SEMI AUX OVERVIEW GUIDE TO SEMI STANDARD FOR 450 MM WAFERS

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SEMI AUX023-0915 OVERVIEW GUIDE TO SEMI STANDARD FOR 450 MM WAFERS The information in this Document has been furnished by the 450 mm International Physical Interfaces & Carriers Task Force, operating under the auspices of the SEMI Standards Physical Interfaces & Carriers Committee, for informational use only and is subject to change without notice. The Semiconductor Equipment and Materials International (SEMI ) Standards Program is publishing this information as furnished by the group in the form of Auxiliary Information so that it may be referenced by the industry, as desired. No material in this Document is to be construed as an official or adopted standard. SEMI assumes no liability for the content of this Document, which is the sole responsibility of the authors, nor for any errors or inaccuracies that may appear in this document. SEMI grants permission to reproduce and distribute this Document provided that (1) the Document is maintained in its original form, and (2) this disclaimer and the notice below accompany the Document at all times. NOTICE: By publication of this Document, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned herein. Users of this Document are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights, are entirely their own responsibility Copyright 2015 by SEMI (Semiconductor Equipment and Materials International, 3081 Zanker Road, San Jose, CA 95134). See above for information on limited rights for reproduction and distribution; all other rights reserved. 1 SEMI AUX023-0915 SEMI 2015

450mm SEMI Standards Overview

1) Purpose A purpose of this document is to promote an integrated understanding of the 450mm SEMI Standards. The 450mm standards extend over subjects covered by the following committees: Silicon Wafer Committee Physical Interfaces & Carriers Committee Information & Control Committee Japan Packaging Committee 2

2) The List of Published 450mm SEMI Standards Standard Number SEMI M1 SEMI M49 SEMI M52 SEMI M62 SEMI M73 SEMI M74 SEMI M76 SEMI M80 SEMI E83 SEMI E154 SEMI E156 SEMI E158 SEMI E159 SEMI E162 SEMI E166 SEMI G88 SEMI G92 SEMI G95 Title Specification for Polished Single Crystal Silicon Wafers Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations Specifications for Silicon Epitaxial Wafers Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles Specification for 450mm Diameter Mechanical Handling Polished Wafer Specification for Developmental 450mm Diameter Polished Single Crystal Wafer Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers Specification for PGV Mechanical Docking Flange Mechanical Interface for 450mm Load Port Mechanical Specification for 450mm AMHS Stocker to Transport Interface Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 MAC) and Kinematic Coupling Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard Specification for Tape Frame for 450 mm Wafer Specification for Tape Frame Cassette for 450 mm Wafer Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process 3

3) Overview of 450mm SEMI Standards E156 (Stocker Interface) Carriers: E158 (450FOUP), E159 (450 MAC), M80 (450 FOSB) M1,M49,M52,M62,M73, M74, M76 (Wafer) E144 (RF Air Interface) E84 (Carrier Hand off Parallel I/O) wafer carrier E166 (Cluster-Tool Module Interface) Status Published No change Same as 300mm tape frame carrier E154 (FOUP & MAC Load Port) or E162 (FOSB Load Port) E84 (Carrier Hand off Parallel I/O) G88 (Tape Frame) G92 (Tape Frame Cassette ) G95 (Load port for Tape Frame Cassettes) E83 (PGV Docking Flange) Exx (SECS/GEM, Software Communication Standards) 4

4) 450mm/300mm Comparison Table Item 300mm 450mm Standard Name N/A M74 Mechanical Handling Polished Wafer M1 M1 (Rev) Polished Single Crystal Si Wafer M28 M76 Developmental Polished Single Crystal Si Wafer Wafer M49 Geometry Measurement Systems for Silicon Wafers M52 Scanning Surface Inspection Systems for Silicon Wafers M62 Silicon Epitaxial Wafers M73 Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles E15.1 Load Port E62 FIMS E63 E154 BOLTS-M Load Port E64 Cart Docking Interface E110 Indicator / Switch Placement E83 E83 (Rev) PGV Docking Flange N/A E162 FOSB Load port G82 G95 Load Port for Tape Frame Cassettes E1.9 Cassette FOUP E47.1 E158 Front Opening Unified Pod Carrier E57 Kinematic Coupling MAC N/A E159 Multi Application Carrier FOSB M31 M80 Front Opening Shipping Box Tape Frame G77 G92 Tape Frame Cassette Stocker Interface E85 E156 Stocker Interface Cluster Tool E21.1 Cluster-Tool Module Interface E166 E22.1 Cluster-Tool End Effector #1) E84 Carrier Hand off Parallel I/O Communication E99 Carrier Reader/Writer Functional E144 RF Air Interface Packaging G74 Tape Frame G88 G87 Plastic Tape Frame NOTE #1: A set of Wafer Transport Plane Exclusion Zone Dimensions example is given as Related Information in E166. 5

5) 300mm PIC Related Standards (Reference) E110 (Operator Interface) Carriers: E47.1(FOUP), E1.9(Cassette), M31(FOSB), E103(SWIF), E119(FOBIT) M1, M28 (Wafer) E144 (RF Air Interface) E57 (Kinematic Coupling) E62 (FIMS) E15.1 (Load Port) E84 (Carrier Hand off Parallel I/O) E22.1 (Cluster-Tool End Effector) E72 (Equipment Footprint, Height, and Weight) E21.1 (Cluster-Tool Module Interface) 6 E64 (Cart Docking Interface) and E83 (PGV Docking Flange) E63 (BOLTS-M) and/or E92 (BOLTS-Light) or E131 (IMM) E85 (Stocker Interface) E26.1 (Cluster-Tool Footprint ) and/or E25 (Cluster-Tool Access) 6