ink vertically 300 layers of single pixels array were printed and sintered on brass substrate using the same printing and sintering conditions as the planer tracks. The resistance of the tracks was measured between the brass substrate and the tip of the silver as shown in figure 5. 1557

Figure 5, The configuration of measuring the resistance of 300 sintered silver layers vertically. The measured resistance of the 300 layers was 21±4 mω. The diameter of each pixel was around 150 µm and the height was around 200 µm. Comparing that to the estimated resistivity for less number of layers (1-20 layers), the overall resistivity increases when the number of layers increase. This confirms the influence of the interlayering organic materials acting as small resistors between the layers. The conclusion of the presence of organic interlayers needs further study to include an accurate surface profile of the tracks to measure the resistivity quantitatively and compare it to higher aspect ratio silver pillars in order to draw a further rigorous conclusion and a mathematical model of the resistivity as it changes with the number of layers. Conclusion Printing and sintering multilayer conductive ink was achieved using an inkjet print-head with IR post-processing. The droplet size on glass substrate and silver film was measured to evaluate the influence of the substrate and determine the optimal printing resolution. Multiple layers of silver tracks were printed and sintered for each layer at the same conditions. The resistance of tracks was measured and showed a nonlinear behavior. A hypothesis of this nonlinearity as the number of layers increase was introduced. Organic interlayers from various additives in the ink add a fine resistance between the silver layers increasing the overall resistivity of the structure. This conclusion needs further investigation to quantitatively measure the resistivity of the sintered tracks in addition to the vertical resistance that was introduced in this study. Acknowledgments The authors gratefully acknowledge funding support from EPSRC (Engineering and Physical Sciences Research Council) under the Jetting Electronic Tracks JET project, and the EPSRC Centre for Innovative Manufacturing in Additive Manufacturing (EP/I033335/2) at the University of Nottingham. References 1558

1. Davis, W.R., et al., Demystifying 3D ICs: the pros and cons of going vertical. Design & Test of Computers, IEEE, 2005. 22(6): p. 498-510. 2. Xiangyu, D. and X. Yuan. System-level cost analysis and design exploration for threedimensional integrated circuits (3D ICs). in Design Automation Conference, 2009. ASP- DAC 2009. Asia and South Pacific. 2009. 3. Lea, R.M., et al., A 3-D stacked chip packaging solution for miniaturized massively parallel processing. Advanced Packaging, IEEE Transactions on, 1999. 22(3): p. 424-432. 4. Ahn, B.Y., et al., Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes. Science, 2009. 323(5921): p. 1590-1593. 5. Adams, J.J., et al., Conformal Printing of Electrically Small Antennas on Three- Dimensional Surfaces. Advanced Materials, 2011. 23(11): p. 1335-1340. 6. Perelaer, B.J., et al., Inkjet-printed silver tracks: low temperature curing and thermal stability investigation. Journal of Materials Chemistry, 2008. 18(27): p. 3209-3215. 7. Dang, M.C., T.M.D. Dang, and E. Fribourg-Blanc, Silver nanoparticles ink synthesis for conductive patterns fabrication using inkjet printing technology. Advances in Natural Sciences: Nanoscience and Nanotechnology, 2015. 6(1): p. 015003. 8. Denneulin, A., et al., Infra-red assisted sintering of inkjet printed silver tracks on paper substrates. Journal of Nanoparticle Research, 2011. 13(9): p. 3815-3823. 9. Cherrington, M., et al., Ultrafast near-infrared sintering of a slot-die coated nano-silver conducting ink. Journal of Materials Chemistry, 2011. 21(21): p. 7562-7564. 10. Wunscher, S., et al., Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices. Journal of Materials Chemistry C, 2014. 2(48): p. 10232-10261. 11. Määttänen, A., et al., Inkjet-Printed Gold Electrodes on Paper: Characterization and Functionalization. ACS Applied Materials & Interfaces, 2012. 4(2): p. 955-964. 1559